Search results for: chip seal

Authors: Rafiqul Tarefder, Mohiuddin Ahmad, Mohammad Hossain

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While milling materials from old pavement surface can be an important component of cost effective maintenance operation, their use in maintenance projects are not uniform and well documented. This study documents the different maintenance practices followed by four transportation districts of New Mexico Department of Transportation (NMDOT) in an attempt to find whether millings are being used in maintenance projects by those districts. Based on existing literature, a questionnaire was developed related to six common maintenance practices. NMDOT district personal were interviewed face to face to discuss and get answers to that questionnaire. It revealed that NMDOT districts mainly use chip seal and patching. Other maintenance procedures such as sand seal, scrub seal, slurry seal, and thin overlay have limited use. Two out of four participating districts do not have any documents on chip sealing; rather they employ the experiences of the chip seal crew. All districts use polymer modified high float emulsion (HFE100P) for chip seal with an application rate ranging from 0.4 to 0.56 gallons per square yard. Chip application rate varies from 15 to 40 lb/ square yard. State wide, the thickness of chip seal varies from 3/8" to 1" and life varies from 3 to 10 years. NMDOT districts mainly use three type of patching: pothole, dig-out and blade patch. Pothole patches are used for small potholes and during emergency, dig-out patches are used for all type of potholes sometimes after pothole patching, and blade patch is used when a significant portion of the pavement is damaged. Pothole patches last as low as three days whereas, blade patch lasts as long as 3 years. It was observed that all participating districts use millings in maintenance projects.

Keywords: chip seal, sand seal, scrub seal, slurry seal, overlay, patching, millings

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Authors: Muthana Saleh Alalaki, Michael Opoku Agyeman

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The growth in the number of Intellectual Properties (IPs) or the number of cores on the same chip becomes a critical issue in System-on-Chip (SoC) due to the intra-communication problem between the chip elements. As a result, Network-on-Chip (NoC) has emerged as a system architecture to overcome intra-communication issues. This paper presents a study of recent contributions on simulation tools for NoC. Furthermore, an overview of NoC is covered as well as a comparison between some NoC simulators to help facilitate research in on-chip communication.

Keywords: WiNoC, simulation tool, network-on-chip, SoC

Procedia PDF Downloads 462

Authors: Boudjedra Abderrahim, Toumi Salah, Boutalbi Mostefa, Frihi Mohammed

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Nowadays, using the advancement of technology in semiconductor device fabrication, many transistors can be integrated to a single chip (VLSI). Although the growth chip density potentially eases systems-on-chip (SoCs) integrating thousands of processing element (PE) such as memory, processor, interfaces cores, system complexity, high-performance interconnect and scalable on-chip communication architecture become most challenges for many digital and embedded system designers. Networks-on-chip (NoCs) becomes a new paradigm that makes possible integrating heterogeneous devices and allows many communication constraints and performances. In this paper, we are interested for good performance and low area for implementation and a behavioral modeling of network on chip mesh topology design using VHDL hardware description language with performance evaluation and FPGA implementation results.

Keywords: design, implementation, communication system, network on chip, VHDL

Procedia PDF Downloads 344

Authors: Hossein Shokouhmand, Masoomeh Shadab, Rohallah Torabi

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Turbulent flow inside the seal chamber of a pump operating at nearly high Reynolds number is investigated. A comparison of a 3-D computational model for flow and thermal analysis of a mechanical seal with experimental thermal results is presented. The computational model adequately predicts the flow field in the seal chamber and thermal characteristics with the rotating and stationary rings and the twister flow around the seal parts by solving N-S and energy equations in ANSYS-CFX software. The Reynolds stress model (RSM) is applied as a turbulence model for this purpose. Experimental work is discussed which quantifies the temperature of five different points of the working fluid in chamber, mass flow at inlet and the fluid pressure at inlet and outlet. Experimental measurements are combined with computational modeling to obtain local and average heat transfer characteristics. Numerical results of three cases including different flush rates are reported.

