Search results for: printed electronics
Commenced in January 2007
Frequency: Monthly
Edition: International
Paper Count: 233

Search results for: printed electronics

203 An Electrically Small Silver Ink Printed FR4 Antenna for RF Transceiver Chip CC1101

Authors: F. Majeed, D. V. Thiel, M. Shahpari

Abstract:

An electrically small meander line antenna is designed for impedance matching with RF transceiver chip CC1101. The design provides the flexibility of tuning the reactance of the antenna over a wide range of values: highly capacitive to highly inductive. The antenna was printed with silver ink on FR4 substrate using the screen printing design process. The antenna impedance was perfectly matched to CC1101 at 433 MHz. The measured radiation efficiency of the antenna was 81.3% at resonance. The 3 dB and 10 dB fractional bandwidth of the antenna was 14.5% and 4.78%, respectively. The read range of the antenna was compared with a copper wire monopole antenna over a distance of five meters. The antenna, with a perfect impedance match with RF transceiver chip CC1101, shows improvement in the read range compared to a monopole antenna over the specified distance.

Keywords: Meander line antenna, RFID, Silver ink printing, Impedance matching.

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202 Controllable Electrical Power Plug Adapters Made As A ZigBee Wireless Sensor Network

Authors: Toshihiko Sasama, Takao Kawamura, Kazunori Sugahara

Abstract:

Using Internet communication, new home electronics have functions of monitoring and control from remote. However in many case these electronics work as standalone, and old electronics are not followed. Then, we developed the total remote system include not only new electronics but olds. This systems node is a adapter of electrical power plug that embed relay switch and some sensors, and these nodes communicate with each other. the system server was build on the Internet, and users access to this system from web browsers. To reduce the cost to set up of this system, communication between adapters are used ZigBee wireless network instead of wired LAN cable[3]. From measured RSSI(received signal strength indicator) information between each nodes, the system can estimate roughly adapters were mounted on which room, and where in the room. So also it reduces the cost of mapping nodes. Using this system, energy saving and house monitoring are expected.

Keywords: outlet, remote monitor, remote control, mobile ad hocnetwork, sensor network, zigbee.

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201 Semi-Transparent Dye-Sensitized Solar Panels for Energy Autonomous Greenhouses

Authors: A. Mourtzikou, D. Sygkridou, T. Georgakopoulos, G. Katsagounos, E. Stathatos

Abstract:

Over 60% highly transparent quasi-solid-state dye-sensitized solar cells (DSSCs) with dimension of 50x50 cm2 were fabricated via inkjet printing process using nanocomposite inks as raw materials and tested under outdoor illumination conditions. The cells were electrically characterized, and their possible application to the shell of greenhouses was also examined. The panel design was in Z-interconnection, where the working electrode was inkjet printed on one conductive glass and the counter electrode on a second glass in a sandwich configuration. Silver current collective fingers were printed on the glasses to make the internal electrical connections. In that case, the adjacent cells were connected in series via silver fingers and finally insulated using a UV curing resin to protect them from the corrosive (I-/I3-) redox couple of the electrolyte.

Keywords: Dye-sensitized solar panels, inkjet printing, quasi-solid-state electrolyte, semi-transparency, scale up.

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200 Review, Analysis and Simulation of Advanced Technology Solutions of Selected Components in Power Electronics Systems (PES) of More Electric Aircraft

Authors: Lucjan Setlak, Emil Ruda

Abstract:

The subject of this paper is to review, comparative analysis and simulation of selected components of power electronic systems (PES), consistent with the concept of a more electric aircraft (MEA). Comparative analysis and simulation in software environment MATLAB / Simulink were carried out on the base of a group of representatives of civil aircraft (B-787, A-380) and military (F-22 Raptor, F-35) in the context of multi-pulse converters used in them (6- and 12-pulse, and 18- and 24-pulse), which are key components of high-tech electronics on-board power systems of autonomous power systems (ASE) of modern aircraft (airplanes of the future).

Keywords: Converters, electrical machinery, more electric aircraft, MEA, power electronics systems, PES.

