%0 Journal Article %A MK Lee and JS Hong and SM Sin and HU Oh %D 2010 %J International Journal of Mechanical and Mechatronics Engineering %B World Academy of Science, Engineering and Technology %I Open Science Index 46, 2010 %T Development of Thermal Model by Performance Verification of Heat Pipe Subsystem for Electronic Cooling under Space Environment %U https://publications.waset.org/pdf/5644 %V 46 %X Heat pipes are used to control the thermal problem for electronic cooling. It is especially difficult to dissipate heat to a heat sink in an environment in space compared to earth. For solving this problem, in this study, the Poiseuille (Po) number, which is the main measure of the performance of a heat pipe, is studied by CFD; then, the heat pipe performance is verified with experimental results. A heat pipe is then fabricated for a spatial environment, and an in-house code is developed. Further, a heat pipe subsystem, which consists of a heat pipe, MLI (Multi Layer Insulator), SSM (Second Surface Mirror), and radiator, is tested and correlated with the TMM (Thermal Mathematical Model) through a commercial code. The correlation results satisfy the 3K requirement, and the generated thermal model is verified for application to a spatial environment. %P 1030 - 1034