Search results for: chip scale packaging (CSP)

Authors: Ching-Feng Chen, Ching-Chih Tsai

Abstract:

With the size of the transistor gradually approaching the physical limit, it challenges the persistence of Moore’s Law due to the development of the high numerical aperture (high-NA) lithography equipment and other issues such as short channel effects. In the context of the ever-increasing technical requirements of portable devices and high-performance computing, relying on the law continuation to enhance the chip density will no longer support the prospects of the electronics industry. Weighing the chip’s power consumption-performance-area-cost-cycle time to market (PPACC) is an updated benchmark to drive the evolution of the advanced wafer nanometer (nm). The advent of two and half- and three-dimensional (2.5 and 3D)- Very-Large-Scale Integration (VLSI) packaging based on Through Silicon Via (TSV) technology has updated the traditional die assembly methods and provided the solution. This overview investigates the up-to-date and cutting-edge packaging technologies for 2.5D and 3D integrated circuits (ICs) based on the updated transistor structure and technology nodes. The author concludes that multi-chip solutions for 2.5D and 3D IC packagings are feasible to prolong Moore’s Law.

Keywords: moore’s law, high numerical aperture, power consumption-performance-area-cost-cycle time to market, 2.5 and 3D- very-large-scale integration, packaging, through silicon via

Procedia PDF Downloads 114

Authors: R. C. Law, Shirley Kang, T. Y. Hin, M. Z. Abdullah

Abstract:

LED technology has been evolving aggressively in recent years from incandescent bulb during older days to as small as chip scale package. It will continue to stay bright in future. As such, there is tremendous pressure to stay competitive in the market by optimizing products to next level of performance and reliability with the shortest time to market. This changes the conventional way of product design and development to virtual prototyping by means of Computer Aided Engineering (CAE). It comprises of the deployment of Finite Element Method (FEM) and Computational Fluid Dynamic (CFD). FEM accelerates the investigation for early detection of failures such as crack, improve the thermal performance of system and enhance solder joint reliability. CFD helps to simulate the flow pattern of molding material as a function of different temperature, molding parameters settings to evaluate failures like voids and displacement. This paper will briefly discuss the procedures and applications of FEM in thermal stress, solder joint reliability and CFD of compression molding in LED CSP. Integration of virtual prototyping in product development had greatly reduced the time to market. Many successful achievements with minimized number of evaluation iterations required in the scope of material, process setting, and package architecture variant have been materialized with this approach.

Keywords: LED, chip scale packaging (CSP), computational fluid dynamic (CFD), virtual prototyping

Procedia PDF Downloads 287

Authors: Rohaya Abdul Wahab, Raja Mohd Fuad Tengku Aziz, Nazaliza Othman, Sharifah Saleh, Nabihah Razali, Rozaimah Baharim, Md Hanif Md Nasir

Abstract:

This paper will discuss flip chip methodology, in which I/O pads, standard cells, macros and bump cells array are placed in the floorplan, then routed using Astro place and route tool. Final DRC and LVS checking is done using Calibre verification tool. The design vehicle to run this methodology is an OpenRISC design targeted to Silterra 0.18 micrometer technology with 6 metal layers for routing. Astro has extensive support for flip chip placement and routing. Astro tool commands for flip chip are straightforward approach like the conventional standard wire bond packaging. However since we do not have flip chip commands in our Astro tool, no LEF file for bump cell and no LEF file for flip chip I/O pad, we create our own methodology to prepare for future flip chip tapeout. 

Keywords: methodology, flip chip, bump cell, LEF, astro, calibre, SCHEME, TCL

Procedia PDF Downloads 488

Authors: Muthana Saleh Alalaki, Michael Opoku Agyeman

Abstract:

The growth in the number of Intellectual Properties (IPs) or the number of cores on the same chip becomes a critical issue in System-on-Chip (SoC) due to the intra-communication problem between the chip elements. As a result, Network-on-Chip (NoC) has emerged as a system architecture to overcome intra-communication issues. This paper presents a study of recent contributions on simulation tools for NoC. Furthermore, an overview of NoC is covered as well as a comparison between some NoC simulators to help facilitate research in on-chip communication.

