Search results for: chip design

Authors: Boudjedra Abderrahim, Toumi Salah, Boutalbi Mostefa, Frihi Mohammed

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Nowadays, using the advancement of technology in semiconductor device fabrication, many transistors can be integrated to a single chip (VLSI). Although the growth chip density potentially eases systems-on-chip (SoCs) integrating thousands of processing element (PE) such as memory, processor, interfaces cores, system complexity, high-performance interconnect and scalable on-chip communication architecture become most challenges for many digital and embedded system designers. Networks-on-chip (NoCs) becomes a new paradigm that makes possible integrating heterogeneous devices and allows many communication constraints and performances. In this paper, we are interested for good performance and low area for implementation and a behavioral modeling of network on chip mesh topology design using VHDL hardware description language with performance evaluation and FPGA implementation results.

Keywords: design, implementation, communication system, network on chip, VHDL

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Authors: Rohaya Abdul Wahab, Raja Mohd Fuad Tengku Aziz, Nazaliza Othman, Sharifah Saleh, Nabihah Razali, Rozaimah Baharim, Md Hanif Md Nasir

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This paper will discuss flip chip methodology, in which I/O pads, standard cells, macros and bump cells array are placed in the floorplan, then routed using Astro place and route tool. Final DRC and LVS checking is done using Calibre verification tool. The design vehicle to run this methodology is an OpenRISC design targeted to Silterra 0.18 micrometer technology with 6 metal layers for routing. Astro has extensive support for flip chip placement and routing. Astro tool commands for flip chip are straightforward approach like the conventional standard wire bond packaging. However since we do not have flip chip commands in our Astro tool, no LEF file for bump cell and no LEF file for flip chip I/O pad, we create our own methodology to prepare for future flip chip tapeout. 

Keywords: methodology, flip chip, bump cell, LEF, astro, calibre, SCHEME, TCL

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Authors: Muthana Saleh Alalaki, Michael Opoku Agyeman

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The growth in the number of Intellectual Properties (IPs) or the number of cores on the same chip becomes a critical issue in System-on-Chip (SoC) due to the intra-communication problem between the chip elements. As a result, Network-on-Chip (NoC) has emerged as a system architecture to overcome intra-communication issues. This paper presents a study of recent contributions on simulation tools for NoC. Furthermore, an overview of NoC is covered as well as a comparison between some NoC simulators to help facilitate research in on-chip communication.

Keywords: WiNoC, simulation tool, network-on-chip, SoC

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Authors: Martin Pumera

Abstract:

Graphene materials are being widely used in electrochemistry due to their versatility and excellent properties as platforms for biosensing. Here we present current trends in the electrochemical biosensing of pesticides and other toxic compounds. We explore two fundamentally different designs, (i) using graphene and other 2-D nanomaterials as an electrochemical platform and (ii) using these nanomaterials in the laboratory on chip design, together with paramagnetic beads. More specifically: (i) We explore graphene as transducer platform with very good conductivity, large surface area, and fast heterogeneous electron transfer for the biosensing. We will present the comparison of these materials and of the immobilization techniques. (ii) We present use of the graphene in the laboratory on chip systems. Laboratory on the chip had a huge advantage due to small footprint, fast analysis times and sample handling. We will show the application of these systems for pesticide detection and detection of other toxic compounds.

Keywords: graphene, 2D nanomaterials, biosensing, chip design

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Authors: Reza Hadjiaghaie Vafaie, Aysan Madanpasandi, Behrooz Zare Desari, Seyedmohammad Mousavi

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High lamination in microchannel is one of the main challenges in on-chip components like micro total analyzer systems and lab-on-a-chips. Electro-osmotic force is highly effective in chip-scale. This research proposes a microfluidic-based micropump for low ionic strength solutions. Narrow microchannels are designed to generate an efficient electroosmotic flow near the walls. Microelectrodes are embedded in the lateral sides and actuated by low electric potential to generate pumping effect inside the channel. Based on the simulation study, the fluid velocity increases by increasing the electric potential amplitude. We achieve a net flow velocity of 100 µm/s, by applying +/- 2 V to the electrode structures. Our proposed low voltage design is of interest in conventional lab-on-a-chip applications.