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199 Coreless Printed Circuit Board (PCB) Stepdown Transformers for DC-DC Converter Applications

Authors: Radhika Ambatipudi, Hari Babu Kotte, Dr. Kent Bertilsson

Abstract:

In this paper, multilayered coreless printed circuit board (PCB) step-down power transformers for DC-DC converter applications have been designed, manufactured and evaluated. A set of two different circular spiral step-down transformers were fabricated in the four layered PCB. These transformers have been modelled with the assistance of high frequency equivalent circuit and characterized with both sinusoidal and square wave excitation. This paper provides the comparative results of these two different transformers in terms of their resistances, self, leakage, mutual inductances, coupling coefficient and also their energy efficiencies. The operating regions for optimal performance of these transformers for power transfer applications are determined. These transformers were tested for the output power levels of about 30 Watts within the input voltage range of 12-50 Vrms. The energy efficiency for these step down transformers is observed to be in the range of 90%-97% in MHz frequency region.

Keywords: Coreless Step down Transformer, DC-DC Converterapplications, High frequency transformer, MHz operating frequency, Multilayered PCB transformers, Power Transfer Applications.

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198 The Use of Appeals in Green Printed Advertisements: A Case of Product Orientation and Organizational Image Orientation Ads

Authors: Chutima Ruanguttamanun

Abstract:

Despite the relatively large number of studies that have examined the use of appeals in advertisements, research on the use of appeals in green advertisements is still underdeveloped and needs to be investigated further, as it is definitely a tool for marketers to create illustrious ads. In this study, content analysis was employed to examine the nature of green advertising appeals and to match the appeals with the green advertisements. Two different types of green print advertisings, product orientation and organizational image orientation were used. Thirty highly educated participants with different backgrounds were asked individually to ascertain three appeals out of thirty-four given appeals found among forty real green advertisements. To analyze participant responses and to group them based on common appeals, two-step K-mean clustering is used. The clustering solution indicates that eye-catching graphics and imaginative appeals are highly notable in both types of green ads. Depressed, meaningful and sad appeals are found to be highly used in organizational image orientation ads, whereas, corporate image, informative and natural appeals are found to be essential for product orientation ads.

Keywords: Advertising appeals, green marketing, green advertisement, printed advertisement.

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197 Square Printed Monopole Antenna for Wireless Applications

Authors: Rekha P. Labade, Shankar B. Deosarkar, Narayan Pisharoty

Abstract:

In this article design and optimization of square printed monopole antenna for wireless application is proposed. Theory of characteristics mode (TCM) is used for analysis of current modes on the antenna. TCM analysis shows that beveled ground plane improves the impedance bandwidth. The antenna operates over the frequency range from 1.860 GHz to 5 GHz for a VSWR ≤ 2, covering the GSM (1900-1990MHz), IMT-2000(1920-2170MHz), Bluetooth (2.400-2484 MHz) and lower band of ultrawideband (UWB). Stable radiation pattern shows minimal pulse distortion. The radiation pattern is omni-directional along the H-plane and figure of eight along the E-plane. Size of proposed antenna is 39 mm x 29 mm x 1.6mm. Antenna is simulated using CAD FEKO suite (6.2) using method of moment. A prototype antenna is fabricated using FR4 dielectric substrate with a dielectric constant of 4.4 and loss tangent of 0.02 to validate the simulated and measured results of the proposed antenna. Measured results are in good agreement with simulated results.

Keywords: Destructive Ground Surface (DGS), Method of moment, Theory of characteristics mode, UWB, VSWR.

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196 A Simple Electronic Curvy Length Measurement System: Application to Geography

Authors: Arijit Roy, Sharmistha Roy, Dibyendu Chatterjee

Abstract:

This article describes an interesting and inexpensive laboratory experiment for undergraduate students of electronics, geography and related disciplines. The objective of the proposed experiment is to improve the students’ exposure on the basic principles of instrumentation and to demonstrate an electronic measurement system. A simple electronic curvy length measurement system is presented here. Such a system can be used to measure curvy lengths e.g. length of a river, road or railway line etc. from topographical map. The proposed system is composed of simple functional blocks which are usually demonstrated in laboratory or in theory course of electronics at the undergraduate level. The experiment is assigned to a group of students and it is found that the experiment can fulfill its objectives with high degree of satisfaction.