Keywords: WiNoC, simulation tool, network-on-chip, SoC

Procedia PDF Downloads 497

Authors: Reza Hadjiaghaie Vafaie, Aysan Madanpasandi, Behrooz Zare Desari, Seyedmohammad Mousavi

Abstract:

High lamination in microchannel is one of the main challenges in on-chip components like micro total analyzer systems and lab-on-a-chips. Electro-osmotic force is highly effective in chip-scale. This research proposes a microfluidic-based micropump for low ionic strength solutions. Narrow microchannels are designed to generate an efficient electroosmotic flow near the walls. Microelectrodes are embedded in the lateral sides and actuated by low electric potential to generate pumping effect inside the channel. Based on the simulation study, the fluid velocity increases by increasing the electric potential amplitude. We achieve a net flow velocity of 100 µm/s, by applying +/- 2 V to the electrode structures. Our proposed low voltage design is of interest in conventional lab-on-a-chip applications.

Keywords: integration, electrokinetic, on-chip, fluid pumping, microfluidic

Procedia PDF Downloads 294

Authors: Anusha Chanda, Reenu Singh

Abstract:

Packaging is one of the major contributors to global waste. While efforts are being made to switch to more sustainable types of packaging, such as switching from single use plastics to paper, not all polluting materials, have been rethought in terms of recycling. Minimalism in packaging design can help reduce the amount of waste produced greatly. While online companies have shifted to using cardboard boxes for packages, a large amount of waste in still generated from other materials affiliated with cardboard packaging, such as tape, bubble wrap, plastic wrap, among others. Minimalism also works by reducing extra packaging and increasing the reusability of the material. This paper looks at research related to minimalism in packaging design, minimalism, and sustainability. A survey was conducted in order to find out the different ways in which minimalism can be implemented in packaging design. Information gathered from the research and responses from the survey was used to ideate product design alternatives for sustainable substitutes for bubble wrap in packaging. This would help greatly reduce the amount of packaging waste and improve environmental quality.

Keywords: environment, minimalism, packaging, product design, sustainable

Procedia PDF Downloads 253

Authors: Boudjedra Abderrahim, Toumi Salah, Boutalbi Mostefa, Frihi Mohammed

Abstract:

Nowadays, using the advancement of technology in semiconductor device fabrication, many transistors can be integrated to a single chip (VLSI). Although the growth chip density potentially eases systems-on-chip (SoCs) integrating thousands of processing element (PE) such as memory, processor, interfaces cores, system complexity, high-performance interconnect and scalable on-chip communication architecture become most challenges for many digital and embedded system designers. Networks-on-chip (NoCs) becomes a new paradigm that makes possible integrating heterogeneous devices and allows many communication constraints and performances. In this paper, we are interested for good performance and low area for implementation and a behavioral modeling of network on chip mesh topology design using VHDL hardware description language with performance evaluation and FPGA implementation results.

Keywords: design, implementation, communication system, network on chip, VHDL

Procedia PDF Downloads 378

Authors: G. Götz, P. Stich, J. Backhaus, G. Reinhart

Abstract:

The rising demand for format-flexible packaging machines is caused by current market changes. Increasing the formatflexibility is a new goal for the packaging machine manufacturers’ product development process. There are no methodical or designorientated tools for a comprehensive consideration of this target. This paper defines the term format-flexibility in the context of packaging machines and shows the state-of-the-art for improving the changeover of production machines. The requirements for a new approach and the concept itself will be introduced, and the method elements will be explained. Finally, the use of the concept and the result of the development of a format-flexible packaging machine will be shown.

