TY - JFULL AU - Shen-Kuei Du and Jen-Chieh Chang and Chia-Hong Kao and Tzu-Chen Hung and Chii-Ray Lin PY - 2011/7/ TI - Effects of Various Substrate Openings for Electronic Cooling under Forced and Natural Convection T2 - International Journal of Mechanical and Mechatronics Engineering SP - 1113 EP - 1121 VL - 5 SN - 1307-6892 UR - https://publications.waset.org/pdf/12399 PU - World Academy of Science, Engineering and Technology NX - Open Science Index 54, 2011 N2 - This study experimentally investigates the heat transfer effects of forced convection and natural convection under different substrate openings design. A computational fluid dynamics (CFD) model was established and implemented to verify and explain the experimental results and heat transfer behavior. It is found that different opening position will destroy the growth of the boundary layer on substrates to alter the cooling ability for both forced under low Reynolds number and natural convection. Nevertheless, having too many opening may reduce heat conduction and affect the overall heat transfer performance. This study provides future researchers with a guideline on designing and electronic package manufacturing. ER -