Search results for: printed heat circuits

Authors: Cam Minh Tri Tien, Richard Fenrich, Tristan Shelley, Nam Mai-Duy, Allan Malano, Xuesen Zeng

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Since additive manufacturing is a layer-by-layer deposition approach, good bonding quality between adjacent layers is critically important to achieve optimal mechanical performance, including applications in pressure vessels. The need to enhance the strength of printed products, especially in the build direction where layup gaps and voids exist between the printed layers, has garnered significant attention. The proposed research will focus on improving the current Fused Deposition Modelling (FDM) process to produce polymers reinforced with chopped fibers, utilizing a controlled heat zone to enhance the adhesion between printed layers. Energy will be applied to both printed and printing layers to improve the bonding strength between adjacent layers. Through the enhanced FDM process, the mechanical performance of composite parts will experience a substantial improvement, particularly in the build direction, as compared to current FDM methods. A combination of experimental, numerical, and analytical methods will be employed to demonstrate the enhanced performance of heat-controlled 3D printed parts.

Keywords: 3D Printing, pressure vessels, interlayer bonding, controlled heat

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Authors: Ahmed Moulay, Mariia Zhuldybina, Mirko Torres, Mike Rozel, Ngoc Duc Trinh, Chloé Bois

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Hybrid printed electronics technology (HPE) provides innovative opportunities to enhance conventional electronics applications, which are often based on printed circuit boards (PCB). By combining the best of both performance from conventional electronic components and the flexibility from printed circuits makes it possible to manufacture HPE at high volumes using roll-to-roll printing processes. However, several challenges must be overcome in order to accurately integrate an electronic component on a printed circuit. In this presentation, we will demonstrate the integration process of electronic components from the lab scale to the industrialization. Both the printing quality and the integration technique must be studied to define the optimal conditions. To cover the parameters that influence the print quality of the printed circuit, different printing processes, flexible substrates, and conductive inks will be used to determine the optimized printing process/ink/substrate system. After the systems is selected, an electronic component of 2.5 mm2 chip size will be integrated to validate the functionality of the printed, electronic circuit. Critical information such as the conductive adhesive, the curing conditions, and the chip encapsulation will be determined. Thanks to these preliminary results, we are able to demonstrate the chip integration on a printed circuit using industrial equipment, showing the potential of industrialization, compatible using roll-to-roll printing and integrating processes.

Keywords: flat bed screen-printing, hybrid printed electronics, integration, large-scale production, roll-to-roll printing, rotary screen printing

Procedia PDF Downloads 175

Authors: Joana Pimenta, Lorena Coelho, José Silva, Vanessa Miranda, Jorge Laranjeira, Rui Soares

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In this paper, the results of R&D on an innovative food package for increased shelf-life are presented. SAP4MA aims at the development of a printed active device that enables smart packaging solutions for food preservation, targeting the extension of the shelf-life of the packed food through the controlled release of active natural antioxidant agents at the onset of the food degradation process. To do so, SAP4MA focuses on the development of active devices such as printed heaters and batteries/supercapacitors in a label format to be integrated on packaging lids during its injection molding process, promoting the passive release of natural antioxidants after the product is packed, during transportation and in the shelves, and actively when the end-user activates the package, just prior to consuming the product at home. When the active device present on the lid is activated, the release of the natural antioxidants embedded in the inner layer of the packaging lid in direct contact with the headspace atmosphere of the food package starts. This approach is based on the use of active functional coatings composed of nano encapsulated active agents (natural antioxidants species) in the prevention of the oxidation of lipid compounds in food by agents such as oxygen. Thus keeping the product quality during the shelf-life, not only when the user opens the packaging, but also during the period from food packaging up until the purchase by the consumer. The active systems that make up the printed smart label, heating circuit, and battery were developed using screen-printing technology. These systems must operate under the working conditions associated with this application. The printed heating circuit was studied using three different substrates and two different conductive inks. Inks were selected, taking into consideration that the printed circuits will be subjected to high pressures and temperatures during the injection molding process. The circuit must reach a homogeneous temperature of 40ºC in the entire area of the lid of the food tub, promoting a gradual and controlled release of the antioxidant agents. In addition, the circuit design involves a high level of study in order to guarantee maximum performance after the injection process and meet the specifications required by the control electronics component. Furthermore, to characterize the different heating circuits, the electrical resistance promoted by the conductive ink and the circuit design, as well as the thermal behavior of printed circuits on different substrates, were evaluated. In the injection molding process, the serpentine-shaped design developed for the heating circuit was able to resolve the issues connected to the injection point; in addition, the materials used in the support and printing had high mechanical resistance against the pressure and temperature inherent to the injection process. Acknowledgment: This research has been carried out within the Project “Smart and Active Packing for Margarine Product” (SAP4MA) running under the EURIPIDES Program being co-financed by COMPETE 2020 – the Operational Programme for Competitiveness and Internationalization and under Portugal 2020 through the European Regional Development Fund (ERDF).

