Search results for: flexible and printed electronic

Authors: Ahmed Moulay, Mariia Zhuldybina, Mirko Torres, Mike Rozel, Ngoc Duc Trinh, Chloé Bois

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Hybrid printed electronics technology (HPE) provides innovative opportunities to enhance conventional electronics applications, which are often based on printed circuit boards (PCB). By combining the best of both performance from conventional electronic components and the flexibility from printed circuits makes it possible to manufacture HPE at high volumes using roll-to-roll printing processes. However, several challenges must be overcome in order to accurately integrate an electronic component on a printed circuit. In this presentation, we will demonstrate the integration process of electronic components from the lab scale to the industrialization. Both the printing quality and the integration technique must be studied to define the optimal conditions. To cover the parameters that influence the print quality of the printed circuit, different printing processes, flexible substrates, and conductive inks will be used to determine the optimized printing process/ink/substrate system. After the systems is selected, an electronic component of 2.5 mm2 chip size will be integrated to validate the functionality of the printed, electronic circuit. Critical information such as the conductive adhesive, the curing conditions, and the chip encapsulation will be determined. Thanks to these preliminary results, we are able to demonstrate the chip integration on a printed circuit using industrial equipment, showing the potential of industrialization, compatible using roll-to-roll printing and integrating processes.

Keywords: flat bed screen-printing, hybrid printed electronics, integration, large-scale production, roll-to-roll printing, rotary screen printing

Procedia PDF Downloads 177

Authors: Donia Fredj, Marie Parmentier, Florence Archet, Olivier Margeat, Sadok Ben Dkhil, Jorg Ackerman

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Transparent conductive electrodes (TCEs) or transparent electrodes (TEs) are a crucial part of many electronic and optoelectronic devices such as touch panels, liquid crystal displays (LCDs), organic light-emitting diodes (OLEDs), solar cells, and transparent heaters. The indium tin oxide (ITO) electrode is the most widely utilized transparent electrode due to its excellent optoelectrical properties. However, the drawbacks of ITO, such as the high cost of this material, scarcity of indium, and the fragile nature, limit the application in large-scale flexible electronic devices. Importantly, flexibility is becoming more and more attractive since flexible electrodes have the potential to open new applications which require transparent electrodes to be flexible, cheap, and compatible with large-scale manufacturing methods. So far, several materials as alternatives to ITO have been developed, including metal nanowires, conjugated polymers, carbon nanotubes, graphene, etc., which have been extensively investigated for use as flexible and low-cost electrodes. Among them, silver nanowires (AgNW) are one of the promising alternatives to ITO thanks to their excellent properties, high electrical conductivity as well as desirable light transmittance. In recent years, inkjet printing became a promising technique for large-scale printed flexible and stretchable electronics. However, inkjet printing of AgNWs still presents many challenges. In this study, a synthesis of stable AgNW that could compete with ITO was developed. This material was printed by inkjet technology directly on a flexible substrate. Additionally, we analyzed the surface microstructure, optical and electrical properties of the printed AgNW layers. Our further research focused on the study of all inkjet-printed organic modules with high efficiency.

Keywords: transparent electrodes, silver nanowires, inkjet printing, formulation of stable inks

Procedia PDF Downloads 222

Authors: Mariia Zhuldybina, Ahmed Moulay, Mirko Torres, Mike Rozel, Ngoc-Duc Trinh, Chloé Bois

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To reduce the global waste of perishable goods, a solution for monitoring and traceability of their environmental conditions is needed. Temperature is the most controllable environmental parameter determining the kinetics of physical, chemical, and microbial spoilage in food products. To store the time-temperature information, time-temperature indicator (TTI) is a promising solution. Printed electronics (PE) has shown a great potential to produce customized electronic devices using flexible substrates and inks with different functionalities. We propose to fabricate a hybrid printed TTI using environmentally friendly materials. The real-time TTI profile can be stored and transmitted to the smartphone via Near Field Communication (NFC). To ensure environmental performance, Canadian Green Electronics NSERC Network is developing green materials for the ink formulation with different functionalities. In terms of substrate, paper-based electronics has gained the great interest for utilization in a wide area of electronic systems because of their low costs in setup and methodology, as well as their eco-friendly fabrication technologies. The main objective is to deliver a prototype of TTI using small-scale printed techniques under typical printing conditions. All sub-components of the smart labels, including a memristor, a battery, an antenna compatible with NFC protocol, and a circuit compatible with integration performed by an offsite supplier will be fully printed with flexography or flat-bed screen printing.

Keywords: NFC, printed electronics, time-temperature indicator, hybrid electronics

Procedia PDF Downloads 163

Authors: Yang Xiaodong

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This article explores the application and structural characteristics of flexible and programmable systems in electronic systems, with a focus on analyzing their advantages and architectural differences in dealing with complex environments. By introducing mathematical models and simulation experiments, the performance of dynamic module combination in flexible systems and fixed path selection in programmable systems in resource utilization and performance optimization was demonstrated. This article also discusses the mutual transformation between the two in practical applications and proposes a solution to improve system flexibility and performance through dynamic reconfiguration technology. This study provides theoretical reference for the design and optimization of flexible and programmable systems.