Keywords: Curvy length measurement, Education, Electronics, Laboratory experiment, Topographical map.

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195 Adapting the Chemical Reaction Optimization Algorithm to the Printed Circuit Board Drilling Problem

Authors: Taisir Eldos, Aws Kanan, Waleed Nazih, Ahmad Khatatbih

Abstract:

Chemical Reaction Optimization (CRO) is an optimization metaheuristic inspired by the nature of chemical reactions as a natural process of transforming the substances from unstable to stable states. Starting with some unstable molecules with excessive energy, a sequence of interactions takes the set to a state of minimum energy. Researchers reported successful application of the algorithm in solving some engineering problems, like the quadratic assignment problem, with superior performance when compared with other optimization algorithms. We adapted this optimization algorithm to the Printed Circuit Board Drilling Problem (PCBDP) towards reducing the drilling time and hence improving the PCB manufacturing throughput. Although the PCBDP can be viewed as instance of the popular Traveling Salesman Problem (TSP), it has some characteristics that would require special attention to the transactions that explore the solution landscape. Experimental test results using the standard CROToolBox are not promising for practically sized problems, while it could find optimal solutions for artificial problems and small benchmarks as a proof of concept.

Keywords: Evolutionary Algorithms, Chemical Reaction Optimization, Traveling Salesman, Board Drilling.

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194 E-Learning Platform with SPICE Web Service

Authors: A. Braeken, L. Sterckx, A. Touhafi, Y. Verbelen

Abstract:

When studying electronics, hands-on experience is considered to be very valuable for a better understanding of the concepts of electricity and electronics. Students lacking sufficient time in the lab are often put at disadvantage. A way to overcome this, is by using interactive multimedia in a virtual environment. Instead of proposing another new ad-hoc simulator for e-learning, we propose in this paper an e-learning platform integrating the SPICE simulator as a web service. This enables to make use of all the functions of the de-facto standard simulator SPICE inelectronics when developing new simulations.

Keywords: E-learning, SPICE, virtual experiments, web service.

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193 Mannequin Evaluation of 3D-Printed Intermittent Oro-Esophageal Tube Guide for Dysphagia

Authors: Yujin Jeong, Youkyung Son, Myounghwan Choi, Sanghyub Lee, Sangyeol Lee, Changho Hwang, Kyo-in Koo

Abstract:

Dysphasia is difficulty in swallowing food because of oral cavity impairments induced by stroke, muscle damage, tumor. Intermittent oro-esophageal (IOE) tube feeding is one of the well-known feeding methods for the dysphasia patients. However, it is hard to insert at the proper position in esophagus. In this study, we design and fabricate the IOE tube guide using 3-dimensional (3D) printer. The printed IOE tube is tested in a mannequin (Airway Management Trainer, Co., Ltd., Copenhagen, Denmark) mimicking human’s esophagus. The gag reflex point is measured as the design point in the mannequin. To avoid the gag reflex, we design various shapes of IOE tube guide. One structure is separated into three parts; biting part, part through oral cavity, connecting part to oro-esophageal. We designed 6 types of IOE tube guide adjusting length and angle of these three parts. To evaluate the IOE tube guide, it is inserted in the mannequin, and through the inserted guide, an endoscopic camera successfully arrived at the oro-esophageal. We had planned to apply this mannequin-based design experience to patients in near future.

Keywords: Dysphagia, feeding method, IOE tube guide, 3-D printer.

