WASET
    Mihai Brânzei and  Ioan Plotog and  Ion Pencea,  The Influence of Pad Thermal Diffusivity over Heat Transfer into the PCBs Structure.   journal   = {International Journal of Electronics and Communication Engineering}, [online]. World Academy of Science, Engineering and Technology.
    May 2013, vol. 77(5). 511 - 514
    [viewed 28 April 2024]. Available from: https://publications.waset.org/pdf/14796.