Keywords: packaging machine, format-flexibility, changeover, design method

Procedia PDF Downloads 434

Authors: Nirere Martine

Abstract:

Purpose –The purpose of this study aims to understand the intention of customers to adopt sustainable packaging and the impact of sustainable packaging on customers’ willingness to buy a product using sustainable packaging. Design/methodology/approach – A new research model based on the technology acceptance model (TAM) and structural equation modeling are used to examine causality and test relationship based on the data collected from 251 Rwanda samples. Findings – The findings indicated that perceived ease of use positively affects perceived usefulness. However, perceived usefulness and perceived ease of use positively affect the intention to adopt sustainable packaging. However, perceived risk and perceived cost negatively affect the intention to adopt sustainable packaging. The intention to adopt sustainable packaging positively affects the willingness to buy a product using sustainable packaging. Originality/value – Many researchers have investigated the issue of a consumers’ behavior to purchase a product. In particular, they have examined whether customers are willing to pay extra for a packaging product. There has been no study that has examined the impact of sustainable packaging on customers’ willingness to buy. The results of this study can help manufacturers form a better understanding of customers’ willingness to purchase a product using sustainable packaging.

Keywords: consumers’ behavioral, sustainable packaging, TAM, Rwanda

Procedia PDF Downloads 196

Authors: A. C. Khor, M. R. Mohamed, M. H. Sulaiman, M. R. Daud

Abstract:

Packaging for vanadium redox flow battery is one of the key elements for successful implementation of flow battery in the electrical energy storage system. Usually the bulky battery size and low energy densities make this technology not available for mobility application. Therefore RFB with improved packaging size and energy capacity are highly desirable. This paper focuses on the study of packaging improvement for unit cell V-RFB to the application on Series Hybrid Electric Vehicle. Two different designs of 25 cm2 and 100 cm2 unit cell V-RFB at same current density are used for the sample in this investigation. Further suggestions on packaging improvement are highlighted.

Keywords: electric vehicle, redox flow battery, packaging, vanadium

Procedia PDF Downloads 433

Authors: Long Kim Vu

Abstract:

The central processing unit in Electro-Optical devices is a Field-programmable gate array (FPGA) chip package allowing flexible, reconfigurable computing but energy consumption. Because chip package is placed in isolated devices based on IP67 waterproof standard, there is no air circulation and the heat dissipation is a challenge. In this paper, the author successfully modeled a chip package which various interposer materials such as silicon, glass and organics. Computational fluid dynamics (CFD) was utilized to analyze the thermal performance of chip package in the case of considering comprehensive heat transfer modes: conduction, convection and radiation, which proposes equivalent heat dissipation. The logic chip temperature varying with time is compared between the simulation and experiment results showing the excellent correlation, proving the reasonable chip modeling and simulation method.

Keywords: CFD, FPGA, heat transfer, thermal analysis

Procedia PDF Downloads 184

Authors: Chung-Yu Wu, Chia-Chi Chang, Wei-Ming Chen, Pu-Wei Wu, Shih-Fan Chen, Po-Chun Chen

Abstract:

Electrostimulation medical devices for neural diseases require electroactive and biocompatible materials to transmit signals from electrodes to targeting tissues. Protection of surrounding tissues has become a great challenge for long-term implants. In this study, we designed back-end processes with compatible, efficient, and reliable advantages over the current state-of-the-art. We explored a hermetic packaging process with high quality of adhesion and uniformity as the biocompatible devices for long-term implantation. This approach is able to provide both excellent biocompatibility and protection to the biomedical electronic devices by performing conformal coating of biocompatible materials. We successfully developed a packaging process that is capable of exposing the stimulating electrode and cover all other faces of chip with high quality of protection to prevent leakage of devices and body fluid.

Keywords: biocompatible package, medical microelectronics, surface coating, long-term implantation

Procedia PDF Downloads 524

Authors: Novriyanti Lubis, Riska Prasetiawati, Wulan Septiani

Abstract:

The quantitative analysis of vitamin C content from variations beverage packaging containing red guava (Psidium Guajava Linn) fruit juice had been done. In this study, four samples were obtained from the shopping center in Garut and Bandung City. Samples were tested quantitatively by 2,6-dichlorophenol indophenol titration method. The results showed different concentration of 4 samples consist of tetra pack packaging, tin, glass, and plastic bottles, such as; 17.99 mg/100 gr, 31.46 mg/100 gr, 13.00 mg/100 gr, and 12.01 mg/100 gr, respectively. These results indicated that the packaging variations affected the level of vitamin C content which was characterized by decreased levels of vitamin C. It means the levels of vitamin C from this research were not in accordance with nutritional value information on the packaging. Tetra pack packaging was the most stable compared to other packaging even though it had a shorter expired date than with other.