Keywords: integration, electrokinetic, on-chip, fluid pumping, microfluidic

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Authors: Zhao Bin, Yan Dan Lei

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In this paper, a multi-pattern parallel PRBS generator and a dedicated parallel BER tester is proposed for the 8-Gbps On-chip interconnection testing. A unique full-parallel PRBS checker is also proposed. The proposed design, together with the custom-designed high-speed parallel-to-serial and the serial-to-parallel circuit, will be used to test different on-chip interconnection transceivers. The design is implemented in TSMC 28nm CMOS technology with working voltage at 1.0 V. The serial to parallel ratio is 8:1 so the parallel PRBS generation and BER Tester can be run at lower speed.

Keywords: PRBS, BER, high speed, generator

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Authors: D. O. Ramadan, R. S. Dwyer-Joyce

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The measurement of the interface conditions in a cutting tool contact is essential information for performance monitoring and control. This interface provides the path for the heat flux to the cutting tool. This elevate in the cutting tool temperature leads to motivate the mechanism of tool wear, thus affect the life of the cutting tool and the productivity. This zone is representative by the tool-chip interface. Therefore, understanding and monitoring this interface is considered an important issue in machining. In this paper, an acoustic emission (AE) technique was used to find the correlation between AE parameters and the tool-chip interface. For this reason, a response surface design (RSD) has been used to analyse and optimize the machining parameters. The experiment design was based on the face centered, central composite design (CCD) in the Minitab environment. According to this design, a series of orthogonal cutting experiments for different cutting conditions were conducted on a Triumph 2500 lathe machine to study the sensitivity of the acoustic emission (AE) signal to change in tool-chip contact length. The cutting parameters investigated were the cutting speed, depth of cut, and feed and the experiments were performed for 6082-T6 aluminium tube. All the orthogonal cutting experiments were conducted unlubricated. The tool-chip contact area was investigated using a scanning electron microscope (SEM). The results obtained in this paper indicate that there is a strong dependence of the root mean square (RMS) on the cutting speed, where the RMS increases with increasing the cutting speed. A dependence on the tool-chip contact length has been also observed. However there was no effect observed of changing the cutting depth and feed on the RMS. These dependencies have been clarified in terms of the strain and temperature in the primary and secondary shear zones, also the tool-chip sticking and sliding phenomenon and the effect of these mechanical variables on dislocation activity at high strain rates. In conclusion, the acoustic emission technique has the potential to monitor in situ the tool-chip interface in turning and consequently could indicate the approaching end of life of a cutting tool.

Keywords: Acoustic emission, tool-chip interface, orthogonal cutting, monitoring

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Authors: Long Kim Vu

Abstract:

The central processing unit in Electro-Optical devices is a Field-programmable gate array (FPGA) chip package allowing flexible, reconfigurable computing but energy consumption. Because chip package is placed in isolated devices based on IP67 waterproof standard, there is no air circulation and the heat dissipation is a challenge. In this paper, the author successfully modeled a chip package which various interposer materials such as silicon, glass and organics. Computational fluid dynamics (CFD) was utilized to analyze the thermal performance of chip package in the case of considering comprehensive heat transfer modes: conduction, convection and radiation, which proposes equivalent heat dissipation. The logic chip temperature varying with time is compared between the simulation and experiment results showing the excellent correlation, proving the reasonable chip modeling and simulation method.

Keywords: CFD, FPGA, heat transfer, thermal analysis

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Authors: Bhuvnesh Narayanan, Bernhard Weiss, Tvrtko Mandic, Adrijan Baric

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This paper discusses a method to reconstruct internal high-frequency signals through subsampling techniques in an IC using an on-chip sensor. Though there are existing methods to internally probe and reconstruct high frequency signals through subsampling techniques; these methods have been applicable mainly for synchronized systems. This paper demonstrates a method for making such non-intrusive on-chip reconstructions possible also in non-synchronized systems. The TLP pulse is used to demonstrate the experimental validation of the concept. The on-chip sensor measures the voltage in an internal node. The jitter in the input pulse causes a varying pulse delay with respect to the on-chip sampling command. By measuring this pulse delay and by correlating it with the measured on-chip voltage, time domain waveforms can be reconstructed, and the influence of the pulse on the internal nodes can be better understood.