Keywords: mechanical seal, CFD_CFX, reynolds stress model, flow field, heat transfer analysis, stream line, heat transfer coefficient, heat flux, nusselt

Procedia PDF Downloads 411

Authors: Paul Onyegbule, Harjit Singh

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Vacuum glazing is an innovative transparent thermal insulator that has application in high performance window, especially in renewable energy. Different materials as well as sealing methods have been adopted to seal windows with different temperatures. The impact of temperatures on sealing layers has been found to have significant effects on the microstructure of the seal. This paper seeks to investigate the effects of sealing materials specifically glass powder and flux compound (borax) for vacuum glazing. The findings of the experiment conducted show that the sealing material was rigid with some leakage around the edge, and we found that this could be stopped by enhancing the uniformity of the seal within the periphery. Also, we found that due to the intense tensile stress from the oven surface temperature of the seal at 200 ⁰C, a crack was observed at the side of the glass. Based on the above findings, this study concludes that a glass powder with a lower melting temperature of below 250 ⁰C with the addition of an adhesive (borax flux) should be used for future vacuum seals.

Keywords: double glazed windows, U-value, heat loss, borax powder, edge seal

Procedia PDF Downloads 191

Authors: Rohaya Abdul Wahab, Raja Mohd Fuad Tengku Aziz, Nazaliza Othman, Sharifah Saleh, Nabihah Razali, Rozaimah Baharim, Md Hanif Md Nasir

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This paper will discuss flip chip methodology, in which I/O pads, standard cells, macros and bump cells array are placed in the floorplan, then routed using Astro place and route tool. Final DRC and LVS checking is done using Calibre verification tool. The design vehicle to run this methodology is an OpenRISC design targeted to Silterra 0.18 micrometer technology with 6 metal layers for routing. Astro has extensive support for flip chip placement and routing. Astro tool commands for flip chip are straightforward approach like the conventional standard wire bond packaging. However since we do not have flip chip commands in our Astro tool, no LEF file for bump cell and no LEF file for flip chip I/O pad, we create our own methodology to prepare for future flip chip tapeout. 

Keywords: methodology, flip chip, bump cell, LEF, astro, calibre, SCHEME, TCL

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Authors: Won Kyeong Kang, Tae-Ho Song

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Vacuum glazing (VG) is a super insulator, which is able to greatly improve the energy efficiency of building. However, a significant amount of heat loss occurs through the welded edge of conventional VG. The joining method should be improved for further application and commercialization. For this purpose VG with metal edge seal is conceived. In this paper, the feasibility of joining stainless steel and soda lime glass using glass solder is assessed numerically and experimentally. In the case of very thin stainless steel, partial joining with glass is identified, which need further improvement for practical application.

Keywords: VG, metal edge seal, vacuum glazing, manufacturing,

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Authors: Long Kim Vu

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The central processing unit in Electro-Optical devices is a Field-programmable gate array (FPGA) chip package allowing flexible, reconfigurable computing but energy consumption. Because chip package is placed in isolated devices based on IP67 waterproof standard, there is no air circulation and the heat dissipation is a challenge. In this paper, the author successfully modeled a chip package which various interposer materials such as silicon, glass and organics. Computational fluid dynamics (CFD) was utilized to analyze the thermal performance of chip package in the case of considering comprehensive heat transfer modes: conduction, convection and radiation, which proposes equivalent heat dissipation. The logic chip temperature varying with time is compared between the simulation and experiment results showing the excellent correlation, proving the reasonable chip modeling and simulation method.