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192 A Low Cost and High Quality Duty-Cycle Modulation Scheme and Applications

Authors: B. Lonla Moffo, J. Mbihi, L. Nneme Nneme

Abstract:

In this paper, a low cost duty-cycle modulation scheme is studied in depth and compared to the standard pulse width modulation technique. Using a mix of analytical reasoning and electronics simulation tools, it is shown that under the same operating conditions, most characteristics of the proposed duty-cycle modulation scheme are better than those provided by a standard pulse width modulation technique. The simulation results obtained when testing both modulation control policies on prototyping systems, indicate that the proposed duty-cycle modulation approach, appears to be a high quality control policy in a wide variety of application areas, including A/D and D/A conversion, signal transmission and switching control in power electronics.

Keywords: Duty-cycle Modulation, Operational amplifiers, Pulse width modulation, Power electronics, Signal processing.

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191 The Analysis of Printing Quality of Offset - Printing Ink with Coconut Oil Base

Authors: Wat Ploysri

Abstract:

The objectives of this research are to produce prototype coconut oil based solvent offset printing inks and to analyze a basic quality of printing work derived from coconut oil based solvent offset printing inks, by mean of bringing coconut oil for producing varnish and bringing such varnish to produce black offset printing inks. Then, analysis of qualities i.e. CIELAB value, density value, and dot gain value of printing work from coconut oil based solvent offset printing inks which printed on gloss-coated woodfree paper weighs 130 grams were done. The research result of coconut oil based solvent offset printing inks indicated that the suitable varnish formulation is using 51% of coconut oil, 36% of phenolic resin, and 14% of solvent oil 14%, while the result of producing black offset ink displayed that the suitable formula of printing ink is using varnish mixed with 20% of coconut oil, and the analyzing printing work of coconut oil based solvent offset printing inks which printed on paper, the results were as follows: CIELAB value of black offset printing ink is at L* = 31.90, a* = 0.27, and b* = 1.86, density value is at 1.27 and dot gain value was high at mid tone area of image area.

Keywords: Offset Printing, Coconut Oil, Printing Ink, Printing Quality.

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190 Automatic Adjustment of Thresholds via Closed-Loop Feedback Mechanism for Solder Paste Inspection

Authors: Chia-Chen Wei, Pack Hsieh, Jeffrey Chen

Abstract:

Surface Mount Technology (SMT) is widely used in the area of the electronic assembly in which the electronic components are mounted to the surface of the printed circuit board (PCB). Most of the defects in the SMT process are mainly related to the quality of solder paste printing. These defects lead to considerable manufacturing costs in the electronics assembly industry. Therefore, the solder paste inspection (SPI) machine for controlling and monitoring the amount of solder paste printing has become an important part of the production process. So far, the setting of the SPI threshold is based on statistical analysis and experts’ experiences to determine the appropriate threshold settings. Because the production data are not normal distribution and there are various variations in the production processes, defects related to solder paste printing still occur. In order to solve this problem, this paper proposes an online machine learning algorithm, called the automatic threshold adjustment (ATA) algorithm, and closed-loop architecture in the SMT process to determine the best threshold settings. Simulation experiments prove that our proposed threshold settings improve the accuracy from 99.85% to 100%.

Keywords: Big data analytics, Industry 4.0, SPI threshold setting, surface mount technology.

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189 Mechanisms in Regulating Language Practices in Electronics Engineering: A Program Plan for Outcomes-Based Education

Authors: Analiza Acuña-Villacorte

Abstract:

The underlying principle behind the harmonization in international education does not solely aim for the comparability but also the compatibility of outputs produced. The international standard in the different professions particularly in engineering defines the required graduate attributes to attain suitable qualifications and recognitions. This study described the language practices of the Electronics Engineering students of Bulacan State University, Philippines who will be deployed for their internship program. The purpose of the study was achieved by determining the language proficiency of the students in terms of speaking, listening, reading, and writing, and checking the adherence of the University to the commitment of intensifying community building for the Association of Southeast Asian Nation Vision 2020. The analysis of variance of the variables defined the significance between the causal variables and dependent variables. Thus, this study identified the mechanism that would regulate language practices in the Electronics Engineering program.

Keywords: Communicative competence, descriptive design, language practices, mechanisms, outcomes-based education.