Keywords: smart package, printed heat circuits, printed batteries, flexible and printed electronic

Procedia PDF Downloads 108

Authors: Xiaohui Wang, Liwei Sun, Guilin Zhang

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Printed circuit board (PCB) is the carrier of electronic components. Its coating is the first barrier for protecting itself. If the coating is damaged, the performance of printed circuit board will decrease rapidly until failure. Therefore, the coating plays an important role in the entire printed circuit board. There are common four kinds of coating of printed circuit board that the material of the coatings are paryleneC, acrylic, polyurethane, silicone. In this paper, we designed an accelerated degradation test of humid and heat for these four kinds of coating. And chose insulation resistance, moisture absorption and surface morphology as its test indexes. By comparing the change of insulation resistance of the coating before and after the test, we estimate failure time of these coatings based on the degradation of insulation resistance. Based on the above, we estimate the service life of the four kinds of PCB.

Keywords: printed circuit board, life assessment, insulation resistance, coating material

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Authors: Florian Kleber, Martin Kampel

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The increasing demand of gallium, indium and rare-earth elements for the production of electronics, e.g. solid state-lighting, photovoltaics, integrated circuits, and liquid crystal displays, will exceed the world-wide supply according to current forecasts. Recycling systems to reclaim these materials are not yet in place, which challenges the sustainability of these technologies. This paper proposes a multispectral imaging system as a basis for a vision based recognition system for valuable components of electronics waste. Multispectral images intend to enhance the contrast of images of printed circuit boards (single components, as well as labels) for further analysis, such as optical character recognition and entire printed circuit board recognition. The results show that a higher contrast is achieved in the near infrared compared to ultraviolet and visible light.

Keywords: electronics waste, multispectral imaging, printed circuit boards, rare-earth elements

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Authors: Li Guoyou, Zhang Tao, Ji Wenzhan, Huo Liang, Lin Xiqiang, Zhang Nan

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The three dimensional (3D) printing technology has undergone rapid development in the last few years and it is possible to print engineering structures. 3D printing buildings use wastes from constructions, industries and mine tailings as “ink”, and mix it with property improved materials, such as cement, fiber etc. This paper presents a study of the Thermodynamic performance of 3D printed walls using cement and steel slag powder. Analyses the thermal simulation regarding 3D printed walls and solid brick wall by the way of the hot-box methods and the infrared technology, and the results were contrasted with theoretical calculation. The results show that the excellent thermodynamic performance of 3D printed concrete wall made it suitable as the partial materials for self-thermal insulation walls in residential buildings. The thermodynamic performance of 3D printed concrete walls depended on the density of materials, distribution of holes, and the filling materials. Decreasing the density of materials, increasing the number of holes or replacing the filling materials with foamed concrete could improve its thermodynamic performance significantly. The average of heat transfer coefficient and thermal inertia index of 3D printed steel slag powder concrete wall all better than the traditional solid brick wall with a thickness of 240mm.

Keywords: concrete, 3D printed walls, thermodynamic performance, steel slag powder

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Authors: Wieslaw Marszalek, Zdzislaw Trzaska

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Interesting properties of various one-period loops of singularly perturbed memristive circuits with mixed-mode oscillations (MMOs) are analyzed in this paper. The analysis is mixed, both analytical and numerical and focused on the properties of pinched hysteresis of the memristive element and other one-period loops formed by pairs of time-series solutions for various circuits' variables. The memristive element is the only nonlinear element in the two circuits. A theorem on periods of mixed-mode oscillations of the circuits is formulated and proved. Replacements of memristors by parallel G-C or series R-L circuits for a MMO response with equivalent RMS values is also discussed.

