Search results for: CMUT
2 Transimpedance Amplifier for Integrated 3D Ultrasound Biomicroscope Applications
Authors: Xiwei Huang, Hyouk-Kyu Cha, Dongning Zhao, Bin Guo, Minkyu Je, Hao Yu
Abstract:
This paper presents the design and implementation of a fully integrated transimpedance amplifier (TIA) as the analog frontend receiver for Capacitive Micromachined Ultrasound Transducers (CMUTs) for ultrasound biomicroscope imaging application. The amplifier is designed to amplify the received signals from 17.5MHz to 52.5MHz with a center frequency of 35MHz. The TIA was fabricated in GF 0.18μm 1P6M 30V high voltage process. The measurement results show that the designed amplifier can reach a transimpedance gain of 61.08dBΩ and operating frequency from 17.5MHz to 100MHz with 1VP-P output voltage under 6V power supply.
Keywords: 3D ultrasound biomicroscope, analog front-end, transimpedance amplifier, CMUT
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 27221 Analog Front End Low Noise Amplifier in 0.18-µm CMOS for Ultrasound Imaging Applications
Authors: Haridas Kuruveettil, Dongning Zhao, Cheong Jia Hao, Minkyu Je
Abstract:
We present the design of Analog front end (AFE) low noise pre-amplifier implemented in a high voltage 0.18-µm CMOS technology for a three dimensional ultrasound bio microscope (3D UBM) application. The fabricated chip has 4X16 pre-amplifiers implemented to interface a 2-D array of high frequency capacitive micro-machined ultrasound transducers (CMUT). Core AFE cell consists of a high-voltage pulser in the transmit path, and a low-noise transimpedance amplifier in the receive path. Proposed system offers a high image resolution by the use of high frequency CMUTs with associated high performance imaging electronics integrated together. Performance requirements and the design methods of the high bandwidth transimpedance amplifier are described in the paper. A single cell of transimpedance (TIA) amplifier and the bias circuit occupies a silicon area of 250X380 µm2 and the full chip occupies a total silicon area of 10x6.8 mm².
Keywords: Ultrasound, analog front end, medical imaging, beam forming, biomicroscope, transimpedance gain.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 8186