Search results for: Jun Murakami
13 Some Relationships between Classes of Reverse Watson-Crick Finite Automata
Authors: Kazuki Murakami, Takashige Nakamura, Noriko Sakamoto, Kunio Aizawa
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A Watson-Crick automaton is recently introduced as a computational model of DNA computing framework. It works on tapes consisting of double stranded sequences of symbols. Symbols placed on the corresponding cells of the double-stranded sequences are related by a complimentary relation. In this paper, we investigate a variation of Watson-Crick automata in which both heads read the tape in reverse directions. They are called reverse Watson-Crick finite automata (RWKFA). We show that all of following four classes, i.e., simple, 1-limited, all-final, all-final and simple, are equal to non-restricted version of RWKFA.Keywords: automaton, DNA computing, formal languages, Watson-Crick automaton
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 151612 Commercializing Technology Solutions- Moving from Products to Solutions
Authors: Anand Dass, Hiroaki Murakami
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The paper outlines the drivers behind the movement from products to solutions in the Hi-Tech Business-to-Business markets. The paper lists out the challenges in enabling the transformation from products to solutions and also attempts to explore strategic and operational recommendations based on the authors- factual experiences with Japanese Hi-tech manufacturing organizations. Organizations in the Hi-Tech Business-to-Business markets are increasingly being compelled to move to a solutions model from the conventional products model. Despite the added complexity of solutions, successful technology commercialization can be achieved by making prudent choices in defining a relevant solutions model, by backing the solution model through appropriate organizational design, and by overhauling the new product development process and supporting infrastructure.Keywords: Technology commercialization, Solutions, Hi-Tech companies, Japan, Management of technology
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 135711 An Approach to Solving a Permutation Problem of Frequency Domain Independent Component Analysis for Blind Source Separation of Speech Signals
Authors: Masaru Fujieda, Takahiro Murakami, Yoshihisa Ishida
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Independent component analysis (ICA) in the frequency domain is used for solving the problem of blind source separation (BSS). However, this method has some problems. For example, a general ICA algorithm cannot determine the permutation of signals which is important in the frequency domain ICA. In this paper, we propose an approach to the solution for a permutation problem. The idea is to effectively combine two conventional approaches. This approach improves the signal separation performance by exploiting features of the conventional approaches. We show the simulation results using artificial data.Keywords: Blind source separation, Independent componentanalysis, Frequency domain, Permutation ambiguity.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 178510 A Fast Directionally Constrained Minimization of Power Algorithm for Extracting a Speech Signal Perpendicular to a Microphone Array
Authors: Yasuhiko Okuma, Yuichi Suzuki, Takahiro Murakami, Yoshihisa Ishida
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In this paper, an extended method of the directionally constrained minimization of power (DCMP) algorithm for broadband signals is proposed. The DCMP algorithm is one of the useful techniques of extracting a target signal from observed signals of a microphone array system. In the DCMP algorithm, output power of the microphone array is minimized under a constraint of constant responses to directions of arrival (DOAs) of specific signals. In our algorithm, by limiting the directional constraint to the perpendicular direction to the sensor array system, the calculating time is reduced.Keywords: Beamformer, directionally constrained minimizationof power, direction of arrival, microphone array.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 16619 Application of Multi-Dimensional Principal Component Analysis to Medical Data
Authors: Naoki Yamamoto, Jun Murakami, Chiharu Okuma, Yutaro Shigeto, Satoko Saito, Takashi Izumi, Nozomi Hayashida
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Multi-dimensional principal component analysis (PCA) is the extension of the PCA, which is used widely as the dimensionality reduction technique in multivariate data analysis, to handle multi-dimensional data. To calculate the PCA the singular value decomposition (SVD) is commonly employed by the reason of its numerical stability. The multi-dimensional PCA can be calculated by using the higher-order SVD (HOSVD), which is proposed by Lathauwer et al., similarly with the case of ordinary PCA. In this paper, we apply the multi-dimensional PCA to the multi-dimensional medical data including the functional independence measure (FIM) score, and describe the results of experimental analysis.Keywords: multi-dimensional principal component analysis, higher-order SVD (HOSVD), functional independence measure (FIM), medical data, tensor decomposition
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 25028 A Support System Applicable to Multiple APIs for Haptic VR Application Designers
Authors: Masaharu Isshiki, Kenji Murakami, Shun Ido