Keywords: on-chip sensor, jitter, transmission line pulse, subsampling

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Authors: J. Shiue, I. H. Chen, S. W. Y. Chiu, Y. L. Wang

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In this work, we present a nondestructive method to characterize bacteria in a TEM system. Unlike the conventional TEM specimen preparation method, which needs to thin the specimen in a destructive way, or spread the samples on a tiny millimeter sized carbon grid, our method is easy to operate without the need of sample pretreatment. With a specially designed transparent chip that allows the electron beam to pass through, and a custom made chip holder to fit into a standard TEM sample holder, the bacteria specimen can be easily prepared on the chip without any pretreatment, and then be observed under TEM. The centimeter-sized chip is covered with Au nanoparticles in the surface as the markers which allow the bacteria to be observed easily on the chip. We demonstrate the success of our method by using E. coli as an example, and show that high-resolution TEM images of E. coli can be obtained with the method presented. Some E. coli morphology characteristics imaged using this method are also presented.

Keywords: bacteria, chip, nanoparticles, TEM

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Authors: F. Majeed, D. V. Thiel, M. Shahpari

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An electrically small meander line antenna is designed for impedance matching with RF transceiver chip CC1101. The design provides the flexibility of tuning the reactance of the antenna over a wide range of values: highly capacitive to highly inductive. The antenna was printed with silver ink on FR4 substrate using the screen printing design process. The antenna impedance was perfectly matched to CC1101 at 433 MHz. The measured radiation efficiency of the antenna was 81.3% at resonance. The 3 dB and 10 dB fractional bandwidth of the antenna was 14.5% and 4.78%, respectively. The read range of the antenna was compared with a copper wire monopole antenna over a distance of five meters. The antenna, with a perfect impedance match with RF transceiver chip CC1101, shows improvement in the read range compared to a monopole antenna over the specified distance.

Keywords: meander line antenna, RFID, silver ink printing, impedance matching

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Authors: Nesrine Toubaline, Djamel Bennouar, Ali Mahdoum

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3D technology can lead to a significant reduction in power and average hop-count in Networks on Chip (NoCs). It offers short and fast vertical links which copes with the long wire problem in 2D NoCs. This work proposes heuristic-based method to optimize number and placement of vertical links to achieve specified performance goals. Experiments show that significant improvement can be achieved by using a specific number of vertical interconnect.

Keywords: interconnect optimization, monolithic inter-tier vias, network on chip, system on chip, through silicon vias, three dimensional integration circuits

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Authors: Qing K. Zhu

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Very Large Scale Integration (VLSI) design becomes very complex due to the continuous integration of millions of gates in one chip based on Moore’s law. Designers have encountered numerous report files during design iterations using timing and noise analysis tools. This paper presented our work using data mining techniques combined with HTML tables to extract and represent critical timing/noise data. When we apply this data-mining tool in real applications, the running speed is important. The software employs table look-up techniques in the programming for the reasonable running speed based on performance testing results. We added several advanced features for the application in one industry chip design.

Keywords: VLSI design, data mining, big data, HTML forms, web, VLSI, EDA, timing, noise

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Authors: Pedro Acevedo, Carlos Díaz, Mónica Vázquez, Joel Durán

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This paper describes the design of a pulse generator based on the Programmable System-on-Chip (PSoC) module. In this module, using programmable logic is possible to implement different pulses which are required for ultrasonic applications, either in a single channel or multiple channels. This module can operate with programmable frequencies from 3-74 MHz; its programming may be versatile covering a wide range of ultrasonic applications. It is ideal for low-power ultrasonic applications where PZT or PVDF transducers are used.

Keywords: PSoC, pulse generator, PVDF, ultrasonic transducer

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Authors: Mohsen Marani Barzani, Ahmed A. D. Sarhan, Saeed Farahany, Ramesh Singh

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Surface roughness and chip morphology are important output in manufacturing product. In this paper, an experimental investigation was conducted to determine the effects of various cutting speeds and feed rates on surface roughness and chip morphology in turning the Al-Si cast alloy and Sr-containing. Experimental trials carried out using coated carbide inserts. Experiments accomplished under oblique dry cutting when various cutting speeds 70, 130 and 250 m/min and feed rates of 0.05, 0.1 and 0.15 mm/rev were used, whereas depth of cut kept constant at 0.05 mm. The results showed that Sr-containing Al-Si alloy have poor surface roughness in comparison to Al-Si alloy (base alloy). The surface roughness values reduce with cutting speed increment from 70 to 250 m/min. the size of chip changed with changing silicon shape in Al matrix. Also, the surface finish deteriorated with increase in feed rate from 0.5 mm/rev to 0.15 mm/rev.