Keywords: vitamin C, variations beverage packaging, red guava, titration 2, 6- dichlorophenol indophenol

Procedia PDF Downloads 239

Authors: Hafiz A. Sakandar, M. Afzaal, U. Khan, M. N. Akhtar

Abstract:

Food is the primary concern of living organisms, provision of diet for maintenance of good physical and mental health is a basic right of an individual and the outcome of factors related to diet on health has been matter of apprehension since ancient times. Healthy and fresh food always demanded by the consumers. Modern research has find out many alternatives of traditional packaging. Now the consumer knows that good packaging system is that which protects the food from the contaminants and increases shelf life of food product. While in Pakistan about 40% of fruits and vegetables lost due to spoilage caused by poor handling, transportation, and poor packaging interaction with other environmental conditions. So it is crucial for developing countries like Pakistan to pay attention to these exacerbating situations for economy losses by considering food packaging an ultimate solution to the problem.

Keywords: packaging, food safety, antimicrobial, food losses

Procedia PDF Downloads 550

Authors: Bhuvnesh Narayanan, Bernhard Weiss, Tvrtko Mandic, Adrijan Baric

Abstract:

This paper discusses a method to reconstruct internal high-frequency signals through subsampling techniques in an IC using an on-chip sensor. Though there are existing methods to internally probe and reconstruct high frequency signals through subsampling techniques; these methods have been applicable mainly for synchronized systems. This paper demonstrates a method for making such non-intrusive on-chip reconstructions possible also in non-synchronized systems. The TLP pulse is used to demonstrate the experimental validation of the concept. The on-chip sensor measures the voltage in an internal node. The jitter in the input pulse causes a varying pulse delay with respect to the on-chip sampling command. By measuring this pulse delay and by correlating it with the measured on-chip voltage, time domain waveforms can be reconstructed, and the influence of the pulse on the internal nodes can be better understood.

Keywords: on-chip sensor, jitter, transmission line pulse, subsampling

Procedia PDF Downloads 145

Authors: Yuan Long, Fabrizio Ceschin, David Harrison

Abstract:

Environmental sustainability is under the threat of excessive single-use plastic packaging waste, and current waste management fails to address this issue. Therefore, it has led to a reidentification of the alternative, which can curb the packaging waste without reducing social needs. Reusable packaging represents a circular approach to close the loop of consumption in which packaging can stay longer in the system to satisfy social needs. However, the implementation of reusable packaging is fragmented and lacks systematic approaches. The product-service system (PSS) is widely regarded as a sustainable business model innovation for embracing circular consumption. As a result, applying PSS to reusable packaging solutions will be promising to address the packaging waste issue. This paper aims at filling the knowledge gap relating to apply PSS to reusable packaging solutions and provide a strategic design tool that could support packaging professionals to design reusable packaging solutions. The methodology of this paper is case studies and workshops to provide a design tool. The respondents are packaging professionals who are packaging consultants, NGO professionals, and entrepreneurs. 57 cases collected show that 15 archetypal models operate in the market. Subsequently, a polarity diagram is developed to embrace those 15 archetypal models, and a total number of 24 experts were invited for the workshop to evaluate the design tool. This research finally provides a strategic design tool to support packaging professionals to design reusable packaging solutions. The application of the tool is to support the understanding of the reusable packaging solutions, analyzing the markets, identifying new opportunities, and generate new business models. The implication of this research is to provide insights for academics and businesses in terms of tackling single-use packaging waste and build a foundation for further development of the reusable packaging solution tool.