Keywords: flexibility, programmable, electronic systems, system architecture

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Authors: Yohann R. J. Thomas, Sébastien Solan

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Conventional battery technology includes the assembly of electrode/separator/electrode by standard techniques such as stacking or winding, depending on the format size. In that type of batteries, coating or pasting techniques are only used for the electrode process. The processes are suited for large scale production of batteries and perfectly adapted to plenty of application requirements. Nevertheless, as the demand for both easier and cost-efficient production modes, flexible, custom-shaped and efficient small sized batteries is rising. Thin-film, printable batteries are one of the key areas for printed electronics. In the frame of European BASMATI project, we are investigating the feasibility of a new design of lithium-ion battery: interdigitated planar core design. Polymer substrate is used to produce bendable and flexible rechargeable accumulators. Direct fully printed batteries lead to interconnect the accumulator with other electronic functions for example organic solar cells (harvesting function), printed sensors (autonomous sensors) or RFID (communication function) on a common substrate to produce fully integrated, thin and flexible new devices. To fulfill those specifications, a high resolution printing process have been selected: Aerosol jet printing. In order to fit with this process parameters, we worked on nanomaterials formulation for current collectors and electrodes. In addition, an advanced printed polymer-electrolyte is developed to be implemented directly in the printing process in order to avoid the liquid electrolyte filling step and to improve safety and flexibility. Results: Three different current collectors has been studied and printed successfully. An ink of commercial copper nanoparticles has been formulated and printed, then a flash sintering was applied to the interdigitated design. A gold ink was also printed, the resulting material was partially self-sintered and did not require any high temperature post treatment. Finally, carbon nanotubes were also printed with a high resolution and well defined patterns. Different electrode materials were formulated and printed according to the interdigitated design. For cathodes, NMC and LFP were efficaciously printed. For anodes, LTO and graphite have shown to be good candidates for the fully printed battery. The electrochemical performances of those materials have been evaluated in a standard coin cell with lithium-metal counter electrode and the results are similar with those of a traditional ink formulation and process. A jellified plastic crystal solid state electrolyte has been developed and showed comparable performances to classical liquid carbonate electrolytes with two different materials. In our future developments, focus will be put on several tasks. In a first place, we will synthesize and formulate new specific nano-materials based on metal-oxyde. Then a fully printed device will be produced and its electrochemical performance will be evaluated.

Keywords: high resolution digital printing, lithium-ion battery, nanomaterials, solid-state electrolytes

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Authors: Adria Kajenski, Guinevere Strack, Edward Kingsley, Shahriar Khushrushahi, Alkim Akyurtlu

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Radio Frequency (RF) metasurfaces are arrangements of subwavelength elements interacting with electromagnetic radiation. These arrangements affect polarization state, amplitude, and phase of impinged radio waves; for example, metasurface designs are used to produce functional passband and stopband filters. Recent advances in additive manufacturing techniques have enabled the low-cost, rapid fabrication of ultra-thin metasurface elements on flexible substrates such as plastic films, paper, and textiles. Furthermore, scalable manufacturing processes promote the integration of fabric-based RF metasurfaces into the market of sensors and devices within the Internet of Things (IoT). The design and fabrication of metasurfaces on textiles require a multidisciplinary team with expertise in i) textile and materials science, ii) metasurface design and simulation, and iii) metasurface fabrication and testing. In this presentation, we will discuss RF metasurfaces on fabric with an emphasis on how the materials, including fabric and inks, along with fabrication techniques, affect the RF performance. We printed metasurfaces using a direct-write approach onto various woven and non-woven fabrics, as well as on fabrics coated with either thermoplastic or thermoset coatings. Our team also performed a range of tests on the printed structures, including different inks and their curing parameters, wash durability, abrasion resistance, and RF performance over time.

Keywords: electronic textiles, metasurface, printed electronics, flexible

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Authors: Xiaohui Wang, Liwei Sun, Guilin Zhang

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Printed circuit board (PCB) is the carrier of electronic components. Its coating is the first barrier for protecting itself. If the coating is damaged, the performance of printed circuit board will decrease rapidly until failure. Therefore, the coating plays an important role in the entire printed circuit board. There are common four kinds of coating of printed circuit board that the material of the coatings are paryleneC, acrylic, polyurethane, silicone. In this paper, we designed an accelerated degradation test of humid and heat for these four kinds of coating. And chose insulation resistance, moisture absorption and surface morphology as its test indexes. By comparing the change of insulation resistance of the coating before and after the test, we estimate failure time of these coatings based on the degradation of insulation resistance. Based on the above, we estimate the service life of the four kinds of PCB.

Keywords: printed circuit board, life assessment, insulation resistance, coating material

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Authors: Braden M. Li, Inhwan Kim, Jesse S. Jur