Keywords: CFD, FPGA, heat transfer, thermal analysis

Procedia PDF Downloads 156

Authors: Quoc Ngoc Phan, Hieu Van Nguyen, Minh Hong Nguyen

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This study presents an integrated approach using Mercury Injection Capillary Pressure (MICP) and petrographic analysis to assess the seal quality of the inter-bedded shale formations which are considered the intra-formation top seals of hydrocarbon bearing zones in Green Dragon structure. Based on the hydrocarbon column height (HCH) at leak point derived from capillary pressure data, four seal types were identified. Furthermore, the results of scanning electron microscopy (SEM) and X-ray diffraction (XRD) analysis were interpreted to clarify the influence of clay minerals on seal capacity. The result of the study indicated that the inter-bedded shale formations are the good sealing quality with a majority of analyzed samples ranked type A and B seals in the sample set. Both seal types occurred mainly in mudstones with pore radius estimated less than 0.251 µm. Overall, type A and B seals contained a large amount of authigenic clay minerals such as illite, chlorite which showed the complexity of morphological arrangement in pore space. Conversely, the least common seal type C and D were presented in moderately compacted sandstones with more open pore radius. It is noticeable that there was a reduction of illite and chlorite in clay mineral fraction of these seal type. It is expected that the integrated analysis approach using Mercury Injection Capillary Pressure and petrographic data employed in this study can be applied to assess the sealing quality of future well sites in Green Dragon or other structures.

Keywords: seal capacity, hydrocarbon height column, seal type, SEM, XRD

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Authors: Bhuvnesh Narayanan, Bernhard Weiss, Tvrtko Mandic, Adrijan Baric

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This paper discusses a method to reconstruct internal high-frequency signals through subsampling techniques in an IC using an on-chip sensor. Though there are existing methods to internally probe and reconstruct high frequency signals through subsampling techniques; these methods have been applicable mainly for synchronized systems. This paper demonstrates a method for making such non-intrusive on-chip reconstructions possible also in non-synchronized systems. The TLP pulse is used to demonstrate the experimental validation of the concept. The on-chip sensor measures the voltage in an internal node. The jitter in the input pulse causes a varying pulse delay with respect to the on-chip sampling command. By measuring this pulse delay and by correlating it with the measured on-chip voltage, time domain waveforms can be reconstructed, and the influence of the pulse on the internal nodes can be better understood.

Keywords: on-chip sensor, jitter, transmission line pulse, subsampling

Procedia PDF Downloads 113

Authors: J. Shiue, I. H. Chen, S. W. Y. Chiu, Y. L. Wang

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In this work, we present a nondestructive method to characterize bacteria in a TEM system. Unlike the conventional TEM specimen preparation method, which needs to thin the specimen in a destructive way, or spread the samples on a tiny millimeter sized carbon grid, our method is easy to operate without the need of sample pretreatment. With a specially designed transparent chip that allows the electron beam to pass through, and a custom made chip holder to fit into a standard TEM sample holder, the bacteria specimen can be easily prepared on the chip without any pretreatment, and then be observed under TEM. The centimeter-sized chip is covered with Au nanoparticles in the surface as the markers which allow the bacteria to be observed easily on the chip. We demonstrate the success of our method by using E. coli as an example, and show that high-resolution TEM images of E. coli can be obtained with the method presented. Some E. coli morphology characteristics imaged using this method are also presented.

Keywords: bacteria, chip, nanoparticles, TEM

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Authors: Nesrine Toubaline, Djamel Bennouar, Ali Mahdoum

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3D technology can lead to a significant reduction in power and average hop-count in Networks on Chip (NoCs). It offers short and fast vertical links which copes with the long wire problem in 2D NoCs. This work proposes heuristic-based method to optimize number and placement of vertical links to achieve specified performance goals. Experiments show that significant improvement can be achieved by using a specific number of vertical interconnect.

Keywords: interconnect optimization, monolithic inter-tier vias, network on chip, system on chip, through silicon vias, three dimensional integration circuits

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Authors: Aydin Azizi, Ahmed Al. Azizi

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Mechanical seals are essential components in centrifugal pumps since they help in controlling leaking out of the liquid that is pumped under pressure. Unlike the common types of packaging, mechanical seals are highly efficient and they reduce leakage by a great extent. However, all multiphase mechanical seals leak and they are subject to failure. Some of the factors that have been recognized to their failure include excessive heating, open seal faces, as well as environment related factors that trigger failure of the materials used to manufacture seals. The proposed research study will explore the failure of multiphase mechanical seal in centrifugal pumps. The objective of the study includes how to reduce the failure in multiphase mechanical seals and to make them more efficient.