Keywords: mixed-mode oscillations, memristive circuits, pinched hysteresis, one-period loops, singularly perturbed circuits

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Authors: Ashish Mahalle, Kishore Borakhade

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High porosity metal foams are excellent for heat dissipation. There use has been widened to include heat removal from high density microelectronics circuits. Other important applications have been found in compact heat exchangers for airborne equipment, regenerative and dissipative air cooled condenser towers, and compact heat sinks for power electronic. The low relative density, open porosity and high thermal conductivity of the cell edges, large accessible surface area per unit volume, and the ability to mix the cooling fluid make metal foam heat exchangers efficient, compact and light weight. This paper reports the thermal performance of metal foam for high heat dissipation. In experimentation metal foam samples of different pore diameters i.e. 35 µ, 20 µ, 12 µ, are analyzed for varying velocities and heat inputs. The study investigate the effect of various dimensionless no. like Re,Nu, Pr and heat transfer characteristics of basic flow configuration.

Keywords: pores, foam, effective thermal conductivity, permeability

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Authors: Eman Helal, Ahmed M. Esmat

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Statement of problem: The development of computer-aided design/computer-aided manufacturing (CAD/CAM) resin dentures has simplified complete denture production. Most of the studies evaluated the mechanical properties of the material, but the hygienic performance of the CAD /CAM denture and their ability to maintain clean surfaces and minimize bacterial accumulation is still lacking. Purpose evaluation of the antibacterial characteristics of the 3D printed CAD/CAM denture and to compare it with the conventional heat polymerized acrylic denture base material. Methodology a total of thirty completely edentulous patients grouped randomly into two groups (Group I: Control group) received conventional heat polymerized acrylic resin complete dentures, (Group II: Test group) received 3D printed (CAD/CAM) dentures (stereolithographic PMMA), Samples of Candida albicans culture swabs were taken after 1 month and 3 months of dentures` insertion. A culture swab was obtained by scrubbing the fitting surface of the upper denture. At each time interval, three swab samples were collected from each patient and were inoculated in three individual culture media. Results: there was a significant difference in the colonization of Candida albicans to the fitting surface of the dentures between both groups (Group I: Conventional denture cases) exhibited more adhesion of Candida Albicans to the fitting surface than did (Group II: CAD/CAM cases) (P<0.05). Conclusion: 3D printed CAD/CAM complete denture showed minimal Candida adherence upon upper denture fitting compared to conventional heat-polymerized acrylic resin, which contributes to decreasing the incidence of denture stomatitis which is considered one of the most common problems among complete denture wearers.

Keywords: CAD/CAM denture, completely edentulous, elderly patients, 3D printing, antimicrobial efficiency, conventional denture, PMMA, Candida Albicans, denture stomatitis

Procedia PDF Downloads 139

Authors: Simona Ziukaite, Remigijus Ivanauskas, Gintaras Denafas

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Market development of electrical and electronic equipment and a short life cycle is driven by the increasing waste streams. Gold Au, copper Cu, silver Ag and palladium Pd can be found on printed circuit board. These metals make up the largest value of printed circuit board. Therefore, the printed circuit boards scrap is valuable as potential raw material for precious metals recovery. A comparison of Cu, Au, Ag, Pd recovery from waste printed circuit techniques was selected metals leaching of chemical reagents. The study was conducted using the selected multistage technique for Au, Cu, Ag, Pd recovery of printed circuit board. In the first and second metals leaching stages, as the elution reagent, 2M H2SO4 and H2O2 (35%) was used. In the third stage, leaching of precious metals used solution of 20 g/l of thiourea and 6 g/l of Fe2 (SO4)3. Verify the efficiency of the method was carried out the metals leaching test with aqua regia. Based on the experimental study, the leaching efficiency, using the preferred methodology, 60 % of Au and 85,5 % of Cu dissolution was achieved. Metals leaching efficiency after waste mechanical crushing and thermal treatment have been increased by 1,7 times (40 %) for copper, 1,6 times (37 %) for gold and 1,8 times (44 %) for silver. It was noticed that, the Au amount in old (> 20 years) waste is 17 times more, Cu amount - 4 times more, and Ag - 2 times more than in the new (< 1 years) waste. Palladium in the new printed circuit board waste has not been found, however, it was established that from 1 t of old printed circuit board waste can be recovered 1,064 g of Pd (leaching with aqua regia). It was found that from 1 t of old printed circuit board waste can be recovered 1,064 g of Ag. Precious metals recovery in Lithuania was estimated in this study. Given the amounts of generated printed circuit board waste, the limits for recovery of precious metals were identified.