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One of the fundamental challenges in the electronic textile (e-textile) industry is the mismatch in compliance between the rigid electronic components integrated onto soft textile platforms. To address these problems, various printing technologies using conductive inks have been explored in an effort to improve the electromechanical performance without sacrificing the innate properties of the printed textile. However, current printing methods deposit densely layered coatings onto textile surfaces with low through-plane wetting resulting in poor electromechanical properties. This work presents an inkjet printing technique in conjunction with unique Kirigami cut designs to address these issues for printed smart textiles. By utilizing particle free reactive silver inks, our inkjet process produces conformal and micron thick silver coatings that surround individual fibers of the printed smart textile. This results in a highly conductive (0.63 Ω sq-1) printed e-textile while also maintaining the innate properties of the textile material including stretchability, flexibility, breathability and fabric hand. Kirigami is the Japanese art of paper cutting. By utilizing periodic cut designs, Kirigami imparts enhanced flexibility and delocalization of stress concentrations. Kirigami cut design parameters (i.e., cut spacing and length) were correlated to both the mechanical and electromechanical properties of the printed textiles. We demonstrate that designs using a higher cut-out ratio exponentially softens the textile substrate. Thus, our designs achieve a 30x improvement in the overall stretchability, 1000x decrease in elastic modulus, and minimal resistance change over strain regimes of 100-200% when compared to uncut designs. We also show minimal resistance change of our Kirigami inspired printed devices after being stretched to 100% for 1000 cycles. Lastly, we demonstrate a Kirigami-inspired electrocardiogram (ECG) monitoring system that improves stretchability without sacrificing signal acquisition performance. Overall this study suggests fundamental parameters affecting the performance of e-textiles and their scalability in the wearable technology industry

Keywords: kirigami, inkjet printing, flexible electronics, reactive silver ink

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Authors: Bahattin Kanal, Nursel Akçam

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Data transmission size and frequency requirements are increasing rapidly in electronic communication protocols. Increasing data transmission speeds have made the design of printed circuit boards much more important. It is important to carefully examine the requirements and make analyses before and after the design of the digital electronic circuit board. It delves into impedance matching techniques, signal trace routing considerations, and the impact of layer stacking on signal performance. The paper extensively explores techniques for minimizing crosstalk issues and interference, presenting a holistic perspective on design strategies to optimize the quality of high-speed signals. Through a comprehensive review of these design methodologies, this study aims to provide insights into achieving reliable and high-performance printed circuit board layouts for these signals. In this study, the effect of different design methods on Ethernet signals was examined from the type of S parameters. Siemens company HyperLynx software tool was used for the analyses.

Keywords: HyperLynx, printed circuit board, s parameters, ethernet

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Authors: Sira Suren, Soorathep Kheawhom

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This work investigates the development of a high energy density zinc-air battery. Printed and flexible thin film zinc-air battery with an overall thickness of about 350 μm was fabricated by an inexpensive screen-printing technique. Commercial nano-silver ink was used as both current collectors and catalyst layer. Carbon black ink was used to fabricate cathode electrode. Polypropylene membrane was used as the cathode substrate and separator. 9 M KOH was used as the electrolyte. A mixture of Zn powder, ZnO, and Bi2O3 was used to prepare the anode electrode. The suitable concentration of Bi2O3 and types of binders (styrene-butadiene and sodium silicate) were investigated. Results showed that battery using 20% Bi2O3 and sodium silicate binder provided the best performance. The open-circuit voltage and energy density observed were 1.59 V and 690 Wh/kg, respectively. When the battery was discharged at 20 mA/cm2, the potential voltage observed was 1.3 V. Furthermore, the battery was tested for its flexibility. Upon bending, no significant loss in performance was observed.

Keywords: flexible, printed battery, screen printing, Zn-air

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Authors: Simona Ziukaite, Remigijus Ivanauskas, Gintaras Denafas

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Market development of electrical and electronic equipment and a short life cycle is driven by the increasing waste streams. Gold Au, copper Cu, silver Ag and palladium Pd can be found on printed circuit board. These metals make up the largest value of printed circuit board. Therefore, the printed circuit boards scrap is valuable as potential raw material for precious metals recovery. A comparison of Cu, Au, Ag, Pd recovery from waste printed circuit techniques was selected metals leaching of chemical reagents. The study was conducted using the selected multistage technique for Au, Cu, Ag, Pd recovery of printed circuit board. In the first and second metals leaching stages, as the elution reagent, 2M H2SO4 and H2O2 (35%) was used. In the third stage, leaching of precious metals used solution of 20 g/l of thiourea and 6 g/l of Fe2 (SO4)3. Verify the efficiency of the method was carried out the metals leaching test with aqua regia. Based on the experimental study, the leaching efficiency, using the preferred methodology, 60 % of Au and 85,5 % of Cu dissolution was achieved. Metals leaching efficiency after waste mechanical crushing and thermal treatment have been increased by 1,7 times (40 %) for copper, 1,6 times (37 %) for gold and 1,8 times (44 %) for silver. It was noticed that, the Au amount in old (> 20 years) waste is 17 times more, Cu amount - 4 times more, and Ag - 2 times more than in the new (< 1 years) waste. Palladium in the new printed circuit board waste has not been found, however, it was established that from 1 t of old printed circuit board waste can be recovered 1,064 g of Pd (leaching with aqua regia). It was found that from 1 t of old printed circuit board waste can be recovered 1,064 g of Ag. Precious metals recovery in Lithuania was estimated in this study. Given the amounts of generated printed circuit board waste, the limits for recovery of precious metals were identified.

Keywords: leaching efficiency, limits for recovery, precious metals recovery, printed circuit board waste

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Authors: F. Noto, F. De Persio, V. Bellini, G. Costa. F. Mammoliti, F. Meddi, C. Sutera, G. M. Urcioli

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One plane X and one plane Y of silicon microstrip detectors will constitute the front part of the Super Bigbite Spectrometer that is under construction and that will be installed in the experimental Hall A of the Thomas Jefferson National Accelerator Facility (Jefferson Laboratory), located in Newport News, Virgina, USA. Each plane will be made up by two nearly identical, 300 μm thick, 10 cm x 10.3 cm wide silicon microstrip detectors with 50 um pitch, whose electronic signals will be transferred to the front-end electronic based on APV25 chips through C-shaped FR4 Printed Circuit Boards (PCB). A total of about 10000 strips are read-out. This paper treats the optimization of the detector support structure, the materials used through a finite element simulation. A very important aspect of the study will also cover the optimization of the bonding parameters between detector and electronics.