Keywords: mechanical seals, centrifugal pumps, multi phase failure, excessive heating

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Authors: Reza Hadjiaghaie Vafaie, Aysan Madanpasandi, Behrooz Zare Desari, Seyedmohammad Mousavi

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High lamination in microchannel is one of the main challenges in on-chip components like micro total analyzer systems and lab-on-a-chips. Electro-osmotic force is highly effective in chip-scale. This research proposes a microfluidic-based micropump for low ionic strength solutions. Narrow microchannels are designed to generate an efficient electroosmotic flow near the walls. Microelectrodes are embedded in the lateral sides and actuated by low electric potential to generate pumping effect inside the channel. Based on the simulation study, the fluid velocity increases by increasing the electric potential amplitude. We achieve a net flow velocity of 100 µm/s, by applying +/- 2 V to the electrode structures. Our proposed low voltage design is of interest in conventional lab-on-a-chip applications.

Keywords: integration, electrokinetic, on-chip, fluid pumping, microfluidic

Procedia PDF Downloads 262

Authors: Martin Pumera

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Graphene materials are being widely used in electrochemistry due to their versatility and excellent properties as platforms for biosensing. Here we present current trends in the electrochemical biosensing of pesticides and other toxic compounds. We explore two fundamentally different designs, (i) using graphene and other 2-D nanomaterials as an electrochemical platform and (ii) using these nanomaterials in the laboratory on chip design, together with paramagnetic beads. More specifically: (i) We explore graphene as transducer platform with very good conductivity, large surface area, and fast heterogeneous electron transfer for the biosensing. We will present the comparison of these materials and of the immobilization techniques. (ii) We present use of the graphene in the laboratory on chip systems. Laboratory on the chip had a huge advantage due to small footprint, fast analysis times and sample handling. We will show the application of these systems for pesticide detection and detection of other toxic compounds.

Keywords: graphene, 2D nanomaterials, biosensing, chip design

Procedia PDF Downloads 517

Authors: Mohsen Marani Barzani, Ahmed A. D. Sarhan, Saeed Farahany, Ramesh Singh

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Surface roughness and chip morphology are important output in manufacturing product. In this paper, an experimental investigation was conducted to determine the effects of various cutting speeds and feed rates on surface roughness and chip morphology in turning the Al-Si cast alloy and Sr-containing. Experimental trials carried out using coated carbide inserts. Experiments accomplished under oblique dry cutting when various cutting speeds 70, 130 and 250 m/min and feed rates of 0.05, 0.1 and 0.15 mm/rev were used, whereas depth of cut kept constant at 0.05 mm. The results showed that Sr-containing Al-Si alloy have poor surface roughness in comparison to Al-Si alloy (base alloy). The surface roughness values reduce with cutting speed increment from 70 to 250 m/min. the size of chip changed with changing silicon shape in Al matrix. Also, the surface finish deteriorated with increase in feed rate from 0.5 mm/rev to 0.15 mm/rev.

Keywords: strontium, surface roughness, chip, morphology, turning

Procedia PDF Downloads 347

Authors: M. Benghersallah, L. Boulanouar, G. List, G. Sutter

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The present work is an experimental study on the dry high speed turning of Ti-6Al-4V titanium alloy. The objective of this study is to see for high cutting speeds, how wear occurs on the face of insert and how to evolve cutting forces and chip formation. Cutting speeds tested is 600, 800, 1000 and 1200 m / min in orthogonal turning with a carbide insert tool H13A uncoated on a cylindrical titanium alloy part. Investigation on the wear inserts with 3D scanning microscope revered the crater formation is instantaneous and a chip adhesion (welded chip) causes detachment of carbide particles. In these experiments, the chip shape was systematically investigated at each cutting conditions using optical microscopy. The chips produced were collected and polished to measure the thicknesses t2max and t2min, dch the distance between each segments and ɸseg the inclination angle As described in the introduction part, the shear angle f and the inclination angle of a segment ɸseg are differentiated. The angle ɸseg is actually measured on the collected chips while the shear angle f cannot be. The angle ɸ represents the initial shear similar to the one that describes the formation of a continuous chip in the primary shear zone. Cutting forces increase and stabilize before removing the tool. The chip reaches a very high temperature.

