Development of Thermal Model by Performance Verification of Heat Pipe Subsystem for Electronic Cooling under Space Environment

Authors: MK Lee, JS Hong, SM Sin, HU Oh

Abstract:

Heat pipes are used to control the thermal problem for electronic cooling. It is especially difficult to dissipate heat to a heat sink in an environment in space compared to earth. For solving this problem, in this study, the Poiseuille (Po) number, which is the main measure of the performance of a heat pipe, is studied by CFD; then, the heat pipe performance is verified with experimental results. A heat pipe is then fabricated for a spatial environment, and an in-house code is developed. Further, a heat pipe subsystem, which consists of a heat pipe, MLI (Multi Layer Insulator), SSM (Second Surface Mirror), and radiator, is tested and correlated with the TMM (Thermal Mathematical Model) through a commercial code. The correlation results satisfy the 3K requirement, and the generated thermal model is verified for application to a spatial environment.

Keywords: CFD, Heat pipe, Radiator, Space.

Digital Object Identifier (DOI): doi.org/10.5281/zenodo.1061426

References:

[1] K. H. OH, M.K. LEE, and S.H.JEONG, "Design and fabrication of a metallic micro-heat pipe based on high-aspect-ratio microchannels," Heat transfer engineering, vol. 28, pp. 8-9, 2007.
[2] C. Aghanajafi, V. Vandadi, M.R. Shahnazari, " Investigation of Convection and Radiation Heat Transfer in Rhombus Microchannels," Int. J. Research and Reviews in Applied Sciences, vol 3. Issue 2, 2010
[3] S.J. Park, S. Cjung, H.W. Bang, C.I. Chung, D.C. Han, J.K. Chang, "Modeling and Designing of Microfludic System Using Poiseuille Number," 2nd Annual International IEEE-EMBS Special Topic Conference on Microtechnologies in Medicine and Bilology. Proceedings(Cat.No.02EX578), 2002
[4] S.H. Jin and J.H. Boo, "Performance Analysis of a Heat Pipe Radiator for Thermal Control of Satellites," unpublished, 1992
[5] N. Damean, P.P.L. Regtien, "Poiseuille number for the fully developed laminar flow through hexagonal ducts etched in <100> silicon," Sensors and Actuators A, vol. 90, pp. 96-101, 2001
[6] R.K. Shah, "Laminar flow friction and forced convection heat transfer in ducts of arbitrary geometry," Int. J. Heat Transfer, vol. 18, pp. 849-862, 1975
[7] A. Faghri and M. Buchko "Experimental and Numerical Analysis of Low-Temperature Heat Pipes with Multiple Heat Sources" Transactions of ASME: Journal of Heat Transfer, Vol. 113, pp. 728-734, 1991
[8] Chi, S.W., Heat Pipe Theory and Practice, New York, pp 54, 1976
[9] T.H. Kim, "An Experimental Study on Estimation of Heat Transport Capability for the Cross Section of Axially Grooved Heat Pipes", unpublished, 2001
[10] Gilmore, David G.,"Spacecraft Thermla Control Handbook", The Aerospace Press, El Segundo, CA., 2002
[11] "SINDA/FLUINT User-s Manual, Version 5.2", 2009, Cullimore and Ring Technologies, Inc.