Keywords: leaching efficiency, limits for recovery, precious metals recovery, printed circuit board waste

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Authors: Alexander Kospach, Fabian Benezeder, Jürgen Abraham

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E-mobility poses new challenges for inverters (e.g., higher switching frequencies) in terms of thermal behavior and thermal management. Due to even higher switching frequencies, thermal losses become greater, and the cooling of critical components (like insulated gate bipolar transistor and diodes) comes into focus. New manufacturing methods, such as 3D printing, enable completely new pin-fin structures that can handle higher waste heat to meet the new thermal requirements. Based on the geometrical specifications of the industrial partner regarding the manufacturing possibilities for 3D printing, different and completely new pin-fin structures were numerically investigated for their hydraulic and thermal behavior in fundamental studies assuming an indirect liquid cooling. For the 3D computational fluid dynamics (CFD) thermal simulations OpenFOAM was used, which has as numerical method the finite volume method for solving the conjugate heat transfer problem. A steady-state solver for turbulent fluid flow and solid heat conduction with conjugate heat transfer between solid and fluid regions was used for the simulations. In total, up to fifty pinfin structures and arrangements, some of them completely new, were numerically investigated. On the basis of the results of the principal investigations, the best two pin-fin structures and arrangements for the complete module cooling of an automotive inverter were numerically investigated and compared. There are clear differences in the maximum temperatures for the critical components, such as IGTBs and diodes. In summary, it was shown that 3D pin fin structures can significantly contribute to the improvement of heat transfer and cooling of an automotive inverter. This enables in the future smaller cooling designs and a better lifetime of automotive inverter modules. The new pin fin structures and arrangements can also be applied to other cooling applications where 3D printing can be used.

Keywords: pin fin heat sink optimization, 3D printed pin fins, CFD simulation, power electronic cooling, thermal management

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Authors: A. Kampker, K. Kreisköther, C. Reinders

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Since additive manufacturing technologies constantly advance, the use of this technology in mold making seems reasonable. Many manufacturers of additive manufacturing machines, however, do not offer any suggestions on how to parameterize the machine to achieve optimal results for mold making. The purpose of this research is to determine the interdependencies of different materials and parameters within the PolyJet process by using design of experiments (DoE), to additively manufacture molds, e.g. for thermoforming and injection molding applications. Therefore, the general requirements of thermoforming molds, such as heat resistance, surface quality and hardness, have been identified. Then, different materials and parameters of the PolyJet process, such as the orientation of the printed part, the layer thickness, the printing mode (matte or glossy), the distance between printed parts and the scaling of parts, have been examined. The multifactorial analysis covers the following properties of the printed samples: Tensile strength, tensile modulus, bending strength, elongation at break, surface quality, heat deflection temperature and surface hardness. The key objective of this research is that by joining the results from the DoE with the requirements of the mold making, optimal and tailored molds can be additively manufactured with the PolyJet process. These additively manufactured molds can then be used in prototyping processes, in process testing and in small to medium batch production.

Keywords: additive manufacturing, design of experiments, mold making, PolyJet, 3D-Printing

Procedia PDF Downloads 255

Authors: Jinyoung Kim, Jinuk Kwon, Haksoo Han

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Polyimide is widely used in electronic industries, and heat dissipation of polyimide film is important for its application in electric devices for high-temperature resistance heat dissipation film. In this study, we demonstrated a new way to increase heat dissipating rate by adding carbon black as filler. This type of polyimide composite film was produced by pyromellitic dianhydride (PMDA) and 4,4’-oxydianiline (ODA). Carbon black (CB) is added in different loading, shows increasing heat dissipation rate for increase of Carbon black. The polyimide-carbon black composite film is synthesized with high dissipation rate to ~8W∙m−1K−1. Its high thermal decomposition temperature and glass transition temperature were maintained with carbon filler verified by thermogravimetric analysis (TGA) and differential scanning calorimetric (DSC), the polyimidization reaction of polyi(amide-mide) was confirmed by Fourier transform infrared spectroscopy (FT-IR). The polyimide composite film with carbon black with high heat dissipating rate could be used in various applications such as computers, mobile phone industries, integrated circuits, coating materials, semiconductor etc.