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188 Immunity of Integrated Drive System, Effects of Radiated and Conducted Emission

Authors: M. Ektesabi

Abstract:

In this paper the problems associated with immunity of embedded systems used in Motor-Drive systems are investigated and appropriate solutions are presented. Integration of VSD motor systems (Integral Motor) while partially reducing some of these effects, adds to immunity problem of their embedded systems. Fail safe operation of an Integral Motor in arduous industrial environments is considered. In this paper an integral motor with a unique design is proposed to overcome critical issues such as heat, vibration and electromagnetic interference which are damaging to sensitive electronics without requirement of any additional cooling system. Advantages of the proposed Integral motor are compactness of combo motor and drive system with no external cabling/wiring. This motor provides a perfect shielding for least amount of radiated emission. It has an inbuilt filter for EMC compliance and has been designed to provide lower EMC noise for immunity of the internal electronics as well as the other neighbouring systems.

Keywords: Electromagnetic Interference, Immunity, IntegralMotor, Radiated & Conducted Emission, Sensitive Electronics, Variable Speed Drive

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187 Tensile Properties of 3D Printed PLA under Unidirectional and Bidirectional Raster Angle: A Comparative Study

Authors: Shilpesh R. Rajpurohit, Harshit K. Dave

Abstract:

Fused deposition modeling (FDM) gains popularity in recent times, due to its capability to create prototype as well as functional end use product directly from CAD file. Parts fabricated using FDM process have mechanical properties comparable with those of injection-molded parts. However, performance of the FDM part is severally affected by the poor mechanical properties of the part due to nature of layered structure of printed part. Mechanical properties of the part can be improved by proper selection of process variables. In the present study, a comparative study between unidirectional and bidirectional raster angle has been carried out at a combination of different layer height and raster width. Unidirectional raster angle varied at five different levels, and bidirectional raster angle has been varied at three different levels. Fabrication of tensile specimen and tensile testing of specimen has been conducted according to ASTM D638 standard. From the results, it can be observed that higher tensile strength has been obtained at 0° raster angle followed by 45°/45° raster angle, while lower tensile strength has been obtained at 90° raster angle. Analysis of fractured surface revealed that failure takes place along with raster deposition direction for unidirectional and zigzag failure can be observed for bidirectional raster angle.

Keywords: Additive manufacturing, fused deposition modeling, raster angle, tensile strength.

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186 Dynamic Modelling and Virtual Simulation of Digital Duty-Cycle Modulation Control Drivers

Authors: J. Mbihi

Abstract:

This paper presents a dynamic architecture of digital duty-cycle modulation control drivers. Compared to most oversampling digital modulation schemes encountered in industrial electronics, its novelty is founded on a number of relevant merits including; embedded positive and negative feedback loops, internal modulation clock, structural simplicity, elementary building operators, no explicit need of samples of the nonlinear duty-cycle function when computing the switching modulated signal, and minimum number of design parameters. A prototyping digital control driver is synthesized and well tested within MATLAB/Simulink workspace. Then, the virtual simulation results and performance obtained under a sample of relevant instrumentation and control systems are presented, in order to show the feasibility, the reliability, and the versatility of target applications, of the proposed class of low cost and high quality digital control drivers in industrial electronics.

Keywords: Dynamic architecture, virtual simulation, duty-cycle modulation, digital control drivers, industrial electronics.

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185 Stability Analysis and Controller Design of Further Development of MIMOS II for Space Applications with Focus on the Extended Lyapunov Method: Part I

Authors: Mohammad Beyki, Justus Pawlak, Robert Patzke, Franz Renz

Abstract:

In the context of planetary exploration, the MIMOS II (miniaturized M¨ossbauer spectrometer) serves as a proven and reliable measuring instrument. The transmission behaviour of the electronics in the M¨ossbauer spectroscopy is further developed and optimized. For this purpose, the overall electronics is split into three parts. This elaboration deals exclusively with the first part of the signal chain for the evaluation of photons in experiments with gamma radiation. Parallel to the analysis of the electronics, an additional method for analysing the stability of linear and non-linear systems is presented: The extended method of Lyapunov’s stability criteria. The design helps to weigh advantages and disadvantages against other simulated circuits in order to optimize the MIMOS II for the terestric and extraterestric measurment. Finally, after stability analysis, the controller design according to Ackermann is performed, achieving the best possible optimization of the output variable through a skillful pole assignment.

