%0 Journal Article
	%A Shingo Murakami and  Shinichi Enoki
	%D 2014
	%J International Journal of Mechanical and Mechatronics Engineering
	%B World Academy of Science, Engineering and Technology
	%I Open Science Index 96, 2014
	%T Effect of Out-of-Plane Deformation on Relaxation Method of Stress Concentration in a Plate with a Circular Hole
	%U https://publications.waset.org/pdf/9999882
	%V 96
	%X In structures, stress concentration is a factor of fatigue
fracture. Basically, the stress concentration is a phenomenon that
should be avoided. However, it is difficult to avoid the stress
concentration. Therefore, relaxation of the stress concentration is
important. The stress concentration arises from notches and circular
holes. There is a relaxation method that a composite patch covers a
notch and a circular hole. This relaxation method is used to repair
aerial wings, but it is not systematized. Composites are more
expensive than single materials. Accordingly, we propose the
relaxation method that a single material patch covers a notch and a
circular hole, and aim to systematize this relaxation method.
We performed FEA (Finite Element Analysis) about an object by
using a three-dimensional FEA model. The object was that a patch
adheres to a plate with a circular hole. And, a uniaxial tensile load acts
on the patched plate with a circular hole. In the three-dimensional FEA
model, it is not easy to model the adhesion layer. Basically, the yield
stress of the adhesive is smaller than that of adherents. Accordingly,
the adhesion layer gets to plastic deformation earlier than the adherents
under the yield load of adherents. Therefore, we propose the
three-dimensional FEA model which is applied a nonlinear elastic
region to the adhesion layer. The nonlinear elastic region was
calculated by a bilinear approximation. We compared the analysis
results with the tensile test results to confirm whether the analysis
model has usefulness. As a result, the analysis results agreed with the
tensile test results. And, we confirmed that the analysis model has
usefulness.
As a result that the three-dimensional FEA model was used to the
analysis, it was confirmed that an out-of-plane deformation occurred
to the patched plate with a circular hole. The out-of-plane deformation
causes stress increase of the patched plate with a circular hole.
Therefore, we investigated that the out-of-plane deformation affects
relaxation of the stress concentration in the plate with a circular hole
on this relaxation method. As a result, it was confirmed that the
out-of-plane deformation inhibits relaxation of the stress concentration
on the plate with a circular hole.

	%P 1980 - 1984