Keywords: environmental sustainability, product-service system, reusable packaging, design tool

Procedia PDF Downloads 148

Authors: Raana Babadi Fathipour

Abstract:

Researchers are now focusing on sustainable advancements in active packaging systems to meet the growing consumer demand for high-quality food with Eco-friendly packaging. One significant advancement in this area is the inclusion of antimicrobial agents in bio-polymer-based edible films, which effectively inhibit or kill pathogenic/spoilage microbes that can contaminate food. This technology also helps reduce undesirable flavors caused by active compounds directly incorporated into the food. To further enhance the efficiency of antimicrobial bio-based packaging systems, Nano technological concepts such as bio-nano composites and Nano encapsulation systems have been applied. This review examines the current state and applications of antimicrobial biodegradable films in the food packaging industry, while also highlighting ongoing research on the use of nanotechnology to develop innovative bio-based packaging systems.

Keywords: active packaging, antimicrobial edible films, bioactive agents, biopolymers, bio-nanocomposites

Procedia PDF Downloads 73

Authors: J. Shiue, I. H. Chen, S. W. Y. Chiu, Y. L. Wang

Abstract:

In this work, we present a nondestructive method to characterize bacteria in a TEM system. Unlike the conventional TEM specimen preparation method, which needs to thin the specimen in a destructive way, or spread the samples on a tiny millimeter sized carbon grid, our method is easy to operate without the need of sample pretreatment. With a specially designed transparent chip that allows the electron beam to pass through, and a custom made chip holder to fit into a standard TEM sample holder, the bacteria specimen can be easily prepared on the chip without any pretreatment, and then be observed under TEM. The centimeter-sized chip is covered with Au nanoparticles in the surface as the markers which allow the bacteria to be observed easily on the chip. We demonstrate the success of our method by using E. coli as an example, and show that high-resolution TEM images of E. coli can be obtained with the method presented. Some E. coli morphology characteristics imaged using this method are also presented.

Keywords: bacteria, chip, nanoparticles, TEM

Procedia PDF Downloads 314

Authors: Francesco Pinci

Abstract:

This study focuses on sustainability and consumer behavior in relation to packaging aesthetics. It investigates the significance of product packaging as a potent marketing tool with a specific emphasis on commercially available pasta as a case study. The research delves into the visual components of packaging, encompassing aspects such as color, shape, packaging material, and logo design. The findings of this study hold particular relevance for food and beverage companies as they seek to gain a comprehensive understanding of the factors influencing consumer purchasing decisions. Furthermore, the study places a significant emphasis on the sustainability aspects of packaging, exploring how eco-friendly and environmentally conscious packaging choices can impact consumer preferences and behaviors. The insights generated from this research contribute to a more sustainable approach to packaging practices and inform marketers on the effective integration of sustainability principles in their branding strategies. Overall, this study provides valuable insights into the dynamic interplay between aesthetics, sustainability, and consumer behavior, offering practical implications for businesses seeking to align their packaging practices with sustainable and consumer-centric approaches. In this study, packaging designs and images from the website of Eataly US.Eataly is one of the leading distributors of authentic Italian pasta worldwide, and its website serves as a rich source of packaging visuals and product representations. By analyzing the packaging and images showcased on the Eataly website, the study gained valuable insights into consumer behavior and preferences regarding pasta packaging in the context of sustainability and aesthetics.

Keywords: consumer behaviour, sustainability, food marketing, neuromarketing

Procedia PDF Downloads 115

Authors: Timothy Francis Grant

Abstract:

There are conflicting purposes at play with the design of sustainable packaging which include material reduction, recycling compatibility, use of secondary content and performance of the package in protecting and delivering the product. Life Cycle Assessment (LCA) is able to evaluate these different strategies against environmental metrics such as climate change, land and water use and marine litter pollution. However, LCA has traditionally been too time consuming and expensive to be used effectively in packaging design process. To make LCA practical for packaging technologist and designers a simplified tool is needed to make LCA possible for non-environmental specialists. The Packaging Quick Evaluation Tool (PIQET) is a web-based solution for undertaking LCA of new and existing packaging designs considering the global supply chain and impacts from cradle to grave. PIQET is based on a pre-calculated LCA database covering the materials and processes involved in the packaging lifecycle from cradle to grave. This includes both virgin materials and recycled content, conversion of materials into packaging, and the transportation of packaging to the product filling. In addition, PIQET assesses the impacts once the package is filled looking at storage, transport and product loss through the supply chain. When applied to consumer packaging light weight packages which are note recyclable have lower impacts than more recyclable packages which have a higher mass. Its also apparent that for many products the impacts of product failure and product loss are more important environmentally compared to packaging material efficiency.