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This paper describes a proposed support system which enables applications designers to effectively create VR applications using multiple haptic APIs. When the VR designers create applications, it is often difficult to handle and understand many parameters and functions that have to be set in the application program using documentation manuals only. This complication may disrupt creative imagination and result in inefficient coding. So, we proposed the support application which improved the efficiency of VR applications development and provided the interactive components of confirmation of operations with haptic sense previously. In this paper, we describe improvements of our former proposed support application, which was applicable to multiple APIs and haptic devices, and evaluate the new application by having participants complete VR program. Results from a preliminary experiment suggest that our application facilitates creation of VR applications.Keywords: VR application, Support system, Haptic devices, Haptic APIs.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 13467 An Approach for Blind Source Separation using the Sliding DFT and Time Domain Independent Component Analysis
Authors: Koji Yamanouchi, Masaru Fujieda, Takahiro Murakami, Yoshihisa Ishida
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''Cocktail party problem'' is well known as one of the human auditory abilities. We can recognize the specific sound that we want to listen by this ability even if a lot of undesirable sounds or noises are mixed. Blind source separation (BSS) based on independent component analysis (ICA) is one of the methods by which we can separate only a special signal from their mixed signals with simple hypothesis. In this paper, we propose an online approach for blind source separation using the sliding DFT and the time domain independent component analysis. The proposed method can reduce calculation complexity in comparison with conventional methods, and can be applied to parallel processing by using digital signal processors (DSPs) and so on. We evaluate this method and show its availability.Keywords: Cocktail party problem, blind Source Separation(BSS), independent component analysis, sliding DFT, onlineprocessing.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 16376 An Improved Algorithm for Calculation of the Third-order Orthogonal Tensor Product Expansion by Using Singular Value Decomposition
Authors: Chiharu Okuma, Naoki Yamamoto, Jun Murakami
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As a method of expanding a higher-order tensor data to tensor products of vectors we have proposed the Third-order Orthogonal Tensor Product Expansion (3OTPE) that did similar expansion as Higher-Order Singular Value Decomposition (HOSVD). In this paper we provide a computation algorithm to improve our previous method, in which SVD is applied to the matrix that constituted by the contraction of original tensor data and one of the expansion vector obtained. The residual of the improved method is smaller than the previous method, truncating the expanding tensor products to the same number of terms. Moreover, the residual is smaller than HOSVD when applying to color image data. It is able to be confirmed that the computing time of improved method is the same as the previous method and considerably better than HOSVD.
Keywords: Singular value decomposition (SVD), higher-orderSVD (HOSVD), outer product expansion, power method.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 16895 Accuracy of Displacement Estimation and Selection of Capacitors for a Four Degrees of Freedom Capacitive Force Sensor
Authors: Chisato Murakami, Makoto Takahashi
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Force sensor has been used as requisite for knowing information on the amount and the directions of forces on the skin surface. We have developed a four-degrees-of-freedom capacitive force sensor (approximately 20×20×5 mm3) that has a flexible structure and sixteen parallel plate capacitors. An iterative algorithm was developed for estimating four displacements from the sixteen capacitances using fourth-order polynomial approximation of characteristics between capacitance and displacement. The estimation results from measured capacitances had large error caused by deterioration of the characteristics. In this study, effective capacitors had major information were selected on the basis of the capacitance change range and the characteristic shape. Maximum errors in calibration and non-calibration points were 25%and 6.8%.However the maximum error was larger than desired value, the smallness of averaged value indicated the occurrence of a few large error points. On the other hand, error in non-calibration point was within desired value.
Keywords: Force sensors, capacitive sensors, estimation, iterative algorithms.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 16164 Rehabilitation Robot in Primary Walking Pattern Training for SCI Patient at Home
Authors: Taisuke Sakaki, Toshihiko Shimokawa, Nobuhiro Ushimi, Koji Murakami, Yong-Kwun Lee, Kazuhiro Tsuruta, Kanta Aoki, Kaoru Fujiie, Ryuji Katamoto, Atsushi Sugyo
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Recently attention has been focused on incomplete spinal cord injuries (SCI) to the central spine caused by pressure on parts of the white matter conduction pathway, such as the pyramidal tract. In this paper, we focus on a training robot designed to assist with primary walking-pattern training. The target patient for this training robot is relearning the basic functions of the usual walking pattern; it is meant especially for those with incomplete-type SCI to the central spine, who are capable of standing by themselves but not of performing walking motions. From the perspective of human engineering, we monitored the operator’s actions to the robot and investigated the movement of joints of the lower extremities, the circumference of the lower extremities, and exercise intensity with the machine. The concept of the device was to provide mild training without any sudden changes in heart rate or blood pressure, which will be particularly useful for the elderly and disabled. The mechanism of the robot is modified to be simple and lightweight with the expectation that it will be used at home.Keywords: Training, rehabilitation, SCI patient, welfare, robot.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 20373 Comparison between Higher-Order SVD and Third-order Orthogonal Tensor Product Expansion