Keywords: dry high speed, orthogonal turning, chip formation, cutting speed, cutting forces

Procedia PDF Downloads 249

Authors: Chien-Ju Chen, Chia-Jui Yu, Jyun-Hao Liao, Chia-Ching Wu, Meng-Chyi Wu

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A 64 × 64 GaN-based micro-light-emitting diode array (μLEDA) with 20 μm in pixel size and 40 μm in pitch by flip-chip bonding (FCB) is demonstrated in this study. Besides, an underfilling (UF) technology is applied to the process for improving the uniformity of device. With those configurations, good characteristics are presented, operation voltage and series resistance of a pixel in the 450 nm flip chip μLEDA are 2.89 V and 1077Ω (4.3 mΩ-cm²) at 25 A/cm², respectively. The μLEDA can sustain higher current density compared to conventional LED, and the power of the device is 9.5 μW at 100 μA and 0.42 mW at 20 mA.

Keywords: GaN, micro-light-emitting diode array(μLEDA), flip-chip bonding, underfilling

Procedia PDF Downloads 389

Authors: Longfei Wang, Selçuk Köse

Abstract:

Hardware Trojan becomes great concern as integrated circuit (IC) technology advances and not all manufacturing steps of an IC are accomplished within one company. Real-time hardware Trojan detection is proven to be a feasible way to detect randomly activated Trojans that cannot be detected at testing stage. On-chip sensors serve as a great candidate to implement real-time hardware Trojan detection, however, the optimization of on-chip sensors has not been thoroughly investigated and the location of Trojan has not been carefully explored. On-chip sensor ellipse distribution method and equivalent mapping technique are proposed based on the characteristics of on-chip power delivery network in this paper to address the optimization and distribution of on-chip sensors for real-time hardware Trojan detection as well as to estimate the location and current consumption of hardware Trojan. Simulation results verify that hardware Trojan activation can be effectively detected and the location of a hardware Trojan can be efficiently estimated with less than 5% error for a realistic power grid using our proposed methods. The proposed techniques therefore lay a solid foundation for isolation and even deactivation of hardware Trojans through accurate location of Trojans.

Keywords: hardware trojan, on-chip sensor, power distribution network, power/ground noise

Procedia PDF Downloads 349

Authors: M. Benghersallah, G. List, G. Sutter

Abstract:

The present work is an experimental study on the dry high speed turning of Ti-6Al-4V titanium alloy. The objective of this study is to see for high cutting speeds, how wear occurs on the face of insert and how to evolve cutting forces and chip formation. Cutting speeds tested is 600, 800, 1000, and 1200 m/min in orthogonal turning with a carbide insert tool H13A uncoated on a cylindrical titanium alloy part. Investigation on the wear inserts with 3D scanning microscope revered the crater formation is instantaneous and a chip adhesion (welded chip) causes detachment of carbide particles. Cutting forces increase and stabilize before removing the tool. The chip reaches a very high temperature.

Keywords: titanium alloy, dry hjgh speed turning, wear insert, MQL technique

Procedia PDF Downloads 523

Authors: Moaz H. Ali, Ahmed H. Al-Saadi

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Most of the materials used in the industry of aero-engine components generally consist of titanium alloys. Advanced materials, because of their excellent combination of high specific strength, lightweight, and general corrosion resistance. In fact, chemical wear resistance of aero-engine alloy provide a serious challenge for cutting tool material during the machining process. The reduction in cutting temperature distributions leads to an increase in tool life and a decrease in wear rate. Hence, the chip morphology and segmentation play a predominant role in determining machinability and tool wear during the machining process. The result of low thermal conductivity and diffusivity of this alloy in the concentration of high temperatures at the tool-work-piece and tool-chip interface. Consequently, the chip morphology is very important in the study of machinability of metals as well as the study of cutting tool wear. Otherwise, the result will be accelerating tool wear, increasing manufacturing cost and time consuming.