Keywords: polyimide, heat dissipation, electric device, filler

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Authors: Loubna Tani, Nabih Elouzzani

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Crosstalk among interconnects and printed-circuit board (PCB) traces is a major limiting factor of signal quality in high-speed digital and communication equipments especially when fast data buses are involved. Such a bus is considered as a planar multiconductor transmission line. This paper will demonstrate how the finite difference time domain (FDTD) method provides an exact solution of the transmission-line equations to analyze the near end and the far end crosstalk. In addition, this study makes it possible to analyze the rise time effect on the near and far end voltages of the victim conductor. The paper also discusses a statistical analysis, based upon a set of several simulations. Such analysis leads to a better understanding of the phenomenon and yields useful information.

Keywords: multiconductor transmission line, crosstalk, finite difference time domain (FDTD), printed-circuit board (PCB), rise time, statistical analysis

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Authors: J. Hajri, H. Hrizi, N. Sboui, H. Baudrand

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This paper presents a study of SIW circuits (Substrate Integrated Waveguide) with a rigorous and fast original approach based on Iterative process (WCIP). The theoretical suggested study is validated by the simulation of two different examples of SIW circuits. The obtained results are in good agreement with those of measurement and with software HFSS.

Keywords: convergence study, HFSS, modal decomposition, SIW circuits, WCIP method

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Authors: Ariangelo Hauer Dias Filho, Gustavo Antoniácomi de Carvalho, Benjamim de Melo Carvalho

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The work´s purpose was to evaluate the possibility of manufacturing casting tools utilizing Fused Filament Fabrication, a 3D printing technique, without any post-processing on the printed part. Taguchi Orthogonal array was used to evaluate the influence of extrusion temperature, bed temperature, layer height, and infill on the dimensional accuracy of a 3D-Printed Polymer Model. A Zeiss T-SCAN CS 3D Scanner was used for dimensional evaluation of the printed parts within the limit of ±0,2 mm. The mold capabilities were tested with the printed model to check how it would interact with the green sand. With little adjustments in the 3D model, it was possible to produce rapid tools without the need for post-processing for iron casting. The results are important for reducing time and cost in the development of such tools.

Keywords: additive manufacturing, Taguchi method, rapid tooling, fused filament fabrication, casting mold

Procedia PDF Downloads 141

Authors: Shiang-Hwua Yu, Po-Hsun Wu

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This study introduces two types of self-oscillating circuits that are frequently found in power electronics applications. Special effort is made to relate the circuits to the analogous mechanical systems of some important scientific inventions: Galileo’s pendulum clock and Coulomb’s friction model. A little touch of related history and philosophy of science will hopefully encourage curiosity, advance the understanding of self-oscillating systems and satisfy the aspiration of some students for scientific literacy. Finally, the two self-oscillating circuits are applied to design a simple class-D audio amplifier.

Keywords: self-oscillation, sigma-delta modulator, pendulum clock, Coulomb friction, class-D amplifier

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Authors: Mohamad Baqer Heidari, Hefzollah.Mohammadian

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This brief presents two original implementations of improved accuracy current-mode multiplier/divider circuits. Besides the advantage of their simplicity, these original multiplier/divider structures present the advantage of very small linearity errors that can be obtained as a result of the proposed design techniques (0.75% and 0.9%, respectively, for an extended range of the input currents). The original multiplier/divider circuits permit a facile reconfiguration, the presented structures representing the functional basis for implementing complex function synthesizer circuits. The proposed computational structures are designed for implementing in 0.18-µm CMOS technology, with a low-voltage operation (a supply voltage of 1.2 V). The circuits’ power consumptions are 60 and 75 µW, respectively, while their frequency bandwidths are 79.6 and 59.7 MHz, respectively.