Keywords: FEM analysis, bonding, SBS tracker, mechanical structure

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Authors: Dessalegn Abera Waktole, Boru Jia, Zhengxing Zuo, Wei Wang, Nianling Kuang

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A flexible thermoelectric generator is one method for recycling waste heat. This research provides the optimum performance of a flexible thermoelectric generator with optimal geometric parameters and a detailed structural design. In this research, a numerical simulation and experiment were carried out to develop an efficient, flexible thermoelectric generator for energy harvesting from human skin. Heteromorphic electrodes and a polyimide substrate with a copper-printed circuit board were introduced into the structural design of a flexible thermoelectric generator. The heteromorphic electrode was used as a heat sink and component of a flexible thermoelectric generator to enhance the temperature difference within the thermoelectric legs. Both N-type and P-type thermoelectric legs were made of bismuth selenium telluride (Bi1.7Te3.7Se0.3) and bismuth antimony telluride (Bi0.4Sb1.6Te3). The output power of the flexible thermoelectric generator was analyzed under different heat source temperatures and heat dissipation conditions. The COMSOL Multiphysics 5.6 software was used to conduct the simulation, which was validated by experiment. It is recorded that the maximum power output of 232.064μW was obtained by considering different wind speed conditions, the ambient temperature of 20℃, and the heat source temperature of 36℃ under various load resistance conditions, which range from 0.24Ω to 0. 91Ω. According to this finding, heteromorphic electrodes have a significant impact on the performance of the device.

Keywords: flexible thermoelectric generator, optimization, performance, temperature gradient, waste heat recovery

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Authors: Vikas Kumar

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Portable batteries are reliable source of mobile energy to power smart wearable electronics, medical devices, communications, and others internet of thing (IoT) devices. There is a continuous increase in demand for thinner, more flexible battery with high energy density and reliability to meet the requirement. For a flexible battery, factors that affect these properties are the stability of current collectors, electrode materials and their interfaces with the corrosive electrolytes. State-of-the-art conventional and flexible batteries utilise carbon as an electrode and current collectors which cause high internal resistance (~100 ohms) and limit the peak current to ~1mA. This makes them unsuitable for a wide range of applications. Replacing the carbon parts with metallic components would reduce the internal resistance (and hence reduce parasitic loss), but significantly increases the risk of corrosion due to galvanic interactions within the battery. To overcome these challenges, low cost electroplated nickel (Ni) on copper (Cu) was studied as a potential anode current collector for a zinc-manganese oxide primary battery with different concentration of NH4Cl/ZnCl2 electrolyte. Using electrical impedance spectroscopy (EIS), we monitored the open circuit potential (OCP) of electroplated nickel (different thicknesses) in different concentration of electrolytes to optimise the thickness of Ni coating. Our results show that electroless Ni coating suffer excessive corrosion in these electrolytes. Corrosion rates of Ni coatings for different concentrations of electrolytes have been calculated with Tafel analysis. These results suggest that for electroplated Ni, channelling and/or open porosity is a major issue, which was confirmed by morphological analysis. These channels are an easy pathway for electrolyte to penetrate thorough Ni to corrode the Ni/Cu interface completely. We further investigated the incorporation of a special printed graphene layer on Ni to provide corrosion protection in this corrosive electrolyte medium. We find that the incorporation of printed graphene layer provides the corrosion protection to the Ni and enhances the chemical bonding between the active materials and current collector and also decreases the overall internal resistance of the battery system.

Keywords: corrosion, electrical impedance spectroscopy, flexible battery, graphene, metal current collector

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Authors: Zahrasadat Hosseini, Jie Yuan

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Point-of-care (POC) diagnostic devices based on lab-on-a-chip (LOC) technology have the potential to revolutionize medical diagnostics. However, the development of an ideal microfluidic system based on LOC technology for diagnostics purposes requires overcoming several obstacles, such as improving sensitivity, selectivity, portability, cost-effectiveness, and prototyping methods. While numerous studies have introduced technologies and systems that advance these criteria, existing systems still have limitations. Electrochemical enzyme-linked immunosorbent assay (e-ELISA) in a LOC device offers numerous advantages, including enhanced sensitivity, decreased turnaround time, minimized sample and analyte consumption, reduced cost, disposability, and suitability for miniaturization, integration, and multiplexing. In this study, we present a novel design and fabrication method for a microfluidic diagnostic platform that integrates screen-printed electrochemical carbon/silver chloride electrodes on flexible printed circuit boards with flexible, multilayer, polydimethylsiloxane (PDMS) microfluidic networks to accurately manipulate and pre-immobilize analytes for performing electrochemical enzyme-linked immunosorbent assay (e-ELISA) for multiplexed quantification of blood serum biomarkers. We further demonstrate fast, cost-effective prototyping, as well as accurate and reliable detection performance of this device for quantification of interleukin-6-spiked samples through electrochemical analytics methods. We anticipate that our invention represents a significant step towards the development of user-friendly, portable, medical-grade, POC diagnostic devices.