Authors: Chiharu Okuma, Jun Murakami, Naoki Yamamoto
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In digital signal processing it is important to approximate multi-dimensional data by the method called rank reduction, in which we reduce the rank of multi-dimensional data from higher to lower. For 2-dimennsional data, singular value decomposition (SVD) is one of the most known rank reduction techniques. Additional, outer product expansion expanded from SVD was proposed and implemented for multi-dimensional data, which has been widely applied to image processing and pattern recognition. However, the multi-dimensional outer product expansion has behavior of great computation complex and has not orthogonally between the expansion terms. Therefore we have proposed an alterative method, Third-order Orthogonal Tensor Product Expansion short for 3-OTPE. 3-OTPE uses the power method instead of nonlinear optimization method for decreasing at computing time. At the same time the group of B. D. Lathauwer proposed Higher-Order SVD (HOSVD) that is also developed with SVD extensions for multi-dimensional data. 3-OTPE and HOSVD are similarly on the rank reduction of multi-dimensional data. Using these two methods we can obtain computation results respectively, some ones are the same while some ones are slight different. In this paper, we compare 3-OTPE to HOSVD in accuracy of calculation and computing time of resolution, and clarify the difference between these two methods.Keywords: Singular value decomposition (SVD), higher-order SVD (HOSVD), higher-order tensor, outer product expansion, power method.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 15612 Breakdown of LDPE Film under Heavy Water Absorption
Authors: Eka PW, T. Okazaki, Y. Murakami, N., Hozumi, M. Nagao
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The breakdown strength characteristic of Low Density Polyethylene films (LDPE) under DC voltage application and the effect of water absorption have been studied. Mainly, our experiment was investigated under two conditions; dry and heavy water absorption. Under DC ramp voltage, the result found that the breakdown strength under heavy water absorption has a lower value than dry condition. In order to clarify the effect, the temperature rise of film was observed using non contact thermograph until the occurrence of the electrical breakdown and the conduction current of the sample was also measured in correlation with the thermograph measurement. From the observations, it was shown that under the heavy water absorption, the hot spot in the samples appeared at lower voltage. At the same voltage the temperature of the hot spot and conduction current was higher than that under the dry condition. The measurement result has a good correlation between the existence of a critical field for conduction current and thermograph observation. In case of the heavy water absorption, the occurrence of the threshold field was earlier than the dry condition as result lead to higher of conduction current and the temperature rise appears after threshold field was significantly increased in increasing of field. The higher temperature rise was caused by the higher current conduction as the result the insulation leads to breakdown to the lower field application.Keywords: Low density polyethylene, heavy water absorption, conduction current, temperature rise.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 18791 Effect of Out-of-Plane Deformation on Relaxation Method of Stress Concentration in a Plate with a Circular Hole
Authors: Shingo Murakami, Shinichi Enoki
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In structures, stress concentration is a factor of fatigue fracture. Basically, the stress concentration is a phenomenon that should be avoided. However, it is difficult to avoid the stress concentration. Therefore, relaxation of the stress concentration is important. The stress concentration arises from notches and circular holes. There is a relaxation method that a composite patch covers a notch and a circular hole. This relaxation method is used to repair aerial wings, but it is not systematized. Composites are more expensive than single materials. Accordingly, we propose the relaxation method that a single material patch covers a notch and a circular hole, and aim to systematize this relaxation method. We performed FEA (Finite Element Analysis) about an object by using a three-dimensional FEA model. The object was that a patch adheres to a plate with a circular hole. And, a uniaxial tensile load acts on the patched plate with a circular hole. In the three-dimensional FEA model, it is not easy to model the adhesion layer. Basically, the yield stress of the adhesive is smaller than that of adherents. Accordingly, the adhesion layer gets to plastic deformation earlier than the adherents under the yield load of adherents. Therefore, we propose the three-dimensional FEA model which is applied a nonlinear elastic region to the adhesion layer. The nonlinear elastic region was calculated by a bilinear approximation. We compared the analysis results with the tensile test results to confirm whether the analysis model has usefulness. As a result, the analysis results agreed with the tensile test results. And, we confirmed that the analysis model has usefulness. As a result that the three-dimensional FEA model was used to the analysis, it was confirmed that an out-of-plane deformation occurred to the patched plate with a circular hole. The out-of-plane deformation causes stress increase of the patched plate with a circular hole. Therefore, we investigated that the out-of-plane deformation affects relaxation of the stress concentration in the plate with a circular hole on this relaxation method. As a result, it was confirmed that the out-of-plane deformation inhibits relaxation of the stress concentration on the plate with a circular hole.
Keywords: Stress concentration, patch, out-of-plane deformation, Finite Element Analysis.
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