@article{(Open Science Index):https://publications.waset.org/pdf/12399,
	  title     = {Effects of Various Substrate Openings for Electronic Cooling under Forced and Natural Convection},
	  author    = {Shen-Kuei Du and  Jen-Chieh Chang and  Chia-Hong Kao and  Tzu-Chen Hung and  Chii-Ray Lin},
	  country	= {},
	  institution	= {},
	  abstract     = {This study experimentally investigates the heat transfer effects of forced convection and natural convection under different substrate openings design. A computational fluid dynamics (CFD) model was established and implemented to verify and explain the experimental results and heat transfer behavior. It is found that different opening position will destroy the growth of the boundary layer on substrates to alter the cooling ability for both forced under low Reynolds number and natural convection. Nevertheless, having too many opening may reduce heat conduction and affect the overall heat transfer performance. This study provides future researchers with a guideline on designing and electronic package manufacturing.
	    journal   = {International Journal of Mechanical and Mechatronics Engineering},
	  volume    = {5},
	  number    = {6},
	  year      = {2011},
	  pages     = {1114 - 1121},
	  ee        = {https://publications.waset.org/pdf/12399},
	  url   	= {https://publications.waset.org/vol/54},
	  bibsource = {https://publications.waset.org/},
	  issn  	= {eISSN: 1307-6892},
	  publisher = {World Academy of Science, Engineering and Technology},
	  index 	= {Open Science Index 54, 2011},