@article{(Open Science Index):https://publications.waset.org/pdf/14796,
	  title     = {The Influence of Pad Thermal Diffusivity over Heat Transfer into the PCBs Structure},
	  author    = {Mihai Brânzei and  Ioan Plotog and  Ion Pencea},
	  country	= {},
	  institution	= {},
	  abstract     = {The Pads have unique values of thermophysical
properties (THP) having important contribution over heat transfer
into the PCB structure.
Materials with high thermal diffusivity (TD) rapidly adjust their
temperature to that of their surroundings, because the HT is quick in
compare to their volumetric heat capacity (VHC).
In the paper is presenting the diffusivity tests (ASTM E1461 flash
method) for PCBs with different core materials. In the experiments,
the multilayer structure of PCBA was taken into consideration, an
equivalent property referring to each of experimental structure be
practically measured.
Concerning to entire structure, the THP emphasize the major
contribution of substrate in establishing of reflow soldering process
(RSP) heat transfer necessities. This conclusion offer practical
solution for heat transfer time constant calculation as function of
thickness and substrate material diffusivity with an acceptable error
estimation.},
	    journal   = {International Journal of Electronics and Communication Engineering},
	  volume    = {7},
	  number    = {5},
	  year      = {2013},
	  pages     = {511 - 514},
	  ee        = {https://publications.waset.org/pdf/14796},
	  url   	= {https://publications.waset.org/vol/77},
	  bibsource = {https://publications.waset.org/},
	  issn  	= {eISSN: 1307-6892},
	  publisher = {World Academy of Science, Engineering and Technology},
	  index 	= {Open Science Index 77, 2013},
	}