Keywords: machinability, titanium alloy (ti-6al-4v), chip formation, milling process

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Authors: Farid Arya, Trevor Hyde, Andrea Trevisi, Paolo Basso, Danilo Bardaro

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Heat transfer through multiple pane windows can be reduced by creating a vacuum pressure less than 0.1 Pa between the glass panes, with low emittance coatings on one or more of the internal surfaces. Fabrication of vacuum glazing (VG) requires the formation of a hermetic seal around the periphery of the glass panes together with an array of support pillars between the panes to prevent them from touching under atmospheric pressure. Atmospheric pressure and temperature differentials induce stress which can affect the integrity of the glazing. Several parameters define the stresses in VG including the glass thickness, pillar specifications, glazing dimensions and edge seal configuration. Inherent stresses in VG can result in fractures in the glass panes and failure of the edge seal. In this study, stress in VG with different glass thicknesses is theoretically studied using Finite Element Modelling (FEM). Based on the finding in this study, suggestions are made to address problems resulting from the use of thinner glass panes in the fabrication of VG. This can lead to the development of high performance, light and thin VG.

Keywords: vacuum glazing, stress, vacuum insulation, support pillars

Procedia PDF Downloads 156

Authors: Ning Chia

Abstract:

Each of the three different language texts (Manchu, Russian, and Latin) of the 1689 Treaty of Nerchinsk bore official seals from Imperial Russia and Qing China. These seals have received no academic attention, yet they can reveal a site of a layered and shared material, cultural, political, and diplomatic world of the time in Eastern Eurasia. The very different seal selections from both empires while ratifying the Treaty of Beijing in 1860 have obtained no scholarly advertency either; they can also explicate a tremendously changed relationship with visual and material manifestation. Exploring primary sources in Manchu, Russian, and Chinese languages as well as the images of the visual seals, this study investigates the reasons and purposes of utilizing official seals for the treaty agreement. A refreshed understanding of Russian-Qing diplomacy will be developed by pursuing the following aspects: (i) Analyzing the iconographic meanings of each seal insignia and unearthing a competitive, yet symbols-delivered and seal-generated, 'dialogue' between the two empires (ii) Contextualizing treaty seals within the historical seal cultures, and discovering how domestic seal system in each empire’s political institution developed into treaty-defined bilateral relations (iii) Expounding the seal confiding in each empire’s daily governing routines, and annotating the trust in the seal as a quested promise from the opponent negotiator to fulfill the treaty terms (iv) Contrasting the two seal traditions along two civilization-lines, Eastern vs. Western, and dissecting how the two styles of seal emblems affected the cross-cultural understanding or misunderstanding between the two empires (v) Comprehending the history-making events from the substantial resources such as the treaty seals, and grasping why the seals for the two treaties, so different in both visual design and symbolic value, were chosen in the two relationship eras (vi) Correlating the materialized seal 'expression' and the imperial worldviews based on each empire’s national/or power identity, and probing the seal-represented 'rule under the Heaven' assumption of China and Russian rising role in 'European-American imperialism … centered on East Asia' (Victor Shmagin, 2020). In conclusion, the impact of official seals on diplomatic treaties needs profound knowledge in seal history, insignia culture, and emblem belief to be able to comprehend. The official seals in both Imperial Russia and Qing China belonged to a particular statecraft art in a specific material and visual form. Once utilized in diplomatic treaties, the meticulously decorated and politically institutionalized seals were transformed from the determinant means for domestic administration and social control into the markers of an empire’s sovereign authority. Overlooked in historical practice, the insignia seal created a wire of 'visual contest' between the two rival powers. Through this material lens, the scholarly knowledge of the Russian-Qing diplomatic relationship will be significantly upgraded. Connecting Russian studies, Qing/Chinese studies, and Eurasian studies, this study also ties material culture, political culture, and diplomatic culture together. It promotes the study of official seals and emblem symbols in worldwide diplomatic history.