Keywords: analog signal processing, current-mode operation, functional core, multiplier, reconfigurable circuits, industrial package systems

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Authors: Afsha Shaikh, Mohammed Azizur Rahman, Ibrahim Hassan, Mayur Pal

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Student engagement in learning is instantly affected by the sources of learning methods available for them, such as videos showing the applications of the concept or showing a practical demonstration. Specific to the engineering discipline, there exist enormous challenging concepts that can be simplified when they are connected to real-world scenarios. For this study, the concept of heat exchangers was used as it is a part of multidisciplinary engineering fields. To make the learning experience enjoyable and impactful, 3-D printed heat exchanger models were created for students to use while working on in-class activities and assignments. Students were encouraged to use the 3-D printed heat exchanger models to enhance their understanding of theoretical concepts associated with its applications. To assess the effectiveness of the method, feedback was received by students pursuing undergraduate engineering via an anonymous electronic survey. To make the feedback more realistic, unbiased, and genuine, students spent nearly two to three weeks using the models in their in-class assignments. The impact of these tools on their learning was assessed through their performance in their ungraded assignments as well as their interactive discussions with peers. ‘Having to apply the theory learned in class whilst discussing with peers on a class assignment creates a relaxed and stress-free learning environment in classrooms’; this feedback was received by more than half the students who took the survey and found 3-D models of heat exchanger very easy to use. Amongst many ways to enhance learning and make students more engaged through interactive models, this study sheds light on the importance of physical tools that help create a lasting mental representation in the minds of students. Moreover, in this technologically enhanced era, the concept of augmented reality was considered in this research. E-drawings application was recommended to enhance the vision of engineering students so they can see multiple views of the detailed 3-D models and cut through its different sides and angles to visualize it properly. E-drawings could be the next tool to implement in classrooms to enhance students’ understanding of engineering concepts.

Keywords: student engagement, life-long-learning, visual demonstration, 3-D printed models, engineering education

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Authors: Hasan Çiçekli, Ahmet Gökçen, Uğur Çam

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In this paper, a comparative performance analysis of mostly used four nonlinearity cancellation techniques used to realize the passive resistor by MOS transistors is presented. The comparison is done by using an integrator circuit which is employing sequentially Op-amp, OTRA and ICCII as active element. All of the circuits are implemented by MOS-C realization and simulated by PSPICE program using 0.35 µm process TSMC MOSIS model parameters. With MOS-C realization, the circuits became electronically tunable and fully integrable which is very important in IC design. The output waveforms, frequency responses, THD analysis results and features of the nonlinearity cancellation techniques are also given.

Keywords: integrator circuits, MOS-C realization, nonlinearity cancellation, tuneable resistors

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Authors: Jung Hyun Kim, Gyo Woo Lee

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In this study, heat release performances of the three extruded-type heat sinks can be used in the inverter for solar power generation were evaluated. Numbers of fins in the heat sinks (namely E-38, E-47 and E-76) were 38, 47 and 76, respectively. Heat transfer areas of them were 1.8, 1.9 and 2.8 m2. The heat release performances of E-38, E-47, and E-76 heat sinks were measured as 79.6, 81.6, and 83.2%, respectively. The results of heat release performance show that the larger amount of heat transfer area the higher heat release rate. While on the other, in this experiment, variations of the mass flow rates caused by different cross-sectional areas of the three heat sinks may not be the major parameter of the heat release. Despite the 47.4% increment of heat transfer area of E-76 heat sink than that of E-47 one, its heat release rate was higher by only 2.0%; this suggests that its heat transfer area need to be optimized.

Keywords: solar Inverter, heat sink, forced convection, heat transfer, performance evaluation

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Authors: Benjamin Panreck, Manfred Hild

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Strain sensors based on a change in resistance are well established for the measurement of forces, stresses, or material fatigue. Within the scope of this paper, fully additive manufactured strain sensors were produced using an ink of silver nanoparticles. Their behavior was evaluated by periodic tensile tests. Printed strain sensors exhibit two advantages: Their measuring grid is adaptable to the use case and they do not need a carrier-foil, as the measuring structure can be printed directly onto a thin sprayed varnish layer on the aluminum specimen. In order to compare quality characteristics, the sensors have been manufactured using two different technologies, namely aerosoljet-printing and micropipette-dispensing. Both processes produce structures which exhibit continuous features (in contrast to what can be achieved with droplets during inkjet printing). Briefly summarized the results show that aerosoljet-printing is the preferable technology for specimen with non-planar surfaces whereas both technologies are suitable for flat specimen.

