Search results for: M. H. Rohaya

2 Effects of Coupling Agent and Flame Retardant on the Performances of Oil Palm Empty Fruit Bunch Fiber Reinforced Polypropylene Composites

Authors: R. Ridzuan, M. D. H. Beg, M. Y. Rosli, M. H. Rohaya, A. A. Astimar S. Samahani, I. Zawawi

Abstract:

Alkali treated oil palm empty fruit bunch (EFB) fibres (TEFBF) and untreated EFBF fibers (UEFBF) were incorporated in polypropylene (PP) with and without malic anhydride grafted PP (MAPP) and magnesium hydroxide as flame retardant (FR) to produce TEFBF-PP and UEFBF-PP composites by the melt casting method. The composites were characterized by mechanical and burning tests along with a scanning electron microscope and Fourier transform infrared spectroscopy. The significant improvement in flexural modulus (133%) and flame retardant property (60%) of TEFBF-PP composite with MAPP and FR is observed. The improved mechanical property is discussed by the development of encapsulated textures.

Keywords: Empty fruit bunch fibers, polypropylene, mechanical property, flame retardant.

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1 The Methodology of Flip Chip Using Astro Place and Route Tool

Authors: Rohaya Abdul Wahab, Raja Mohd Fuad Tengku Aziz, Nazaliza Othman, Sharifah Saleh, Nabihah Razali, Rozaimah Baharim, Md Hanif Md Nasir

Abstract:

This paper will discuss flip chip methodology, in which I/O pads, standard cells, macros and bump cells array are placed in the floorplan, then routed using Astro place and route tool. Final DRC and LVS checking is done using Calibre verification tool. The design vehicle to run this methodology is an OpenRISC design targeted to Silterra 0.18 micrometer technology with 6 metal layers for routing. Astro has extensive support for flip chip placement and routing. Astro tool commands for flip chip are straightforward approach like the conventional standard wire bond packaging. However since we do not have flip chip commands in our Astro tool, no LEF file for bump cell and no LEF file for flip chip I/O pad, we create our own methodology to prepare for future flip chip tapeout.

Keywords: Astro, bump cell, Calibre, flip chip, LEF, methodology, SCHEME, TCL.

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