Commenced in January 2007
Frequency: Monthly
Edition: International
Paper Count: 4

Search results for: Electronics cooling

4 Localized and Time-Resolved Velocity Measurements of Pulsatile Flow in a Rectangular Channel

Authors: R. Blythman, N. Jeffers, T. Persoons, D. B. Murray

Abstract:

The exploitation of flow pulsation in micro- and mini-channels is a potentially useful technique for enhancing cooling of high-end photonics and electronics systems. It is thought that pulsation alters the thickness of the hydrodynamic and thermal boundary layers, and hence affects the overall thermal resistance of the heat sink. Although the fluid mechanics and heat transfer are inextricably linked, it can be useful to decouple the parameters to better understand the mechanisms underlying any heat transfer enhancement. Using two-dimensional, two-component particle image velocimetry, the current work intends to characterize the heat transfer mechanisms in pulsating flow with a mean Reynolds number of 48 by experimentally quantifying the hydrodynamics of a generic liquid-cooled channel geometry. Flows circulated through the test section by a gear pump are modulated using a controller to achieve sinusoidal flow pulsations with Womersley numbers of 7.45 and 2.36 and an amplitude ratio of 0.75. It is found that the transient characteristics of the measured velocity profiles are dependent on the speed of oscillation, in accordance with the analytical solution for flow in a rectangular channel. A large velocity overshoot is observed close to the wall at high frequencies, resulting from the interaction of near-wall viscous stresses and inertial effects of the main fluid body. The steep velocity gradients at the wall are indicative of augmented heat transfer, although the local flow reversal may reduce the upstream temperature difference in heat transfer applications. While unsteady effects remain evident at the lower frequency, the annular effect subsides and retreats from the wall. The shear rate at the wall is increased during the accelerating half-cycle and decreased during deceleration compared to steady flow, suggesting that the flow may experience both enhanced and diminished heat transfer during a single period. Hence, the thickness of the hydrodynamic boundary layer is reduced for positively moving flow during one half of the pulsation cycle at the investigated frequencies. It is expected that the size of the thermal boundary layer is similarly reduced during the cycle, leading to intervals of heat transfer enhancement.

Keywords: Heat transfer enhancement, particle image velocimetry, localized and time-resolved velocity, photonics and electronics cooling, pulsating flow, Richardson’s annular effect.

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3 Influence of Gravity on the Performance of Closed Loop Pulsating Heat Pipe

Authors: Vipul M. Patel, H. B. Mehta

Abstract:

Closed Loop Pulsating Heat Pipe (CLPHP) is a passive two-phase heat transfer device having potential to achieve high heat transfer rates over conventional cooling techniques. It is found in electronics cooling due to its outstanding characteristics such as excellent heat transfer performance, simple, reliable, cost effective, compact structure and no external mechanical power requirement etc. Comprehensive understanding of the thermo-hydrodynamic mechanism of CLPHP is still lacking due to its contradictory results available in the literature. The present paper discusses the experimental study on 9 turn CLPHP. Inner and outer diameters of the copper tube are 2 mm and 4 mm respectively. The lengths of the evaporator, adiabatic and condenser sections are 40 mm, 100 mm and 50 mm respectively. Water is used as working fluid. The Filling Ratio (FR) is kept as 50% throughout the investigations. The gravitational effect is studied by placing the evaporator heater at different orientations such as horizontal (90 degree), vertical top (180 degree) and bottom (0 degree) as well as inclined top (135 degree) and bottom (45 degree). Heat input is supplied in the range of 10-50 Watt. Heat transfer mechanism is natural convection in the condenser section. Vacuum pump is used to evacuate the system up to 10-5 bar. The results demonstrate the influence of input heat flux and gravity on the thermal performance of the CLPHP.

Keywords: Closed loop pulsating heat pipe, gravity, heat input, orientation.

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2 Numerical Optimization of Pin-Fin Heat Sink with Forced Cooling

Authors: Y. T. Yang, H. S. Peng, H. T. Hsu

Abstract:

This study presents the numerical simulation of optimum pin-fin heat sink with air impinging cooling by using Taguchi method. 9 L ( 4 3 ) orthogonal array is selected as a plan for the four design-parameters with three levels. The governing equations are discretized by using the control-volume-based-finite-difference method with a power-law scheme on the non-uniform staggered grid. We solved the coupling of the velocity and the pressure terms of momentum equations using SIMPLEC algorithm. We employ the k −ε two-equations turbulence model to describe the turbulent behavior. The parameters studied include fin height H (35mm-45mm), inter-fin spacing a , b , and c (2 mm-6.4 mm), and Reynolds number ( Re = 10000- 25000). The objective of this study is to examine the effects of the fin spacings and fin height on the thermal resistance and to find the optimum group by using the Taguchi method. We found that the fin spacings from the center to the edge of the heat sink gradually extended, and the longer the fin’s height the better the results. The optimum group is 3 1 2 3 H a b c . In addition, the effects of parameters are ranked by importance as a , H , c , and b .

Keywords: Heat sink, Optimum, Electronics cooling, CFD.

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1 Flat Miniature Heat Pipes for Electronics Cooling: State of the Art, Experimental and Theoretical Analysis

Authors: M.C. Zaghdoudi, S. Maalej, J. Mansouri, M.B.H. Sassi

Abstract:

An experimental study is realized in order to verify the Mini Heat Pipe (MHP) concept for cooling high power dissipation electronic components and determines the potential advantages of constructing mini channels as an integrated part of a flat heat pipe. A Flat Mini Heat Pipe (FMHP) prototype including a capillary structure composed of parallel rectangular microchannels is manufactured and a filling apparatus is developed in order to charge the FMHP. The heat transfer improvement obtained by comparing the heat pipe thermal resistance to the heat conduction thermal resistance of a copper plate having the same dimensions as the tested FMHP is demonstrated for different heat input flux rates. Moreover, the heat transfer in the evaporator and condenser sections are analyzed, and heat transfer laws are proposed. In the theoretical part of this work, a detailed mathematical model of a FMHP with axial microchannels is developed in which the fluid flow is considered along with the heat and mass transfer processes during evaporation and condensation. The model is based on the equations for the mass, momentum and energy conservation, which are written for the evaporator, adiabatic, and condenser zones. The model, which permits to simulate several shapes of microchannels, can predict the maximum heat transfer capacity of FMHP, the optimal fluid mass, and the flow and thermal parameters along the FMHP. The comparison between experimental and model results shows the good ability of the numerical model to predict the axial temperature distribution along the FMHP.

Keywords: Electronics Cooling, Micro Heat Pipe, Mini Heat Pipe, Mini Heat Spreader, Capillary grooves.

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