Keywords: strontium, surface roughness, chip, morphology, turning

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Authors: Chun-Ming Huang, Yi-Jun Liu, Yi-Jie Hsieh, Jin-Ju Chue, Wei-Lin Lai, Chun-Yu Chen, Chih-Chyau Yang, Chien-Ming Wu

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The market of wearable devices has been growing rapidly in two years. The integration of sensors and wearable devices has become the trend of the next technology products. Thus, the academics and industries are eager to cultivate talented persons in sensing technology. Currently, academic and industries have more and more demands on the integrations of versatile sensors and applications, especially for the teams who focus on the development of sensor circuit architectures. These teams tape-out many MEMs sensors chips through the chip fabrication service from National Chip Implementation Center (CIC). However, most of these teams are only able to focus on the circuit design of MEMs sensors; they lack the key support of further system demonstration. This paper follows the CIC’s main mission of promoting the chip/system advanced design technology and aims to establish the environments of the modularized sensing system platform and the system design flow with the measurement and calibration technology. These developed environments are used to support these research teams and help academically advanced sensor designs to perform the system demonstration. Thus, the research groups can promote and transfer their advanced sensor designs to industrial and further derive the industrial economic values. In this paper, the modularized sensing platform is proposed to enable the system demonstration for advanced sensor chip design. The environment of sensor measurement and calibration is established for academic to achieve an accurate sensor result. Two reference sensor designs cooperated with the modularized sensing platform are given to show the sensing system integration and demonstration. These developed environments and platforms are currently provided to academics in Taiwan, and so that the academics can obtain a better environment to perform the system demonstration and improve the research and teaching quality.

Keywords: modularized sensing platform, sensor design and calibration, sensor system, sensor system design flow

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Authors: M. Benghersallah, L. Boulanouar, G. List, G. Sutter

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The present work is an experimental study on the dry high speed turning of Ti-6Al-4V titanium alloy. The objective of this study is to see for high cutting speeds, how wear occurs on the face of insert and how to evolve cutting forces and chip formation. Cutting speeds tested is 600, 800, 1000 and 1200 m / min in orthogonal turning with a carbide insert tool H13A uncoated on a cylindrical titanium alloy part. Investigation on the wear inserts with 3D scanning microscope revered the crater formation is instantaneous and a chip adhesion (welded chip) causes detachment of carbide particles. In these experiments, the chip shape was systematically investigated at each cutting conditions using optical microscopy. The chips produced were collected and polished to measure the thicknesses t2max and t2min, dch the distance between each segments and ɸseg the inclination angle As described in the introduction part, the shear angle f and the inclination angle of a segment ɸseg are differentiated. The angle ɸseg is actually measured on the collected chips while the shear angle f cannot be. The angle ɸ represents the initial shear similar to the one that describes the formation of a continuous chip in the primary shear zone. Cutting forces increase and stabilize before removing the tool. The chip reaches a very high temperature.

Keywords: dry high speed, orthogonal turning, chip formation, cutting speed, cutting forces

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Authors: Chien-Ju Chen, Chia-Jui Yu, Jyun-Hao Liao, Chia-Ching Wu, Meng-Chyi Wu

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A 64 × 64 GaN-based micro-light-emitting diode array (μLEDA) with 20 μm in pixel size and 40 μm in pitch by flip-chip bonding (FCB) is demonstrated in this study. Besides, an underfilling (UF) technology is applied to the process for improving the uniformity of device. With those configurations, good characteristics are presented, operation voltage and series resistance of a pixel in the 450 nm flip chip μLEDA are 2.89 V and 1077Ω (4.3 mΩ-cm²) at 25 A/cm², respectively. The μLEDA can sustain higher current density compared to conventional LED, and the power of the device is 9.5 μW at 100 μA and 0.42 mW at 20 mA.