Keywords: aerosoljet-printing, micropipette-dispensing, printed electronics, printed sensors, strain gauge

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Authors: Peng Hao Wang, Ronald Sterkenburg, Garam Kim, Yuwei He

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As composite materials continue to gain popularity in the aerospace industry; large airframe sections made out of composite materials are becoming the standard for aerospace manufacturers. However, the heavy utilization of these composite materials also increases the importance of the recycling of these composite materials. A team of Purdue University School of Aviation and Transportation Technology (SATT) faculty and students have partnered to investigate the characteristics of 3D printed recycled carbon fiber. A prototype of a 3D printed recycled carbon fiber part was provided by an industry partner and different sections of the prototype were used to create specimens. A furnace was utilized in order to remove the polymer from the specimens and the specimen’s fiber content and fiber length was calculated from the remaining fibers. A differential scanning calorimetry (DSC) and dynamic mechanical analysis (DMA) test was also conducted on the 3D printed recycled carbon fiber prototype in order to determine the prototype’s degree of cure at different locations. The data collected from this study provided valuable information in the process improvement and understanding of 3D printed recycled carbon fiber.

Keywords: 3D printed, carbon fiber, fiber content, recycling

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Authors: A. Oukaira, A. Lakhssassi, O. Ettahri

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To make a good thermal management in an ABDM (Adapter Board Detector Module) card, we must first control temperature and its gradient from the first step in the design of integrated circuits ASIC of our complex system. In this paper, our main goal is to develop and validate the thermal stability in order to get an idea of the flow of heat around the ASIC in transient and thus address the thermal issues for integrated circuits at the ABDM card. However, we need heat sources simulations for ABDM card to establish its thermal mapping. This led us to perform simulations at each ASIC that will allow us to understand the thermal ABDM map and find real solutions for each one of our complex system that contains 36 ABDM map, taking into account the different layers around ASIC. To do a transient simulation under NISA, we had to build a function of power modulation in time TIMEAMP. The maximum power generated in the ASIC is 0.6 W. We divided the power uniformly in the volume of the ASIC. This power was applied for 5 seconds to visualize the evolution and distribution of heat around the ASIC. The DBC (Dirichlet Boundary conditions) method was applied around the ABDM at 25°C and just after these simulations in NISA tool we will validate them by COMSOL tool, wich is a numerical calculation software for a modular finite element for modeling a wide variety of physical phenomena characterizing a real problem. It will also be a design tool with its ability to handle 3D geometries for complex systems.

Keywords: ABDM, APD, thermal mapping, complex system

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Authors: Man Young Kim, Gyo Woo Lee

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In this numerical study, we want to present the design of highly efficient extruded-type heat sink. The symmetrically arranged extruded-type heat sinks are used instead of a single extruded or swaged-type heat sink. In this parametric study, the maximum temperatures, the base temperatures between heaters, and the heat release rates were investigated with respect to the arrangements of heat sources, air flow rates, and amounts of heat input. Based on the results we believe that the use of both side of heat sink is to be much better for release the heat than the use of single side. Also from the results, it is believed that the symmetric arrangement of heat sources is recommended to achieve a higher heat transfer from the heat sink.

Keywords: heat sink, forced convection, heat transfer, performance evaluation, symmetrical arrangement

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Authors: Kathaleeya Chanda

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The objectives of the research on the development of printed media for public relations of community products in Bang Khonthi District, Samut Songkram Province were to; 1) develop printed media for public relations of community products in Bang Khonthi District, Samut Songkram Province and 2) study the satisfaction towards the printed media for public relations of community products in Bang Khonthi District, Samut Songkram Province. The study was on the satisfaction focused on content, illustration, design, and quality. The sampling group of this study included 30 local community producers selected by probability sampling and simple random sampling. The research procedure consisted of 4 phases; 1) problem and situation study, 2) the development of printed media for public relations, 3) research tool development, and 4) data collection. Questionnaires to evaluate the satisfaction of local community producers towards the printed media for public relation were used to collect data which were analysed to find percentage, arithmetic means, and standard deviation. The results showed that the informants reported their satisfaction on 4 aspects as follows: 1) very high satisfaction on the content, 2) high satisfaction on the illustration, 3) very high satisfaction on the design, and 4) very high satisfaction on the product quality. This can be concluded that the developed printed media for public relations of community products can be used effectively with high satisfaction.