Keywords: Climate change, Life Cycle Assessment, Marine litter, Packaging sustainability

Procedia PDF Downloads 132

Authors: Nesrine Toubaline, Djamel Bennouar, Ali Mahdoum

Abstract:

3D technology can lead to a significant reduction in power and average hop-count in Networks on Chip (NoCs). It offers short and fast vertical links which copes with the long wire problem in 2D NoCs. This work proposes heuristic-based method to optimize number and placement of vertical links to achieve specified performance goals. Experiments show that significant improvement can be achieved by using a specific number of vertical interconnect.

Keywords: interconnect optimization, monolithic inter-tier vias, network on chip, system on chip, through silicon vias, three dimensional integration circuits

Procedia PDF Downloads 303

Authors: Shu-Yuan Lin, Tung-Chin Chou

Abstract:

As products become increasingly similar in competitive markets, achieving product segmentation and differentiation through packaging design has become the primary task when designing retail product packaging. When the main focus of brand marketing is no longer the product itself, emotional marketing, such as the use of humorous packaging designs, may be employed to successfully promote the brand. Such efforts will capture the hearts of consumers, generate discussions, and allow the brand to leave a deep impression in consumers. In this study, snack packaging was used to develop a relationship model that illustrated the effect of humorous packaging designs on brand awareness and brand attitude. The study was divided into three stages: In the first stage, in-depth interviews and focus group interviews were conducted with experts to construct 24 indicators for assessing humorous packaging designs. In the second stage, survey questionnaires were distributed to a young consumer group; the results showed that the group had a high and low product involvement with chocolate and dried shredded squid, respectively. Humorous packaging designs were subsequently created for two snack types to produce a study sample of 12 different packaging. In the third stage, packaging designs were evaluated by obtaining scores for the consumers’ brand awareness, brand attitude, and perceived effects of the packaging designs. Finally, a relationship model was developed to show the effect of humorous packaging designs on brand awareness and brand attitude, confirming that two perceived effects of humorous packaging designs (i.e., ‘pleasant and emotionally healing’ and ‘connected to people’s daily life’) exhibited a significant and positive effect on ‘perceived brand value,’ where the effect of ‘pleasant and emotionally healing’ was the most significant. In addition, ‘pleasant and emotionally healing’ exerted a significant and positive effect on ‘brand purchase intention.’ Furthermore, packaging designs with humorous elements helped foster brand awareness.

Keywords: brand awareness, brand attitude, humorous design, packaging design

Procedia PDF Downloads 226

Authors: T. Punjansing, M. Nakkuntod, S. Homchan, P. Inthima, A. Kongbangkerd

Abstract:

The influence of organic supplements on growth and multiplication efficiency of Phaius tankervilleae var. alba seedlings was investigated. 12 week-old seedlings were cultured on half-strength semi-solid Murashige and Skoog (MS) medium supplemented with 30 g/L sucrose, 8 g/L agar and various concentrations of coconut water (0, 50, 100, 150 and 200 mL/L) combined with potato extract (0, 25 and 50 g/L) and the pH was adjusted to 5.8 prior to autoclaving. The cultures were then kept under constant photoperiod (16 h light: 8 h dark) at 25 ± 2 °C for 12 weeks. The highest number of shoots (3.0 shoots/explant) was obtained when cultured on the medium added with 50 ml/L coconut water and 50 g/L potato extract whereas the highest number of leaves (5.9 leaves/explant) and roots (6.1 roots/explant) could receive on the medium supplemented with 150 ml/L coconut water and 50 g/L potato extract. with 150 ml/L coconut water and 50 g/L potato extract. Additionally, plantlets of P. tankervilleae var. alba were transferred to grow into seven different substrates i.e. soil, sand, coconut husk chip, soil-sand mix (1: 1), soil-coconut husk chip mix (1: 1), sand-coconut husk chip mix (1: 1) and soil-sand-coconut husk chip mix (1: 1: 1) for four weeks. The results found that acclimatized plants showed 100% of survivals when sand, coconut husk chip and sand-coconut husk chip mix are used as substrates. The number of leaves induced by sand-coconut husk chip mix was significantly higher than that planted in other substrates (P > 0.05). Meanwhile, no significant difference in new shoot formation among these substrates was observed (P < 0.05). This precursory developing protocol was likely to be applied for more large scale of plant production as well as conservation of germplasm of this orchid species.

Keywords: organic supplements, acclimatization, Phaius tankervilleae var. alba, orchid

Procedia PDF Downloads 229

Authors: Martin Pumera

Abstract:

Graphene materials are being widely used in electrochemistry due to their versatility and excellent properties as platforms for biosensing. Here we present current trends in the electrochemical biosensing of pesticides and other toxic compounds. We explore two fundamentally different designs, (i) using graphene and other 2-D nanomaterials as an electrochemical platform and (ii) using these nanomaterials in the laboratory on chip design, together with paramagnetic beads. More specifically: (i) We explore graphene as transducer platform with very good conductivity, large surface area, and fast heterogeneous electron transfer for the biosensing. We will present the comparison of these materials and of the immobilization techniques. (ii) We present use of the graphene in the laboratory on chip systems. Laboratory on the chip had a huge advantage due to small footprint, fast analysis times and sample handling. We will show the application of these systems for pesticide detection and detection of other toxic compounds.

Keywords: graphene, 2D nanomaterials, biosensing, chip design

Procedia PDF Downloads 550

Authors: Kasra Ghaemi, Syeda Tasnim, Shohel Mahmud

Abstract:

One of the main issues affecting the quality and shelf life of food products is temperature fluctuation during transportation and storage. Packaging plays an important role in protecting food from environmental conditions, especially thermal variations. In this study, the performance of using microencapsulated Phase Change Material (PCM) as a promising thermal buffer layer in smart food packaging is investigated. The considered insulation layer is evaluated for different thicknesses and the absorbed heat from the environment. The results are presented in terms of the melting time of PCM or provided thermal protection period.

Keywords: food packaging, phase change material, thermal buffer, protection time

Procedia PDF Downloads 94

Authors: Memet Vezir Kahraman, Ferhat Sen

Abstract:

This study aimed to develop polyelectrolyte structured antimicrobial food packaging materials that do not contain any antimicrobial agents. Cationic hydroxyethyl cellulose was synthesized and characterized by Fourier Transform Infrared, carbon and proton Nuclear Magnetic Resonance spectroscopy. Its nitrogen content was determined by the Kjeldahl method. Polyelectrolyte structured antimicrobial food packaging materials were prepared using hydroxyethyl cellulose, cationic hydroxyethyl cellulose, and sodium alginate. Antimicrobial activity of materials was defined by inhibition zone method (disc diffusion method). Thermal stability of samples was evaluated by thermal gravimetric analysis and differential scanning calorimetry. Surface morphology of samples was investigated by scanning electron microscope. The obtained results prove that produced food packaging materials have good thermal and antimicrobial properties, and they can be used as food packaging material in many industries.