Keywords: lab-on-a-chip, point-of-care diagnostics, electrochemical ELISA, biomarker quantification, fast prototyping

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Authors: Zahrasadat Hosseini, Jie Yuan

Abstract:

Point-of-care (POC) diagnostic devices based on lab-on-a-chip (LOC) technology have the potential to revolutionize medical diagnostics. However, the development of an ideal microfluidic system based on LOC technology for diagnostics purposes requires overcoming several obstacles, such as improving sensitivity, selectivity, portability, cost-effectiveness, and prototyping methods. While numerous studies have introduced technologies and systems that advance these criteria, existing systems still have limitations. Electrochemical enzyme-linked immunosorbent assay (e-ELISA) in a LOC device offers numerous advantages, including enhanced sensitivity, decreased turnaround time, minimized sample and analyte consumption, reduced cost, disposability, and suitability for miniaturization, integration, and multiplexing. In this study, we present a novel design and fabrication method for a microfluidic diagnostic platform that integrates screen-printed electrochemical carbon/silver chloride electrodes on flexible printed circuit boards with flexible, multilayer, polydimethylsiloxane (PDMS) microfluidic networks to accurately manipulate and pre-immobilize analytes for performing electrochemical enzyme-linked immunosorbent assay (e-ELISA) for multiplexed quantification of blood serum biomarkers. We further demonstrate fast, cost-effective prototyping, as well as accurate and reliable detection performance of this device for quantification of interleukin-6-spiked samples through electrochemical analytics methods. We anticipate that our invention represents a significant step towards the development of user-friendly, portable, medical-grade POC diagnostic devices.

Keywords: lab-on-a-chip, point-of-care diagnostics, electrochemical ELISA, biomarker quantification, fast prototyping

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Authors: Shilpesh R. Rajpurohit, Harshit K. Dave

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Additive manufacturing gains the popularity in recent times, due to its capability to create prototype as well functional as end use product directly from CAD data without any specific requirement of tooling. Fused deposition modeling (FDM) is one of the widely used additive manufacturing techniques that are used to create functional end use part of polymer that is comparable with the injection-molded parts. FDM printed part has an application in various fields such as automobile, aerospace, medical, electronic, etc. However, application of FDM part is greatly affected by poor mechanical properties. Proper selection of the process parameter could enhance the mechanical performance of the printed part. In the present study, experimental investigation has been carried out to study the behavior of the mechanical performance of the printed part with respect to process variables. Three process variables viz. raster angle, raster width and layer height have been varied to understand its effect on tensile strength. Further, effect of process variables on fractured surface has been also investigated.

Keywords: 3D Printing, fused deposition modeling, layer height, raster angle, raster width, tensile strength

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Authors: Joana Pimenta, Lorena Coelho, José Silva, Vanessa Miranda, Jorge Laranjeira, Rui Soares

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In this paper, the results of R&D on an innovative food package for increased shelf-life are presented. SAP4MA aims at the development of a printed active device that enables smart packaging solutions for food preservation, targeting the extension of the shelf-life of the packed food through the controlled release of active natural antioxidant agents at the onset of the food degradation process. To do so, SAP4MA focuses on the development of active devices such as printed heaters and batteries/supercapacitors in a label format to be integrated on packaging lids during its injection molding process, promoting the passive release of natural antioxidants after the product is packed, during transportation and in the shelves, and actively when the end-user activates the package, just prior to consuming the product at home. When the active device present on the lid is activated, the release of the natural antioxidants embedded in the inner layer of the packaging lid in direct contact with the headspace atmosphere of the food package starts. This approach is based on the use of active functional coatings composed of nano encapsulated active agents (natural antioxidants species) in the prevention of the oxidation of lipid compounds in food by agents such as oxygen. Thus keeping the product quality during the shelf-life, not only when the user opens the packaging, but also during the period from food packaging up until the purchase by the consumer. The active systems that make up the printed smart label, heating circuit, and battery were developed using screen-printing technology. These systems must operate under the working conditions associated with this application. The printed heating circuit was studied using three different substrates and two different conductive inks. Inks were selected, taking into consideration that the printed circuits will be subjected to high pressures and temperatures during the injection molding process. The circuit must reach a homogeneous temperature of 40ºC in the entire area of the lid of the food tub, promoting a gradual and controlled release of the antioxidant agents. In addition, the circuit design involves a high level of study in order to guarantee maximum performance after the injection process and meet the specifications required by the control electronics component. Furthermore, to characterize the different heating circuits, the electrical resistance promoted by the conductive ink and the circuit design, as well as the thermal behavior of printed circuits on different substrates, were evaluated. In the injection molding process, the serpentine-shaped design developed for the heating circuit was able to resolve the issues connected to the injection point; in addition, the materials used in the support and printing had high mechanical resistance against the pressure and temperature inherent to the injection process. Acknowledgment: This research has been carried out within the Project “Smart and Active Packing for Margarine Product” (SAP4MA) running under the EURIPIDES Program being co-financed by COMPETE 2020 – the Operational Programme for Competitiveness and Internationalization and under Portugal 2020 through the European Regional Development Fund (ERDF).