Keywords: printed media, public relations, community products in Bang Khonthi district, Samut Songkram Province

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Authors: Masaya Yoshikawa, Toshiya Asai, Ryoma Matsuhisa, Yusuke Nozaki, Kensaku Asahi

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Recently, side-channel attacks, which estimate secret keys using side-channel information such as power consumption and compromising emanations of cryptography circuits embedded in hardware, have become a serious problem. In particular, electromagnetic analysis attacks against cryptographic circuits between information processing and electromagnetic fields, which are related to secret keys in cryptography circuits, are the most threatening side-channel attacks. Therefore, it is important to evaluate tamper resistance against electromagnetic analysis attacks for cryptography circuits. The present study performs basic examination of the tamper resistance of cryptography circuits using electromagnetic analysis attacks with noise resources.

Keywords: tamper resistance, cryptographic circuit, hardware security evaluation, noise resources

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Authors: Sidra Saleemi, Raja Fahad Qureshi, Farooq Ahmed, Rabia Almas, Tahir Jameel

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This research aimed to decrease formaldehyde content in substrates printed by pigments using different fixation temperature and concentration of urea in order to produce eco-friendly textiles. Substrates were printed by hand screen printing method as per recipe followed by drying and curing. Standard test methods were adapted to measure formaldehyde content washing and rubbing fastness. Formaldehyde content is instantaneously decreased by raising the temperature during curing printed fabric. Good results of both dry and wet rubbing fastness were found at 160˚C slightly improved dry rubbing results are achieved with 2% urea at a curing temperature of 150˚C.

Keywords: formaldehyde content, pigment printing, urea, washing fastness, rubbing fastness

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Authors: Jung Hyun Kim, Gyo Woo Lee

Abstract:

In this study, the enhancement of the heat release performance of an extruded-type heat sink to prepare the large-capacity solar inverter thru the flow holes in the base plate near the heat sources was investigated. Optimal location and number of the holes in the baseplate were determined by using a commercial computation program. The heat release performance of the shape-modified heat sink was measured experimentally and compared with that of the simulation. The heat sink with 12 flow holes in the 18-mm-thick base plate has a 8.1% wider heat transfer area, a 2.5% more mass flow of air, and a 2.7% higher heat release rate than those of the original heat sink. Also, the surface temperature of the base plate was lowered 1.5°C by the holes.

Keywords: heat sink, forced convection, heat transfer, performance evaluation, flow holes

Procedia PDF Downloads 532

Authors: David Downey

Abstract:

With the introduction of additive manufacturing (3D printing) to produce titanium (Ti6Al4V) components in the medical/aerospace and automotive industries, intricate geometries can be produced with virtually complete design freedom. However, the consideration of microstructural anisotropy resulting from the additive manufacturing process becomes necessary due to this design flexibility and the need to print a geometric shape that can consist of numerous angles, radii, and swept surfaces. A femoral knee implant serves as an example of a 3D-printed near-net-shaped product. The mechanical properties of the printed components, and consequently, their machinability, are affected by microstructural anisotropy. Currently, finish-machining operations performed on titanium printed parts using selective laser melting (SLM) utilize the same cutting tools employed for processing wrought titanium components. Cutting forces for components manufactured through SLM can be up to 70% higher than those for their wrought counterparts made of Ti6Al4V. Moreover, temperatures at the cutting interface of 3D printed material can surpass those of wrought titanium, leading to significant tool wear. Although the criteria for tool wear may be similar for both 3D printed and wrought materials, the rate of wear during the machining process may differ. The impact of these issues on the choice of cutting tool material and tool lifetimes will be discussed.

Keywords: additive manufacturing, build orientation, microstructural anisotropy, printed titanium Ti6Al4V, tool wear

Procedia PDF Downloads 89