Commenced in January 2007
Paper Count: 31598
Development of Thermal Model by Performance Verification of Heat Pipe Subsystem for Electronic Cooling under Space Environment
Abstract:Heat pipes are used to control the thermal problem for electronic cooling. It is especially difficult to dissipate heat to a heat sink in an environment in space compared to earth. For solving this problem, in this study, the Poiseuille (Po) number, which is the main measure of the performance of a heat pipe, is studied by CFD; then, the heat pipe performance is verified with experimental results. A heat pipe is then fabricated for a spatial environment, and an in-house code is developed. Further, a heat pipe subsystem, which consists of a heat pipe, MLI (Multi Layer Insulator), SSM (Second Surface Mirror), and radiator, is tested and correlated with the TMM (Thermal Mathematical Model) through a commercial code. The correlation results satisfy the 3K requirement, and the generated thermal model is verified for application to a spatial environment.
Digital Object Identifier (DOI): doi.org/10.5281/zenodo.1061426Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1393
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