Commenced in January 2007
Frequency: Monthly
Edition: International
Paper Count: 2

Search results for: K. Shazlin

2 Agrowaste: Phytosterol from Durian Seed

Authors: D. Mohd Nazrul Hisham, J. Mohd Lip, R. Suri, H. Mohamed Shafit, Z.Kharis, K. Shazlin, A. Normah, M.F. Nurul Nabilah

Abstract:

Presence of phytosterol compound in Durian seed (Durio zibethinus) or known as King of fruits has been discovered from screening work using reagent test. Further analysis work has been carried out using mass spectrometer in order to support the priliminary finding. Isolation and purification of the major phytosterol has been carried out using an open column chromatography. The separation was monitored using thin layer chromatography (TLC). Major isolated compounds and purified phytosterol were identified using mass spectrometer and nuclear magnetic resonance (NMR). This novel finding could promote utilization of durian seeds as a functional ingredient in food products through production of standardized extract based on phytosterol content.

Keywords: Agrowaste, durian, seed, phytosterol

Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 2609
1 Evaluation of Alloying Additions on the Microstructure and IMC Formation of Sn-Ag-Cu Solder on Cu and Ni (P) Substrates

Authors: S.O. Shazlin, M.S. Nurulakmal

Abstract:

Studies have shown that the SnAgCu solder family has been widely used as a replacement for conventional Sn-Pb solders. An attractive approach is by introducing alloying additives (rare earth elements (RE), Zn, Co, Fe, Ni, Sb) into the SnAgCu solder, which helps in refining the microstructure also improving the mechanical and wetting properties of the solder. The present work focuses on the effect of additions of 0.5% Ce and Fe into Sn-3.0Ag-0.5Cu solder, in attempt to reduce the intermetallic compound (IMC) growth and reflow properties of the solder on Cu and Ni (P) surface finish, as well as effects thermal aging on the formation of intermetallic compound (IMC) on different surface finish. Excessive intermetallic compound growth may effect the interface and solder joint due to the brittle nature of the intermetallic compounds. Thus, by introducing alloying elements, IMC layer thickness can be decrease, resulting in better joint and solder reliability.

Keywords: Alloying Elements, Cu and Ni (P) Substrate, Intermetallic Compound (IMC), Reflow, Thermal Aging.

Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1405