Abstracts | Electronics and Communication Engineering
Commenced in January 2007
Frequency: Monthly
Edition: International
Paper Count: 1236

World Academy of Science, Engineering and Technology

[Electronics and Communication Engineering]

Online ISSN : 1307-6892

6 The Maximum Throughput Analysis of UAV Datalink 802.11b Protocol

Authors: Inkyu Kim, SangMan Moon

Abstract:

This IEEE 802.11b protocol provides up to 11Mbps data rate, whereas aerospace industry wants to seek higher data rate COTS data link system in the UAV. The Total Maximum Throughput (TMT) and delay time are studied on many researchers in the past years This paper provides theoretical data throughput performance of UAV formation flight data link using the existing 802.11b performance theory. We operate the UAV formation flight with more than 30 quad copters with 802.11b protocol. We may be predicting that UAV formation flight numbers have to bound data link protocol performance limitations.

Keywords: UAV datalink, UAV formation flight datalink, UAV WLAN datalink application, UAV IEEE 802.11b datalink application

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5 Cost-Effective Hybrid Cloud Framework for Higher Educational Institutes

Authors: Shah Muhammad Butt, Ahmed Masaud Ansair

Abstract:

Present financial crisis in Higher Educational Institutes (HEIs) is causing lots of problems such as considerable budget cuts, which makes it difficult to meet the ever growing IT based research and learning needs. Institutions are rapidly planning and promoting cloud based approaches for their academic and research needs. A cost-effective hybrid cloud framework for HEIs will provide educational services for campus or intercampus communication. Hybrid cloud framework comprises private and public cloud approaches. This paper will propose the framework based on the Open Source Cloud (OpenNebula for Virtualization, Eucalyptus for Infrastructure and Aneka for programming development environment) combined with CSPs services which are delivered to the end-user via the internet from public clouds such as Google, Microsoft, Zoho, and Salesforce.

Keywords: educational services, hybrid campus cloud, open source, higher educational institutes

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4 Synchronization of Two Mobile Robots

Authors: R. M. López-Gutiérrez, J. A. Michel-Macarty, H. Cervantes-De Avila, J. I. Nieto-Hipólito, C. Cruz-Hernández, L. Cardoza-Avendaño, S. Cortiant-Velez

Abstract:

It is well know that mankind benefits from the application of robot control by virtual handlers in industrial environments. In recent years, great interest has emerged in the control of multiple robots in order to carry out collective tasks. One main trend is to copy the natural organization that some organisms have, such as, ants, bees, school of fish, birds’ migration, etc. Surely, this collaborative work, results in better outcomes than those obtain in an isolated or individual effort. This topic has a great drive because collaboration between several robots has the potential capability of carrying out more complicated tasks, doing so, with better efficiency, resiliency and fault tolerance, in cases such as: coordinate navigation towards a target, terrain exploration, and search-rescue operations. In this work, synchronization of multiple autonomous robots is shown over a variety of coupling topologies: star, ring, chain, and global. In all cases, collective synchronous behavior is achieved, in the complex networks formed with mobile robots. Nodes of these networks are modeled by a mass using Matlab to simulate them.

Keywords: robots, synchronization, bidirectional, coordinate navigation

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3 A New Criterion Using Pose and Shape of Objects for Collision Risk Estimation

Authors: DoHyeung Kim, DaeHee Seo, ByungDoo Kim, ByungGil Lee

Abstract:

As many recent researches being implemented in aviation and maritime aspects, strong doubts have been raised concerning the reliability of the estimation of collision risk. It is shown that using position and velocity of objects can lead to imprecise results. In this paper, therefore, a new approach to the estimation of collision risks using pose and shape of objects is proposed. Simulation results are presented validating the accuracy of the new criterion to adapt to collision risk algorithm based on fuzzy logic.

Keywords: collision risk, pose, shape, fuzzy logic

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2 Reflection Performance of Truncated Pyramidal and Truncated Wedge Microwave Absorber Using Sugarcane Bagasse (SCB)

Authors: Liyana Zahid, Mohd Fareq Abd Malek, Ee Meng Cheng, Wei Wen Liu, Yeng Seng Lee, Muhammad Nadeem Iqbal, Fwen Hoon Wee

Abstract:

One of the parameters that affect the performance of microwave absorbers is the shape of the absorbers. This paper shows the performance (reflection loss) of truncated pyramidal and truncated wedge microwave absorbers in the range frequency between 8.2 to 12.4 GHz (X-Band) in simulation. The material used is sugarcane bagasse (SCB) which is one of the new materials that used to fabricate the microwave absorber. The complex permittivity was measured using Agilent dielectric probe technique. The designs were simulated using CST Microwave Studio Software. The reflection losses between these two shapes were compared.

Keywords: microwave absorber, reflection loss, sugarcane bagasse (SCB), X-Band

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1 The Methodology of Flip Chip Using Astro Place and Route Tool

Authors: Rohaya Abdul Wahab, Raja Mohd Fuad Tengku Aziz, Nazaliza Othman, Sharifah Saleh, Nabihah Razali, Rozaimah Baharim, Md Hanif Md Nasir

Abstract:

This paper will discuss flip chip methodology, in which I/O pads, standard cells, macros and bump cells array are placed in the floorplan, then routed using Astro place and route tool. Final DRC and LVS checking is done using Calibre verification tool. The design vehicle to run this methodology is an OpenRISC design targeted to Silterra 0.18 micrometer technology with 6 metal layers for routing. Astro has extensive support for flip chip placement and routing. Astro tool commands for flip chip are straightforward approach like the conventional standard wire bond packaging. However since we do not have flip chip commands in our Astro tool, no LEF file for bump cell and no LEF file for flip chip I/O pad, we create our own methodology to prepare for future flip chip tapeout. 

Keywords: methodology, flip chip, bump cell, LEF, astro, calibre, SCHEME, TCL

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