Keywords: smart package, printed heat circuits, printed batteries, flexible and printed electronic

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Authors: Muhammad Mohsin, Fawad Ahmad, Fatima Batool, Muhammad Kaab Zarrar

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The integration of the Internet of Things (IoT) and edge computing devices offers a transformative approach to electronic waste management, particularly in the dismantling of printed circuit boards (PCBs). This paper explores how these technologies optimize operational efficiency and improve environmental sustainability by addressing challenges such as data security, interoperability, scalability, and real-time data processing. Proposed solutions include advanced machine learning algorithms for predictive maintenance, robust encryption protocols, and scalable architectures that incorporate edge computing. Case studies from leading e-waste management facilities illustrate benefits such as improved material recovery efficiency, reduced environmental impact, improved worker safety, and optimized resource utilization. The findings highlight the potential of IoT and edge computing to revolutionize e-waste dismantling and make the case for a collaborative approach between policymakers, waste management professionals, and technology developers. This research provides important insights into the use of IoT and edge computing to make significant progress in the sustainable management of electronic waste

Keywords: internet of Things, edge computing, waste PCB disassembly, electronic waste management, data security, interoperability, machine learning, predictive maintenance, sustainable development

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Authors: Roberta Gentry

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Electronic mentoring is defined as a relationship between a mentor and a mentee using computer mediated communication (CMC) that is intended to develop and improve mentee’s skills, confidence, and cultural understanding. This session will increase knowledge about electronic mentoring, its uses, and outcomes. The research behind electronic mentoring and descriptions of existing programs will also be shared.

Keywords: electronic mentoring, mentoring, beginning special educators, education

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Authors: Hanjun Yun, Gun Bae, Nabin Paul, Cheolhee Moon

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Flexible OLED is an important technology for the next generation display over various kinds of applications. However, the organic materials of OLEDs degrade rapidly under the invasion of oxygen and water moisture. The degradation causes the formation of non-emitting areas which gradually suppress the device brightness, ultimately the lifetime of the device decreasing rapidly. Until now, the most suitable sealing process of the flexible OLED devices is a thin film encapsulation (TFE). However, TFE consists of a multilayer thin-film structure with organic-inorganic materials, so the cost is expensive and the process time is long. Another problem is that the blocking characteristics from the moisture and oxygen are not perfect. Therefore, the encapsulation of the flexible OLED device is a still key technical issue for the successful market entry. In this study, we are to introduce an auxiliary sealing line between the two flexible substrates. The electrode lines were formed on the substrates which have a SiNx barrier coating layer. To induce the solid phase diffusion process between the SiNx layer and the electrode lines, the electrode materials were determined as Al-Si composition. Thermal energy was supplied for both the SiNx layer and Al-Si electrode lines within the furnace to induce the interfacial bonding through the solid phase diffusion of Si. We printed a test pattern for the edge of the flexible PET substrate of 3cm*3cm size. Experimental conditions such as heating temperature, heating time were optimized to get enough adhesion strength which was estimated through the competitive bending test. Finally, OLED devices with flexible PET substrate of 3cm*3cm size were manufactured to investigate the blocking characteristics as an encapsulation layer.

Keywords: barrier, encapsulation, OLED, solid phase diffusion

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Authors: Paweł Żur, Alicja Żur, Andrzej Baier

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Modal analysis is a crucial tool in the field of engineering for understanding the dynamic behavior of structures. In this study, numerical modal analysis was conducted on a multi-material 3D-printed composite bushing, which comprised a polylactic acid (PLA) outer shell and a thermoplastic polyurethane (TPU) flexible filling. The objective was to investigate the modal characteristics of the bushing and assess its potential for practical applications. The analysis involved the development of a finite element model of the bushing, which was subsequently subjected to modal analysis techniques. Natural frequencies, mode shapes, and damping ratios were determined to identify the dominant vibration modes and their corresponding responses. The numerical modal analysis provided valuable insights into the dynamic behavior of the bushing, enabling a comprehensive understanding of its structural integrity and performance. Furthermore, the study expanded its scope by investigating the entire shaft mounting of a small electric car, incorporating the 3D-printed composite bushing. The shaft mounting system was subjected to numerical modal analysis to evaluate its dynamic characteristics and potential vibrational issues. The results of the modal analysis highlighted the effectiveness of the 3D-printed composite bushing in minimizing vibrations and optimizing the performance of the shaft mounting system. The findings contribute to the broader field of composite material applications in automotive engineering and provide valuable insights for the design and optimization of similar components.

Keywords: 3D printing, composite bushing, modal analysis, multi-material

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Authors: Rasha Alshaye

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Blended learning has become an innovative model that combines face-to-face with e-learning approaches. The Saudi Electronic University (SEU) has adopted blended learning as a flexible approach that provides instructors and learners with a motivating learning environment to stimulate the teaching and learning process. This study investigates the perceptions of English language instructors, teaching the four English language skills at Saudi Electronic University. Four main domains were examined in this study; challenges that the instructors encounter while implementing the blended learning approach, enhancing student-instructor interaction, flexibility in teaching, and the lack of technical skills. Furthermore, the study identifies and represents the instructors’ aspirations and plans to utilize this approach in enhancing the teaching and learning experience. Main findings indicate that instructors at Saudi Electronic University experience some challenges while teaching the four language skills. However, they find the blended learning approach motivating and flexible for them and their students. This study offers some important understandings into how instructors are applying the blended learning approach and how this process can be enriched.