Keywords: Russia-Qing diplomatic relation, Treaty of Beijing (1860), Treaty of Nerchinsk (1689), Treaty seals

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Authors: Farid Arya, Trevor Hyde

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The development of vacuum glazing represents a significant advancement in the area of low heat loss glazing systems with the potential to substantially reduce building heating and cooling loads. Vacuum glazing consists of two or more glass panes hermetically sealed together around the edge with a vacuum gap between the panes. To avoid the glass panes from collapsing and touching each other under the influence of atmospheric pressure an array of support pillars is provided between the glass panes. A high level of thermal insulation is achieved by evacuating the spaces between the glass panes to a very low pressure which greatly reduces conduction and convection within the space; therefore heat transfer through this kind of glazing is significantly lower when compared with conventional insulating glazing. However, vacuum glazing is subject to inherent stresses due to atmospheric pressure and temperature differentials which can lead to fracture of the glass panes and failure of the edge seal. A flexible edge seal has been proposed to minimise the impact of these issues. In this paper, vacuum glazing system with rigid and flexible edge seals is theoretically studied and their advantages and disadvantages are discussed.

Keywords: flexible edge seal, stress, support pillar, vacuum glazing

Procedia PDF Downloads 195

Authors: D. O. Ramadan, R. S. Dwyer-Joyce

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The measurement of the interface conditions in a cutting tool contact is essential information for performance monitoring and control. This interface provides the path for the heat flux to the cutting tool. This elevate in the cutting tool temperature leads to motivate the mechanism of tool wear, thus affect the life of the cutting tool and the productivity. This zone is representative by the tool-chip interface. Therefore, understanding and monitoring this interface is considered an important issue in machining. In this paper, an acoustic emission (AE) technique was used to find the correlation between AE parameters and the tool-chip interface. For this reason, a response surface design (RSD) has been used to analyse and optimize the machining parameters. The experiment design was based on the face centered, central composite design (CCD) in the Minitab environment. According to this design, a series of orthogonal cutting experiments for different cutting conditions were conducted on a Triumph 2500 lathe machine to study the sensitivity of the acoustic emission (AE) signal to change in tool-chip contact length. The cutting parameters investigated were the cutting speed, depth of cut, and feed and the experiments were performed for 6082-T6 aluminium tube. All the orthogonal cutting experiments were conducted unlubricated. The tool-chip contact area was investigated using a scanning electron microscope (SEM). The results obtained in this paper indicate that there is a strong dependence of the root mean square (RMS) on the cutting speed, where the RMS increases with increasing the cutting speed. A dependence on the tool-chip contact length has been also observed. However there was no effect observed of changing the cutting depth and feed on the RMS. These dependencies have been clarified in terms of the strain and temperature in the primary and secondary shear zones, also the tool-chip sticking and sliding phenomenon and the effect of these mechanical variables on dislocation activity at high strain rates. In conclusion, the acoustic emission technique has the potential to monitor in situ the tool-chip interface in turning and consequently could indicate the approaching end of life of a cutting tool.

Keywords: Acoustic emission, tool-chip interface, orthogonal cutting, monitoring

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Authors: Laura Boschis, Elena D. Ozzello, Enzo Mastromatteo

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Point of care diagnostic finds growing interest in medicine and agri-food because of faster intervention and prevention. EliChip is a microfluidic platform to perform Point of Care immunoenzymatic assay based on ready-to-use kits and a portable instrument to manage fluidics and read reliable quantitative results. Thanks to miniaturization, analyses are faster and more sensible than conventional ELISA. EliChip is one of the crucial assets of the Europen-founded Flamingo project for in-line measuring inflammatory markers.

Keywords: lab on chip, point of care, immunoenzymatic analysis, synovial arthritis

Procedia PDF Downloads 139

Authors: Junior Nomani

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This paper presents a novel approach to modelling the metal cutting of duplex stainless steels, a two-phase alloy regarded as a difficult-to-machine material. Calculation and control of shear strain and stresses during cutting are essential to achievement of ideal cutting conditions. Too low or too high leads to higher required cutting force or excessive heat generation causing premature tool wear failure. A 2D finite element cutting model was created based on electron backscatter diffraction (EBSD) data imagery of duplex microstructure. A mesh was generated using ‘object-oriented’ software OOF2 version V2.1.11, converting microstructural images to quadrilateral elements. A virtual workpiece was created on ABAQUS modelling software where a rigid body toolpiece advanced towards workpiece simulating chip formation, generating serrated edge chip formation cutting. Model results found calculated stress strain contour plots correlated well with similar finite element models tied with austenite stainless steel alloys. Virtual chip form profile is also similar compared experimental frozen machining chip samples. The output model data provides new insight description of strain behavior of two phase material on how it transitions from workpiece into the chip.

