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Effects of Various Substrate Openings for Electronic Cooling under Forced and Natural Convection

Authors: Shen-Kuei Du, Jen-Chieh Chang, Chia-Hong Kao, Tzu-Chen Hung, Chii-Ray Lin


This study experimentally investigates the heat transfer effects of forced convection and natural convection under different substrate openings design. A computational fluid dynamics (CFD) model was established and implemented to verify and explain the experimental results and heat transfer behavior. It is found that different opening position will destroy the growth of the boundary layer on substrates to alter the cooling ability for both forced under low Reynolds number and natural convection. Nevertheless, having too many opening may reduce heat conduction and affect the overall heat transfer performance. This study provides future researchers with a guideline on designing and electronic package manufacturing.

Keywords: CFD, Experiment, electronic cooling, opening concept

Digital Object Identifier (DOI):

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[1] A. Bar-Cohen, A. D. Kraus, and S. F. Davidson, "Thermal Frontiers in the Design and Packaging of Microelectronic Equipment," Eng., vol. 105, no. 6, 1983, pp. 53-59.
[2] L. T. Yeh, "Review of Heat Transfer Technologies in Electronic Equipment," ASME J. Electron. Packaging, vol. 117, 1995, pp. 333-339.
[3] F. P. Incropera, "Convection Heat Transfer in electronic equipment," ASME J. Heat Transfer, vol. 110, 1988, pp. 1097-1107.
[4] E. M. Sparrow, J. E. Niethammaer and A. Chaboki, "Heat transfer and pressure drop characteristics of arrays of rectangular modules encountered in electronics equipment," International J. Heat and Mass Transfer, vol. 25, no. 7, 1982, pp. 961-973.
[5] E. M. Sparrow, S. B. Verumi and D. S. Kadle, "Enhanced and local heat transfer, pressure drop, and flow visualization for arrays of block-like electronic components," International J. Heat and Mass Transfer, vol. 26, no. 5, 1983, pp. 689-699.
[6] E. M. Sparrow, A. A. Yanezmoreno and D. R. Otis, "Convective heat transfer response to height difference in an array of block-like electronic equipment," International J. Heat and Mass Transfer, vol. 27, no. 3, 1984, pp. 469-473.
[7] R. J. Moffat, A. Ortega and D. E. Arvizu, "Cooling electronic components: forced convection experiments with an air cooled array," Heat Transfer in Electronic Equipment, ASME HTD, vol. 48, 1985, pp. 15.
[8] Y. Asako and M. Faghri, "Three-dimensional heat transfer and fluid flow analysis of rectangular blocks encountered in electronic equipment," Numer. Heat Transfer, vol.13, 1988, pp. 481.
[9] T. C. Hung, S. K. Wang and F. P. Tsai, "Simulation of passively conjugate heat transfer across an array of volumetric heat sources," J. Communications in Numerical Methods in Engineering, vol. 13, 1997, pp. 855-866.
[10] T. C. Hung and C. S. Fu, "Conjugate heat transfer analysis for the passive enhancement of electronic cooling through geometric modification in a mixed convection domain," Numer. Heat Transfer-Part A, vol. 35, no. 5, 1999, pp. 519-535.
[11] T. C. Hung, "A conceptual desing of thermal modeling for efficiently cooling an array of heated devices under low Reynolds numbers," Numer. Heat Transfer-Part A, vol. 39, 2001, pp. 361-382.
[12] Y. S. Tseng, B. S. Bai and T.C. Hung, "Effects of thermal radiation on modified PCB Geometry under natural convection," Numer. Heat Transfer-Part A, vol. 51, 2007, pp. 195-210.
[13] Y. S. Tseng, T. C. Hung and B. S. Bai, "Enhancement of cooling characteristics for electronic cooling by modifying substrate under natural convection," ASME J. Electronic Packing, vol. 130, no. 1, 2008, pp. 11006.1-11006.8.
[14] Y. S. Tseng, H. H. Fu, T. C. Hung and B. S. Bai, "An optimal parametric design to improve chip cooling," International J. Applied Thermal Engineering, vol. 27, 2007, pp. 1823-1831.
[15] ANSYS Inc., FLUENTV12 User's Guide. 2009.
[16] Incropera, F. P., Dewitt, D. P., Bergman, T. L., Lavine, A. S., Introduction to heat transfer, 5th ed., New York:Wiley, 2005, ch. 13, pp. 773 and 785.
[17] Chui, E. H., Raithby, G. D., "Computation of radiant heat transfer on a non-orthogonal mesh using the finite-volume method," Numer. Heat Transfer-Part B, vol. 23, 1993, pp. 269-288.
[18] Chai, J.C., Lee, H.S., patanker, S. V., "Finite volume radiative heat transfer procedure for irregular geometries," J. Thermophys. Heat Transfer, vol. 19, no. 3, 1995, pp. 410-415.
[19] Kim, M.Y., Baek, S.W., "Numerical Analysis of conduction, convection, and radiation in a gradually expanding channel," Numer. Heat Transfer-Part A, vol 29, 1996, pp. 725-740.
[20] Baek, S.W., Kim, M.Y., "Nonorthogonal finite-volume solutions of radiative heat transfer in a three-dimensional enclosure," Numer. Heat Transfer-Part B, vol 34, pp. 419-437.
[21] Liu, J.S., Shang, H.M., Chen, Y.S., Wang, T.S., "Prediction of radiative transfer in general body-fitted coordinates," Numer. Heat Transfer-Part B, vol. 31, 1997, pp. 423-439.
[22] Byun, D. Y. Baek, S. W., Kim, M. Y., "Thermal radiation in a discretely heated irregular geometry using the Monte-Carlo, finite volume, and modified discrete ordinates interpolation method," Numer. Heat transfer- Part A, vol. 37, 2000, pp. 1-18.
[23] R. I. Issa, A. D. Gosman, and A. P. Watkins," The Computation of Compressible and incompressible recirculating flows by a non-iterative Implicit Scheme," J. Comput. Phys., vol. 62, 1986, pp. 66-82.
[24] R. I. Issa, B. Ahmadi-Befrui, K. R. Beshay, and A. D. Gosman, " Solution of the Implicit Discretized Reacting Flow Equations by Operator--Splitting," J. Comput. Phys., vol. 93, 1991, pp. 388-410.