Keywords: blended learning, English language skills, English teaching, instructors' perceptions

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Authors: Ariangelo Hauer Dias Filho, Gustavo Antoniácomi de Carvalho, Benjamim de Melo Carvalho

Abstract:

The work´s purpose was to evaluate the possibility of manufacturing casting tools utilizing Fused Filament Fabrication, a 3D printing technique, without any post-processing on the printed part. Taguchi Orthogonal array was used to evaluate the influence of extrusion temperature, bed temperature, layer height, and infill on the dimensional accuracy of a 3D-Printed Polymer Model. A Zeiss T-SCAN CS 3D Scanner was used for dimensional evaluation of the printed parts within the limit of ±0,2 mm. The mold capabilities were tested with the printed model to check how it would interact with the green sand. With little adjustments in the 3D model, it was possible to produce rapid tools without the need for post-processing for iron casting. The results are important for reducing time and cost in the development of such tools.

Keywords: additive manufacturing, Taguchi method, rapid tooling, fused filament fabrication, casting mold

Procedia PDF Downloads 142

Authors: Wu Peiqin

Abstract:

Flexible thermoelectric devices are light and flexible, which can be in close contact with any shape of heat source surfaces to minimize heat loss and achieve efficient energy conversion. Among the wide application fields, energy harvesting via flexible thermoelectric generators can adapt to a variety of curved heat sources (such as human body, circular tubes, and surfaces of different shapes) and can drive low-power electronic devices, exhibiting one of the most promising technologies in self-powered systems. The heat flux along the cross-section of the flexible thin-film generator is limited by the thickness, so the temperature difference decreases during the generation process, and the output power is low. At present, most of the heat flow directions of the thin film thermoelectric generator are along the thin-film plane; however, this method is not suitable for attaching to the human body surface to generate electricity. In order to make the film generator more suitable for thermoelectric generation, it is necessary to apply a flexible heatsink on the air sides with the film to maintain the temperature difference. In this paper, Bismuth telluride thermoelectric paste was deposited on polyimide flexible substrate by a screen printing method, and the flexible thermoelectric film was formed after drying. There are ten pairs of thermoelectric legs. The size of the thermoelectric leg is 20 x 2 x 0.1 mm, and adjacent thermoelectric legs are spaced 2 mm apart. A phase change material-based flexible heatsink was designed and fabricated. The flexible heatsink consists of n-octadecane, polystyrene, and expanded graphite. N-octadecane was used as the thermal storage material, polystyrene as the supporting material, and expanded graphite as the thermally conductive additive. The thickness of the flexible phase change material-based heatsink is 2mm. A thermoelectric performance testing platform was built, and its output performance was tested. The results show that the system can generate an open-circuit output voltage of 3.89 mV at a temperature difference of 10K, which is higher than the generator without a heatsink. Therefore, the flexible heatsink can increase the temperature difference between the two ends of the film and improve the output performance of the flexible film generator. This result promotes the application of the film thermoelectric generator in collecting human heat for power generation.

Keywords: flexible thermoelectric generator, screen printing, PCM, flexible heatsink

Procedia PDF Downloads 101

Authors: Li Guoyou, Zhang Tao, Ji Wenzhan, Huo Liang, Lin Xiqiang, Zhang Nan

Abstract:

The three dimensional (3D) printing technology has undergone rapid development in the last few years and it is possible to print engineering structures. 3D printing buildings use wastes from constructions, industries and mine tailings as “ink”, and mix it with property improved materials, such as cement, fiber etc. This paper presents a study of the Thermodynamic performance of 3D printed walls using cement and steel slag powder. Analyses the thermal simulation regarding 3D printed walls and solid brick wall by the way of the hot-box methods and the infrared technology, and the results were contrasted with theoretical calculation. The results show that the excellent thermodynamic performance of 3D printed concrete wall made it suitable as the partial materials for self-thermal insulation walls in residential buildings. The thermodynamic performance of 3D printed concrete walls depended on the density of materials, distribution of holes, and the filling materials. Decreasing the density of materials, increasing the number of holes or replacing the filling materials with foamed concrete could improve its thermodynamic performance significantly. The average of heat transfer coefficient and thermal inertia index of 3D printed steel slag powder concrete wall all better than the traditional solid brick wall with a thickness of 240mm.

Keywords: concrete, 3D printed walls, thermodynamic performance, steel slag powder

Procedia PDF Downloads 183

Authors: Banu Hatice Gürcüm, Pınar Arslan, Mahmut Yalçın

Abstract:

From the oldest production methods with yarns used to weave, knit, braid and knot to the newest production methods with fibres used to stitch, bond or structures of innovative technologies, laminates, nanoparticles, composites or 3D printing systems, textile industry advanced through materials, processes and context mostly within the last five decades. The creative momentum of fabric like 3D printed structures have come to the point of transforming as for the newest form of textile applications. Moreover, pioneering studies on the applications of 3D Printing Technology and Additive Manufacturing have been focusing on fashion and apparel sector from the last two decades beginning with fashion designers. After the advent of chain-mail like structures and flexible micro or meso structures created by SLS rapid manufacturing a more textile-like behavior is achieved. Thus, the primary aim of this paper is to discuss the most important properties of traditional fabrics that are to be expected of future fabrics. For this reason, this study deals primarily with the physical properties like softness, hand, flexibility, drapability and wearability of 3D Printed structures necessary to identify the possible ways in which it can be used instead of contemporary textile structures, namely knitted and woven fabrics. The aim of this study is to compare the physical properties of 3D printed fabrics regarding different rapid manufacturing methods (FDM and SLS). The implemented method was Material Driven Design (MDD), which comprise the use of innovative materials according to the production techniques such as 3D printing system. As a result, advanced textile processes and materials enable to the creation of new types of fabric structures and rapid solutions in the field of textiles and 3D fabrics on the other hand, are to be used in this regard.

