Search results for: non-slicing floorplan

2 Music-Inspired Harmony Search Algorithm for Fixed Outline Non-Slicing VLSI Floorplanning

Authors: K. Sivasubramanian, K. B. Jayanthi

Abstract:

Floorplanning plays a vital role in the physical design process of Very Large Scale Integrated (VLSI) chips. It is an essential design step to estimate the chip area prior to the optimized placement of digital blocks and their interconnections. Since VLSI floorplanning is an NP-hard problem, many optimization techniques were adopted in the literature. In this work, a music-inspired Harmony Search (HS) algorithm is used for the fixed die outline constrained floorplanning, with the aim of reducing the total chip area. HS draws inspiration from the musical improvisation process of searching for a perfect state of harmony. Initially, B*-tree is used to generate the primary floorplan for the given rectangular hard modules and then HS algorithm is applied to obtain an optimal solution for the efficient floorplan. The experimental results of the HS algorithm are obtained for the MCNC benchmark circuits.

Keywords: Floor planning, harmony search, non-slicing floorplan, very large scale integrated circuits.

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1 The Methodology of Flip Chip Using Astro Place and Route Tool

Authors: Rohaya Abdul Wahab, Raja Mohd Fuad Tengku Aziz, Nazaliza Othman, Sharifah Saleh, Nabihah Razali, Rozaimah Baharim, Md Hanif Md Nasir

Abstract:

This paper will discuss flip chip methodology, in which I/O pads, standard cells, macros and bump cells array are placed in the floorplan, then routed using Astro place and route tool. Final DRC and LVS checking is done using Calibre verification tool. The design vehicle to run this methodology is an OpenRISC design targeted to Silterra 0.18 micrometer technology with 6 metal layers for routing. Astro has extensive support for flip chip placement and routing. Astro tool commands for flip chip are straightforward approach like the conventional standard wire bond packaging. However since we do not have flip chip commands in our Astro tool, no LEF file for bump cell and no LEF file for flip chip I/O pad, we create our own methodology to prepare for future flip chip tapeout.

Keywords: Astro, bump cell, Calibre, flip chip, LEF, methodology, SCHEME, TCL.

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