Keywords: Controller design for MIMOS II, stability analysis, M¨ossbauer spectroscopy, electronic signal amplifier, light processing technology, photocurrent, transimpedance amplifier, extended Lyapunov method.

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184 Monitorization of Junction Temperature Using a Thermal-Test-Device

Authors: B. Arzhanov, A. Correia, P. Delgado, J. Meireles

Abstract:

Due to the higher power loss levels in electronic components, the thermal design of PCBs (Printed Circuit Boards) of an assembled device becomes one of the most important quality factors in electronics. Nonetheless, some of leading causes of the microelectronic component failures are due to higher temperatures, the leakages or thermal-mechanical stress, which is a concern, is the reliability of microelectronic packages. This article presents an experimental approach to measure the junction temperature of exposed pad packages. The implemented solution is in a prototype phase, using a temperature-sensitive parameter (TSP) to measure temperature directly on the die, validating the numeric results provided by the Mechanical APDL (Ansys Parametric Design Language) under same conditions. The physical device-under-test is composed by a Thermal Test Chip (TTC-1002) and assembly in a QFN cavity, soldered to a test-board according to JEDEC Standards. Monitoring the voltage drop across a forward-biased diode, is an indirectly method but accurate to obtain the junction temperature of QFN component with an applied power range between 0,3W to 1.5W. The temperature distributions on the PCB test-board and QFN cavity surface were monitored by an infra-red thermal camera (Goby-384) controlled and images processed by the Xeneth software. The article provides a set-up to monitorize in real-time the junction temperature of ICs, namely devices with the exposed pad package (i.e. QFN). Presenting the PCB layout parameters that the designer should use to improve thermal performance, and evaluate the impact of voids in solder interface in the device junction temperature.

Keywords: Quad Flat No-Lead packages, exposed pads, junction temperature, thermal management, measurements.

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183 Investigation of 5,10,15,20-Tetrakis(3-,5--Di-Tert-Butylphenyl)Porphyrinatocopper(II) for Electronics Applications

Authors: Zubair Ahmad, M. H. Sayyad, M. Yaseen, M. Ali

Abstract:

In this work, an organic compound 5,10,15,20- Tetrakis(3,5-di-tertbutylphenyl)porphyrinatocopper(II) (TDTBPPCu) is studied as an active material for thin film electronic devices. To investigate the electrical properties of TDTBPPCu, junction of TDTBPPCu with heavily doped n-Si and Al is fabricated. TDTBPPCu film was sandwiched between Al and n-Si electrodes. Various electrical parameters of TDTBPPCu are determined. The current-voltage characteristics of the junction are nonlinear, asymmetric and show rectification behavior, which gives the clue of formation of depletion region. This behavior indicates the potential of TDTBPPCu for electronics applications. The current-voltage and capacitance-voltage techniques are used to find the different electronic parameters.

Keywords: P-type, organic semiconductor, Electricalcharacteristics

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182 Packaging and Interconnection Technologies of Power Devices, Challenges and Future Trends

Authors: Raed A. Amro

Abstract:

Standard packaging and interconnection technologies of power devices have difficulties meeting the increasing thermal demands of new application fields of power electronics devices. Main restrictions are the decreasing reliability of bond-wires and solder layers with increasing junction temperature. In the last few years intensive efforts have been invested in developing new packaging and interconnection solutions which may open a path to future application of power devices. In this paper, the main failure mechanisms of power devices are described and principle of new packaging and interconnection concepts and their power cycling reliability are presented.