Keywords: 3D printing technology, FDM, SLS, textile structure

Procedia PDF Downloads 339

Authors: Lucian Pîslaru-Dănescu, George-Claudiu Zărnescu, Laurențiu Constantin Lipan, Rareș-Andrei Chihaia

Abstract:

In recent years, the utilization of supercapacitors for energy storage (ES) devices that are designed for energy harvesting (EH) applications has increased substantially. The use of supercapacitors as energy storage devices in hybrid energy harvesting systems allows the miniaturization of electronic structures for energy storage. This study is concerned with the concept of energy management capacitors – supercapacitors and the new electronic structures for energy storage used for energy harvesting devices. Supercapacitors are low-voltage devices, and electronic overvoltage protection is needed for powering the source. The power management device that uses these proposed new electronic structures for energy storage is better than conventional electronic structures used for this purpose, like rechargeable batteries, supercapacitors, and hybrid systems. A hybrid energy harvesting system with energy storage management is able to simultaneously use several energy sources with recovery from the environment. The power management device uses a summing electronic block to combine the electric power obtained from piezoelectric composite plates and from a photovoltaic conversion system. Also, an overvoltage protection circuit used as a voltage detector and an improved concept of charging supercapacitors is presented. The piezoelectric composite plates are realized only by pressing two printed circuit boards together without damaging or prestressing the piezoceramic elements. The photovoltaic conversion system has the advantage that the modules are covered with glass plates with nanostructured film of ZnO with the role of anti-reflective coating and to improve the overall efficiency of the solar panels.

Keywords: supercapacitors, energy storage, electronic overvoltage protection, energy harvesting

Procedia PDF Downloads 82

Authors: Ayat Adnan Atwah, Muhammad A. Khan

Abstract:

Self-cleaning surfaces are getting significant attention in industrial fields. Especially for textile fabrics, it is observed that self-cleaning textile fabric surfaces are created by manipulating the surface features with the help of coatings and nanoparticles, which are considered costly and far more complicated. However, controlling the fabrication parameters of textile fabrics at the microscopic level by exploring the potential for self-cleaning has not been addressed. This study aimed to establish the context of self-cleaning textile fabrics by controlling the fabrication parameters of the textile fabric at the microscopic level. Therefore, 3D-printed textile fabrics were fabricated using the low-cost fused filament fabrication (FFF) technique. The printing parameters, such as orientation angle (O), layer height (LH), and extruder width (EW), were used to control the microscopic features of the printed fabrics. The combination of three printing parameters was created to provide the best self-cleaning textile fabric surface: (LH) (0.15, 0.13, 0.10 mm) and (EW) (0.5, 0.4, 0.3 mm) along with two different (O) of (45º and 90º). Three different thermoplastic flexible filament materials were used: (TPU 98A), (TPE felaflex), and (TPC flex45). The printing parameters were optimised to get the optimum self-cleaning ability of the printed specimens. Furthermore, the impact of these characteristics on mechanical strength at the fabric-woven structure level was investigated. The study revealed that the printing parameters significantly affect the self-cleaning properties after adjusting the selected combination of layer height, extruder width, and printing orientation. A linear regression model was effectively developed to demonstrate the association between 3D printing parameters (layer height, extruder width, and orientation). According to the experimental results, (TPE felaflex) has a better self-cleaning ability than the other two materials.

Keywords: 3D printing, self-cleaning fabric, microscopic features, printing parameters, fabrication

Procedia PDF Downloads 90

Authors: Yousaf Tariq

Abstract:

There are many reasons which are involved in electronic equipment failure i.e. temperature, humidity, dust, smoke etc. Corrosive gases are also one of the factor which may involve in failure of equipment. Sensitivity of electronic equipment increased when “lead-free” regulation enforced on manufacturers. In data center, equipment like hard disk, servers, printed circuit boards etc. have been exposed to gaseous contamination due to increase in sensitivity. There is a worldwide standard to protect electronic industrial electronic from corrosive gases. It is well known as “ANSI/ISA S71.04 – 1985 - Environmental Conditions for Control Systems: Airborne Contaminants. ASHRAE Technical Committee (TC) 9.9 members also recommended ISA standard in their whitepaper on Gaseous and Particulate Contamination Guideline for data centers. TC 9.9 members represented some of the major IT equipment manufacturers e.g. IBM, HP, Cisco etc. As per standard practices, first step is to monitor air quality in data center. If contamination level shows more than G1, it means that gas-phase air filtration is required other than dust/smoke air filtration. It is important that outside fresh air entering in data center should have pressurization/re-circulated process in order to absorb corrosive gases and to maintain level within specified limit. It is also important that air quality monitoring should be conducted once in a year. Temperature and humidity should also be monitored as per standard practices to maintain level within specified limit.

Keywords: corrosive gases, corrosion, electronic equipment failure, ASHRAE, hard disk

Procedia PDF Downloads 330