Keywords: GaN, micro-light-emitting diode array(μLEDA), flip-chip bonding, underfilling

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Authors: Longfei Wang, Selçuk Köse

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Hardware Trojan becomes great concern as integrated circuit (IC) technology advances and not all manufacturing steps of an IC are accomplished within one company. Real-time hardware Trojan detection is proven to be a feasible way to detect randomly activated Trojans that cannot be detected at testing stage. On-chip sensors serve as a great candidate to implement real-time hardware Trojan detection, however, the optimization of on-chip sensors has not been thoroughly investigated and the location of Trojan has not been carefully explored. On-chip sensor ellipse distribution method and equivalent mapping technique are proposed based on the characteristics of on-chip power delivery network in this paper to address the optimization and distribution of on-chip sensors for real-time hardware Trojan detection as well as to estimate the location and current consumption of hardware Trojan. Simulation results verify that hardware Trojan activation can be effectively detected and the location of a hardware Trojan can be efficiently estimated with less than 5% error for a realistic power grid using our proposed methods. The proposed techniques therefore lay a solid foundation for isolation and even deactivation of hardware Trojans through accurate location of Trojans.

Keywords: hardware trojan, on-chip sensor, power distribution network, power/ground noise

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Authors: Han-Bin Park, Taesam Kang, SunKi Hong, Jeong Hoi Gu

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The piezoelectric material is being used widely for actuators due to its large power density with simple structure. It can generate a larger force than the conventional actuators with the same size. Furthermore, the response time of piezoelectric actuators is very short, and thus, it can be used for very fast system applications with compact size. To control the piezoelectric actuator, we need analog signal conditioning circuits as well as digital microcontrollers. Conventional microcontrollers are not equipped with analog parts and thus the control system becomes bulky compared with the small size of the piezoelectric devices. To overcome these weaknesses, we are developing one-chip micro controller that can handle analog and digital signals simultaneously using mixed signal FPGA technology. We used the SmartFusion™ FPGA device that integrates ARM®Cortex-M3, analog interface and FPGA fabric in a single chip and offering full customization. It gives more flexibility than traditional fixed-function microcontrollers with the excessive cost of soft processor cores on traditional FPGAs. In this paper we introduce the design of single chip controller using mixed signal FPGA, SmartFusion™[1] device. To demonstrate its performance, we implemented a PI controller for power driving circuit and a 5th order H-infinity controller for the system with piezoelectric actuator in the FPGA fabric. We also demonstrated the regulation of a power output and the operation speed of a 5th order H-infinity controller.

Keywords: mixed signal FPGA, PI control, piezoelectric actuator, SmartFusion™

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Authors: M. Benghersallah, G. List, G. Sutter

Abstract:

The present work is an experimental study on the dry high speed turning of Ti-6Al-4V titanium alloy. The objective of this study is to see for high cutting speeds, how wear occurs on the face of insert and how to evolve cutting forces and chip formation. Cutting speeds tested is 600, 800, 1000, and 1200 m/min in orthogonal turning with a carbide insert tool H13A uncoated on a cylindrical titanium alloy part. Investigation on the wear inserts with 3D scanning microscope revered the crater formation is instantaneous and a chip adhesion (welded chip) causes detachment of carbide particles. Cutting forces increase and stabilize before removing the tool. The chip reaches a very high temperature.

Keywords: titanium alloy, dry hjgh speed turning, wear insert, MQL technique

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Authors: Moaz H. Ali, Ahmed H. Al-Saadi

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Most of the materials used in the industry of aero-engine components generally consist of titanium alloys. Advanced materials, because of their excellent combination of high specific strength, lightweight, and general corrosion resistance. In fact, chemical wear resistance of aero-engine alloy provide a serious challenge for cutting tool material during the machining process. The reduction in cutting temperature distributions leads to an increase in tool life and a decrease in wear rate. Hence, the chip morphology and segmentation play a predominant role in determining machinability and tool wear during the machining process. The result of low thermal conductivity and diffusivity of this alloy in the concentration of high temperatures at the tool-work-piece and tool-chip interface. Consequently, the chip morphology is very important in the study of machinability of metals as well as the study of cutting tool wear. Otherwise, the result will be accelerating tool wear, increasing manufacturing cost and time consuming.

Keywords: machinability, titanium alloy (ti-6al-4v), chip formation, milling process

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Authors: Kadir Gök

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In this study, a vacuum system was developed for orthopedic drilling processes, and the most efficient processing parameters were determined using statistical analysis of temperature rise. A reverse engineering technique was used to obtain a 3D model of the chip vacuum system, and the obtained point cloud data was transferred to Solidworks software in STL format. An experimental design method was performed by selecting different parameters and their levels, such as RPM, feed rate, and drill bit diameter, to determine the most efficient processing parameters in temperature rise using ANOVA. Additionally, the bone chip-vacuum device was developed and performed successfully to collect the whole chips and fragments in the bone drilling experimental tests, and the chip-collecting device was found to be useful in removing overheating from the drilling zone. The effects of processing parameters on the temperature levels during the chip-vacuuming were determined, and it was found that bone chips and fractures can be used as autograft and allograft for tissue engineering. Overall, this study provides significant insights into the development of a vacuum system for orthopedic drilling processes and the use of bone chips and fractures in tissue engineering applications.