Keywords: antimicrobial food packaging, cationic hydroxyethyl cellulose, polyelectrolyte, sodium alginate

Procedia PDF Downloads 159

Authors: Yi Zhang, Yuan Tian, Jiehua Chen, Sihong Gu

Abstract:

Chip-scale spin-exchange relaxation free (SERF) atomic magnetometer makes use of millimeter-scale vapor cells micro-fabricated by Micro-electromechanical Systems (MEMS) technique and SERF mechanism, resulting in the characteristics of high spatial resolution and high sensitivity. It is useful for biomagnetic imaging including magnetoencephalography and magnetocardiography. In a prevailing scheme, circularly polarized on-resonance laser beam is adapted for both pumping and probing the atomic polarization. And the magnetic-field-sensitive signal is extracted by transmission laser intensity enhancement as a result of atomic polarization increase on zero field level crossing resonance. The scheme is very suitable for integration, however, the laser amplitude modulation (AM) noise and laser frequency modulation to amplitude modulation (FM-AM) noise is superimposed on the photon shot noise reducing the signal to noise ratio (SNR). To suppress AM and FM-AM noise the paper puts forward a novel scheme which adopts circularly polarized on-resonance light pumping and linearly polarized frequency-detuning laser probing. The transmission beam is divided into transmission and reflection beams by a polarization analyzer, the angle between the analyzer's transmission polarization axis and frequency-detuning laser polarization direction is set to 45°. The magnetic-field-sensitive signal is extracted by polarization rotation enhancement of frequency-detuning laser which induces two beams intensity difference increase as the atomic polarization increases. Therefore, AM and FM-AM noise in two beams are common-mode and can be almost entirely canceled by differential detection. We have carried out an experiment to study our scheme. The experiment reveals that the noise in the differential signal is obviously smaller than that in each beam. The scheme is promising to be applied for developing more sensitive chip-scale magnetometer.

Keywords: atomic magnetometer, chip scale, differential detection, spin-exchange relaxation free

Procedia PDF Downloads 170

Authors: Qing K. Zhu

Abstract:

Very Large Scale Integration (VLSI) design becomes very complex due to the continuous integration of millions of gates in one chip based on Moore’s law. Designers have encountered numerous report files during design iterations using timing and noise analysis tools. This paper presented our work using data mining techniques combined with HTML tables to extract and represent critical timing/noise data. When we apply this data-mining tool in real applications, the running speed is important. The software employs table look-up techniques in the programming for the reasonable running speed based on performance testing results. We added several advanced features for the application in one industry chip design.

Keywords: VLSI design, data mining, big data, HTML forms, web, VLSI, EDA, timing, noise

Procedia PDF Downloads 254

Authors: Mohsen Marani Barzani, Ahmed A. D. Sarhan, Saeed Farahany, Ramesh Singh

Abstract:

Surface roughness and chip morphology are important output in manufacturing product. In this paper, an experimental investigation was conducted to determine the effects of various cutting speeds and feed rates on surface roughness and chip morphology in turning the Al-Si cast alloy and Sr-containing. Experimental trials carried out using coated carbide inserts. Experiments accomplished under oblique dry cutting when various cutting speeds 70, 130 and 250 m/min and feed rates of 0.05, 0.1 and 0.15 mm/rev were used, whereas depth of cut kept constant at 0.05 mm. The results showed that Sr-containing Al-Si alloy have poor surface roughness in comparison to Al-Si alloy (base alloy). The surface roughness values reduce with cutting speed increment from 70 to 250 m/min. the size of chip changed with changing silicon shape in Al matrix. Also, the surface finish deteriorated with increase in feed rate from 0.5 mm/rev to 0.15 mm/rev.

Keywords: strontium, surface roughness, chip, morphology, turning

Procedia PDF Downloads 386

Authors: Francesco Pinci

Abstract:

This research investigates the significance of product packaging as an effective marketing tool. By using commercially available pasta as an example, the study specifically examines the visual components of packaging, including color, shape, packaging material, and logo. The insights gained from studies like this are particularly valuable to food and beverage companies as they provide marketers with a deeper understanding of the factors influencing consumer purchasing decisions. The research analyzes data collected through surveys conducted via Google Forms and visual data obtained using iMotions eye-tracker software. The results affirm the importance of packaging design elements, such as color and product information, in shaping consumer buying behavior.

Keywords: consumer behaviour, eyetracker, food marketing, neuromarketing

Procedia PDF Downloads 116