Keywords: Power electronics devices, Reliability, Power Cycling, Low-temperature joining technique (LTJT)

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181 Active Learning in Computer Exercises on Electronics

Authors: Zoja Raud, Valery Vodovozov

Abstract:

Modelling and simulation provide effective way to acquire engineering experience. An active approach to modelling and simulation proposed in the paper involves, beside the compulsory part directed by the traditional step-by-step instructions, the new optional part basing on the human’s habits to design thus stimulating the efforts towards success in active learning. Computer exercises as a part of engineering curriculum incorporate a set of effective activities. In addition to the knowledge acquired in theoretical training, the described educational arrangement helps to develop problem solutions, computation skills, and experimentation performance along with enhancement of practical experience and qualification.

Keywords: Modelling, simulation, engineering education, electronics, active learning.

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180 Vector Control of Multimotor Drive

Authors: Archana S. Nanoty, A. R. Chudasama

Abstract:

Three-phase induction machines are today a standard for industrial electrical drives. Cost, reliability, robustness and maintenance free operation are among the reasons these machines are replacing dc drive systems. The development of power electronics and signal processing systems has eliminated one of the greatest disadvantages of such ac systems, which is the issue of control. With modern techniques of field oriented vector control, the task of variable speed control of induction machines is no longer a disadvantage. The need to increase system performance, particularly when facing limits on the power ratings of power supplies and semiconductors, motivates the use of phase number other than three, In this paper a novel scheme of connecting two, three phase induction motors in parallel fed by two inverters; viz. VSI and CSI and their vector control is presented.

Keywords: Field oriented control, multiphase induction motor, power electronics converter.

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179 Electronic System Design for Respiratory Signal Processing

Authors: C. Matiz C., N. Olarte L., A. Rubiano F.

Abstract:

This paper presents the design related to the electronic system design of the respiratory signal, including phases for processing, followed by the transmission and reception of this signal and finally display. The processing of this signal is added to the ECG and temperature sign, put up last year. Under this scheme is proposed that in future also be conditioned blood pressure signal under the same final printed circuit and worked.

Keywords: Conditioning, Respiratory Signal, Storage, Teleconsultation.

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178 A Novel Low-Profile Coupled-Fed Printed Twelve-Band Mobile Phone Antenna with Slotted Ground Plane for LTE/GSM/UMTS/WIMAX/WLAN Operations

Authors: Omar A. Saraereh, M. A. Smadi, A. K. S. Al-Bayati, Jasim A. Ghaeb, Qais H. Alsafasfeh

Abstract:

A low profile planar antenna for twelve-band operation in the mobile phone is presented. The proposed antenna radiating elements occupy an area equals 17 × 50 mm2 are mounted on the compact no-ground portion of the system circuit board to achieve a simple low profile structure. In order to overcome the shortcoming of narrow bandwidth for conventional planar printed antenna, a novel bandwidth enhancement approach for multiband handset antennas is proposed here. The technique used in this study shows that by using a coupled-fed mechanism and a slotted ground structure, a multiband operation with wideband characteristic can be achieved. The influences of the modifications introduced into the ground plane improved significantly the bandwidths of the designed antenna. The slotted ground plane structure with the coupled-fed elements contributes their lowest, middle and higher-order resonant modes to form four operating modes. The generated modes are able to cover LTE 700/2300/2500, GSM 850/900/1800/1900, UMTS, WiMAX 3500, WLAN 2400/5200/5800 operations. Parametric studies via simulation are provided and discussed. Proposed antenna’s gain, efficiency and radiation pattern characteristics over the desired operating bands are obtained and discussed. The reasonable results observed can meet the requirements of practical mobile phones.

Keywords: Antenna, handset, LTE, Mobile, Multiband, Slotted ground, specific absorption rate (SAR).

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177 Design and Control Algorithms for Power Electronic Converters for EV Applications

Authors: Ilya Kavalchuk, Mehdi Seyedmahmoudian, Ben Horan, Aman Than Oo, Alex Stojcevski

Abstract:

The power electronic components within Electric Vehicles (EV) need to operate in several important modes. Some modes directly influence safety, while others influence vehicle performance. Given the variety of functions and operational modes required of the power electronics, it needs to meet efficiency requirements to minimize power losses. Another challenge in the control and construction of such systems is the ability to support bidirectional power flow. This paper considers the construction, operation, and feasibility of available converters for electric vehicles with feasible configurations of electrical buses and loads. This paper describes logic and control signals for the converters for different operations conditions based on the efficiency and energy usage bases.