Keywords: vacuum system, orthopedic drilling, temperature rise, bone chips

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Authors: Vinayaga Jagadessh Raja, R. Ganesan, S. Ramesh Kumar

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An ever more significant fraction of the overall power dissipation of a network-on-chip (NoC) based system on- chip (SoC) is due to the interconnection scheme. In information, as equipment shrinks, the power contributes of NoC links starts to compete with that of NoC routers. In this paper, we propose the use of clock gating in the data encoding techniques as a viable way to reduce both power dissipation and time consumption of NoC links. The projected scramble scheme exploits the wormhole switching techniques. That is, flits are scramble by the network interface (NI) before they are injected in the network and are decoded by the target NI. This makes the scheme transparent to the underlying network since the encoder and decoder logic is integrated in the NI and no modification of the routers structural design is required. We review the projected scramble scheme on a set of representative data streams (both synthetic and extracted from real applications) showing that it is possible to reduce the power contribution of both the self-switching activity and the coupling switching activity in inter-routers links.

Keywords: Xilinx 12.1, power consumption, Encoder, NOC

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Authors: Guowei Hou, Lixin Yu, Wei Zhuang, Hui Qin, Xue Yang

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Formal verification is proposed to ensure the correctness of the design and make functional verification more efficient. As cache plays a vital role in the design of System on Chip (SoC), and cache with Memory Management Unit (MMU) and cache memory unit makes the state space too large for simulation to verify, then a formal verification is presented for such system design. In the paper, a formal model checking verification flow is suggested and a new cache memory model which is called “exhaustive search model” is proposed. Instead of using large size ram to denote the whole cache memory, exhaustive search model employs just two cache blocks. For cache system contains data cache (Dcache) and instruction cache (Icache), Dcache memory model and Icache memory model are established separately using the same mechanism. At last, the novel model is employed to the verification of a cache which is module of a custom-built SoC system that has been applied in practical, and the result shows that the cache system is verified correctly using the exhaustive search model, and it makes the verification much more manageable and flexible.

Keywords: cache system, formal verification, novel model, system on chip (SoC)

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Authors: Manel Langar, Riad Bourguiba, Jaouhar Mouine

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In this paper, we propose the design and implementation of an enhanced wormhole virtual channel on chip router. It is a heart of a mesh NoC using the XY deterministic routing algorithm. It is characterized by its simple virtual channel allocation strategy which allows reducing area and complexity of connections without affecting the performance. We implemented our router on a Tezzaron process to validate its performances. This router is a basic element that will be used later to design a 3D mesh NoC.

Keywords: NoC, mesh, router, 3D NoC

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Authors: Samineh Barmaki, Ville Jokinen, Esko Kankuri

Abstract:

We report a microfluidic chip that can be used to modify the gaseous microenvironment of a cell-culture in ambient atmospheric conditions. The aim of the study is to show the cellular response to nitric oxide (NO) under hypoxic (oxygen < 5%) condition. Simultaneously targeting to hypoxic and nitric oxide will provide an opportunity for NO‑based therapeutics. Studies on cellular responses to lowered oxygen concentration or to gaseous mediators are usually carried out under a specific macro environment, such as hypoxia chambers, or with specific NO donor molecules that may have additional toxic effects. In our study, the chip consists of a microfluidic layer and a cell culture well, separated by a thin gas permeable polydimethylsiloxane (PDMS) membrane. The main design goal is to separate the gas oxygen scavenger and NO donor solutions, which are often toxic, from the cell media. Two different types of gas exchangers, titled 'pool' and 'meander' were tested. We find that the pool design allows us to reach a higher level of oxygen depletion than meander (24.32 ± 19.82 %vs -3.21 ± 8.81). Our microchip design can make the cells culture more simple and makes it easy to adapt existing cell culture protocols. Our first application is utilizing the chip to create hypoxic conditions on targeted areas of cell culture. In this study, oxygen scavenger sodium sulfite generates hypoxia and its effect on human embryonic kidney cells (HEK-293). The PDMS membrane was coated with fibronectin before initiating cell cultures, and the cells were grown for 48h on the chips before initiating the gas control experiments. The hypoxia experiments were performed by pumping of O₂-depleted H₂O into the microfluidic channel with a flow-rate of 0.5 ml/h. Image-iT® reagent as an oxygen level responser was mixed with HEK-293 cells. The fluorescent signal appears on cells stained with Image-iT® hypoxia reagent (after 6h of pumping oxygen-depleted H₂O through the microfluidic channel in pool area). The exposure to different levels of O₂ can be controlled by varying the thickness of the PDMS membrane. Recently, we improved the design of the microfluidic chip, which can control the microenvironment of two different gases at the same time. The hypoxic response was also improved from the new design of microchip. The cells were grown on the thin PDMS membrane for 30 hours, and with a flowrate of 0.1 ml/h; the oxygen scavenger was pumped into the microfluidic channel. We also show that by pumping sodium nitroprusside (SNP) as a nitric oxide donor activated under light and can generate nitric oxide on top of PDMS membrane. We are aiming to show cellular microenvironment response of HEK-293 cells to both nitric oxide (by pumping SNP) and hypoxia (by pumping oxygen scavenger solution) in separated channels in one microfluidic chip.

Keywords: hypoxia, nitric oxide, microenvironment, microfluidic chip, sodium nitroprusside, SNP

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Authors: Laura Boschis, Elena D. Ozzello, Enzo Mastromatteo

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Point of care diagnostic finds growing interest in medicine and agri-food because of faster intervention and prevention. EliChip is a microfluidic platform to perform Point of Care immunoenzymatic assay based on ready-to-use kits and a portable instrument to manage fluidics and read reliable quantitative results. Thanks to miniaturization, analyses are faster and more sensible than conventional ELISA. EliChip is one of the crucial assets of the Europen-founded Flamingo project for in-line measuring inflammatory markers.

Keywords: lab on chip, point of care, immunoenzymatic analysis, synovial arthritis

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Authors: Mohammad Arif Sobhan Bhuiyan, Mamun Bin Ibne Reaz

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The rapid advancement of CMOS technology, in the recent years, has led the scientists to fabricate wireless transceivers fully on-chip which results in smaller size and lower cost wireless communication devices with acceptable performance characteristics. Moreover, the performance of the wireless transceivers rigorously depends on the performance of its first block T/R switch. This article proposes a design of a high performance T/R switch for 2.4 GHz RF wireless transceivers in 0.13 µm CMOS technology. The switch exhibits 1- dB insertion loss, 37.2-dB isolation in transmit mode and 1.4-dB insertion loss, 25.6-dB isolation in receive mode. The switch has a power handling capacity (P1dB) of 30.9-dBm. Besides, by avoiding bulky inductors and capacitors, the size of the switch is drastically reduced and it occupies only (0.00296) mm2 which is the lowest ever reported in this frequency band. Therefore, simplicity and low chip area of the circuit will trim down the cost of fabrication as well as the whole transceiver.

Keywords: CMOS, ISM band, SPDT, t/r switch, transceiver

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Authors: Junior Nomani

Abstract:

This paper presents a novel approach to modelling the metal cutting of duplex stainless steels, a two-phase alloy regarded as a difficult-to-machine material. Calculation and control of shear strain and stresses during cutting are essential to achievement of ideal cutting conditions. Too low or too high leads to higher required cutting force or excessive heat generation causing premature tool wear failure. A 2D finite element cutting model was created based on electron backscatter diffraction (EBSD) data imagery of duplex microstructure. A mesh was generated using ‘object-oriented’ software OOF2 version V2.1.11, converting microstructural images to quadrilateral elements. A virtual workpiece was created on ABAQUS modelling software where a rigid body toolpiece advanced towards workpiece simulating chip formation, generating serrated edge chip formation cutting. Model results found calculated stress strain contour plots correlated well with similar finite element models tied with austenite stainless steel alloys. Virtual chip form profile is also similar compared experimental frozen machining chip samples. The output model data provides new insight description of strain behavior of two phase material on how it transitions from workpiece into the chip.

Keywords: Duplex stainless steel, ABAQUS, OOF2, Chip formation

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