Keywords: Duplex stainless steel, ABAQUS, OOF2, Chip formation

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Authors: Zhao Bin, Yan Dan Lei

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In this paper, a multi-pattern parallel PRBS generator and a dedicated parallel BER tester is proposed for the 8-Gbps On-chip interconnection testing. A unique full-parallel PRBS checker is also proposed. The proposed design, together with the custom-designed high-speed parallel-to-serial and the serial-to-parallel circuit, will be used to test different on-chip interconnection transceivers. The design is implemented in TSMC 28nm CMOS technology with working voltage at 1.0 V. The serial to parallel ratio is 8:1 so the parallel PRBS generation and BER Tester can be run at lower speed.

Keywords: PRBS, BER, high speed, generator

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Authors: T. Punjansing, M. Nakkuntod, S. Homchan, P. Inthima, A. Kongbangkerd

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The influence of organic supplements on growth and multiplication efficiency of Phaius tankervilleae var. alba seedlings was investigated. 12 week-old seedlings were cultured on half-strength semi-solid Murashige and Skoog (MS) medium supplemented with 30 g/L sucrose, 8 g/L agar and various concentrations of coconut water (0, 50, 100, 150 and 200 mL/L) combined with potato extract (0, 25 and 50 g/L) and the pH was adjusted to 5.8 prior to autoclaving. The cultures were then kept under constant photoperiod (16 h light: 8 h dark) at 25 ± 2 °C for 12 weeks. The highest number of shoots (3.0 shoots/explant) was obtained when cultured on the medium added with 50 ml/L coconut water and 50 g/L potato extract whereas the highest number of leaves (5.9 leaves/explant) and roots (6.1 roots/explant) could receive on the medium supplemented with 150 ml/L coconut water and 50 g/L potato extract. with 150 ml/L coconut water and 50 g/L potato extract. Additionally, plantlets of P. tankervilleae var. alba were transferred to grow into seven different substrates i.e. soil, sand, coconut husk chip, soil-sand mix (1: 1), soil-coconut husk chip mix (1: 1), sand-coconut husk chip mix (1: 1) and soil-sand-coconut husk chip mix (1: 1: 1) for four weeks. The results found that acclimatized plants showed 100% of survivals when sand, coconut husk chip and sand-coconut husk chip mix are used as substrates. The number of leaves induced by sand-coconut husk chip mix was significantly higher than that planted in other substrates (P > 0.05). Meanwhile, no significant difference in new shoot formation among these substrates was observed (P < 0.05). This precursory developing protocol was likely to be applied for more large scale of plant production as well as conservation of germplasm of this orchid species.

Keywords: organic supplements, acclimatization, Phaius tankervilleae var. alba, orchid

Procedia PDF Downloads 189

Authors: Anil Kawan, Soon Jae Yu, Jong Min Park

Abstract:

GaN-based 365 nm wavelength ultraviolet (UV) light emitting diodes (LED) have various applications: curing, molding, purification, deodorization, and disinfection etc. However, their usage is limited by very low output power, because of the light absorption in the GaN layers. In this study, we demonstrate a method utilizing removal of 365 nm absorption layer buffer GaN and thinning the n-type GaN so as to improve the light extraction efficiency of the GaN-based 365 nm UV LED. The UV flip chip LEDs of chip size 1.3 mm x 1.3 mm were fabricated using GaN epilayers on a sapphire substrate. Via-hole n-type contacts and highly reflective Ag metal were used for efficient light extraction. LED wafer was aligned and bonded to AlN carrier wafer. To improve the extraction efficiency of the flip chip LED, sapphire substrate and absorption layer buffer GaN were removed by using laser lift-off and dry etching, respectively. To further increase the extraction efficiency of the LED, exposed n-type GaN thickness was reduced by using inductively coupled plasma etching.

Keywords: extraction efficiency, light emitting diodes, n-GaN thinning, ultraviolet

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