Commenced in January 2007
Frequency: Monthly
Edition: International
Paper Count: 31009
Two-dimensional Analytical Drain Current Model for Multilayered-Gate Material Engineered Trapezoidal Recessed Channel(MLGME-TRC) MOSFET: a Novel Design

Authors: Priyanka Malik A, Rishu Chaujar B, Mridula Gupta C, R.S. Gupta D


In this paper, for the first time, a two-dimensional (2D) analytical drain current model for sub-100 nm multi-layered gate material engineered trapezoidal recessed channel (MLGMETRC) MOSFET: a novel design is presented and investigated using ATLAS and DEVEDIT device simulators, to mitigate the large gate leakages and increased standby power consumption that arise due to continued scaling of SiO2-based gate dielectrics. The twodimensional (2D) analytical model based on solution of Poisson-s equation in cylindrical coordinates, utilizing the cylindrical approximation, has been developed which evaluate the surface potential, electric field, drain current, switching metric: ION/IOFF ratio and transconductance for the proposed design. A good agreement between the model predictions and device simulation results is obtained, verifying the accuracy of the proposed analytical model.


Digital Object Identifier (DOI):

Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1381


[1] S.A. Campbell, D.C. Gilmer, X. Wang, M. Hsieh, H-S. Kim, W.L. Gladfelter and J. Yan , "MOSFET transistors fabricated with high permittivity TiO2 dielectrics" IEEE Trans. Electron Devices vol. 44, pp.104-109, (1997).
[2] W. Tsai et a,l "Performance comparison of sub 1 nm sputtered TiN HfO2 nMOS and pMOSFETs" IEDM Tech., Dig. 311-314, (2003).
[3] H. Kimura, J. Mizuki, S. Kamiyama and H. Suzuki, "Extended x-ray absorption fine structure analysis of the difference in local structure of tantalum oxide capacitor films produced by various annealing methods" Appl. Phys. Lett. Vol. 66, pp.2209-2211, (1995).
[4] J-L Autran, D. Munteanu, M. Houssa, K. C. Coulie and A. Said, "Performance degradation induced by fringing field-induced barrier lowering and parasitic charge in double-gate metal-oxide semiconductor field-effect transistors with high-ê dielectrics" Japan. J. Appl. Phys. Vol. 44, 8362-6, (2005).
[5] S.J. Lee, C.H. Choi, A. Kamath, R. Clark and D.L. Kwong, " Characterization and reliability of dual high-k gate dielectric stack (poly-Si-HfO2-SiO2) prepared by in situ RTCVD process for systemon- chip applications" IEEE Electron Device Lett. Vol. 24, 105-107, (2003).
[6] T. Kauerauf, B. Govoreanu, R. Degraeve, G. Groeseneken and H. Maes, "Scaling CMOS: finding the gate stack with the lowest leakage current" Solid-State Electron. Vol. 49, 695-701, (2005).
[7] B.Cheng, M. Cao, R. Rao, A. Inani, P.V. Voorde, W.M. Greene, J.M.C. Stork, Z. Yu, P.M. Zeitoff and J.C.S. Woo , "The impact of high-k gate dielectrics and metal gate electrodes on sub-100 nm MOSFETs" IEEE Trans. Electron. Devices Vol. 46, pp. 1537, (1999).
[8] J. Zhang, J.S. Yuan and Y. Ma "Modeling short channel effect on highk and stacked gate MOSFETs" Solid-State Electron. Vol.44, pp. 2089, (2000).
[9] P.Malik, S.P.Kumar, R.Chaujar, M.Gupta, R.S.Gupta, "GATE MATERIAL ENGINEERED-TRAPIZIODAL RECESSED CHANNEL MOSFET FOR HIGH-PERFORMANCE ANALOG AND RF APPLICATIONS", Microwave and optical technology letters, Vol.52, march 2010.
[10] P.H. Bricout and E. Dubois "Short-channel effect immunity and current capability of sub-0.1-micron MOSFETs using a recessed channel" IEEE Trans. Electron. Devices Vol.43, pp.1251 (1996).
[11] H. Ren and Y. Hao "The influence of geometric structure on the hotcarrier- effect immunity for deep-sub-micron grooved gate PMOSFET Solid-State Electron". Vol.46, pp. 665 (2002).
[12] ATLAS: 3-D and DEVEDIT: 3D Device Simulator SILVACO International (2002).
[13] X.J. Zhang, H.X. Ren, Q. Feng and Y. Hao, Chin. J. Semiconductors, Vol.25, pp. 441, (2004) (in chinese)
[14] N.D. Arora, R.Rios, C-L Huang and K. Raol,"PCIM: A Physically Short-Channel IGFET Model for Circuit Simulation" IEEE Trans. Electron Devices, Vol.41, June 1994.