Keywords: Electric Vehicles, Electrical Machines Control, Power Electronics, Powerflow Regulations.

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176 Thermal Management of Space Power Electronics using TLM-3D

Authors: R. Hocine, K. Belkacemi, A. Boukortt, A. Boudjemai

Abstract:

When designing satellites, one of the major issues aside for designing its primary subsystems is to devise its thermal. The thermal management of satellites requires solving different sets of issues with regards to modelling. If the satellite is well conditioned all other parts of the satellite will have higher temperature no matter what. The main issue of thermal modelling for satellite design is really making sure that all the other points of the satellite will be within the temperature limits they are designed. The insertion of power electronics in aerospace technologies is becoming widespread and the modern electronic systems used in space must be reliable and efficient with thermal management unaffected by outer space constraints. Many advanced thermal management techniques have been developed in recent years that have application in high power electronic systems. This paper presents a Three-Dimensional Modal Transmission Line Matrix (3D-TLM) implementation of transient heat flow in space power electronics. In such kind of components heat dissipation and good thermal management are essential. Simulation provides the cheapest tool to investigate all aspects of power handling. The 3DTLM has been successful in modeling heat diffusion problems and has proven to be efficient in terms of stability and complex geometry. The results show a three-dimensional visualisation of self-heating phenomena in the device affected by outer space constraints, and will presents possible approaches for increasing the heat dissipation capability of the power modules.

Keywords: Thermal management, conduction, heat dissipation, CTE, ceramic, heat spreader, nodes, 3D-TLM.

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175 Electronics Thermal Management Driven Design of an IP65-Rated Motor Inverter

Authors: Sachin Kamble, Raghothama Anekal, Shivakumar Bhavi

Abstract:

Thermal management of electronic components packaged inside an IP65 rated enclosure is of prime importance in industrial applications. Electrical enclosure protects the multiple board configurations such as inverter, power, controller board components, busbars, and various power dissipating components from harsh environments. Industrial environments often experience relatively warm ambient conditions, and the electronic components housed in the enclosure dissipate heat, due to which the enclosures and the components require thermal management as well as reduction of internal ambient temperatures. Design of Experiments based thermal simulation approach with MOSFET arrangement, Heat sink design, Enclosure Volume, Copper and Aluminum Spreader, Power density, and Printed Circuit Board (PCB) type were considered to optimize air temperature inside the IP65 enclosure to ensure conducive operating temperature for controller board and electronic components through the different modes of heat transfer viz. conduction, natural convection and radiation using Ansys ICEPAK. MOSFET’s with the parallel arrangement, IP65 enclosure molded heat sink with rectangular fins on both enclosures, specific enclosure volume to satisfy the power density, Copper spreader to conduct heat to the enclosure, optimized power density value and selecting Aluminum clad PCB which improves the heat transfer were the contributors towards achieving a conducive operating temperature inside the IP-65 rated Motor Inverter enclosure. A reduction of 52 ℃ was achieved in internal ambient temperature inside the IP65 enclosure between baseline and final design parameters, which met the operative temperature requirements of the electronic components inside the IP-65 rated Motor Inverter.

Keywords: Ansys ICEPAK, Aluminum Clad PCB, IP 65 enclosure, motor inverter, thermal simulation.

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174 3D-Printing Plates without “Support”

Authors: Yasusi Kanada

Abstract:

When printing a plate (or dish) by an FDM 3D printer, the process normally requires support material, which causes several problems. This paper proposes a method for forming thin plates without using wasteful support material. This method requires several extraordinary parameter values when slicing plates. The experiments show that the plates can, for the most part, be successfully formed using a conventional slicer and a 3D printer; however, seams between layers spoil them and the quality of printed objects strongly depends on the slicer.

Keywords: Fused deposition modeling (FDM), 3D printing, Support-less, Layer seam, Slicer.

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