Effects of Various Substrate Openings for Electronic Cooling under Forced and Natural Convection
This study experimentally investigates the heat transfer effects of forced convection and natural convection under different substrate openings design. A computational fluid dynamics (CFD) model was established and implemented to verify and explain the experimental results and heat transfer behavior. It is found that different opening position will destroy the growth of the boundary layer on substrates to alter the cooling ability for both forced under low Reynolds number and natural convection. Nevertheless, having too many opening may reduce heat conduction and affect the overall heat transfer performance. This study provides future researchers with a guideline on designing and electronic package manufacturing.
Digital Object Identifier (DOI): doi.org/10.5281/zenodo.1079130Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF
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