@article{(Open Science Index):https://publications.waset.org/pdf/5644,
	  title     = {Development of Thermal Model by Performance Verification of Heat Pipe Subsystem for Electronic Cooling under Space Environment},
	  author    = {MK Lee and  JS Hong and  SM Sin and  HU Oh},
	  country	= {},
	  institution	= {},
	  abstract     = {Heat pipes are used to control the thermal problem for
electronic cooling. It is especially difficult to dissipate heat to a heat
sink in an environment in space compared to earth. For solving this
problem, in this study, the Poiseuille (Po) number, which is the main
measure of the performance of a heat pipe, is studied by CFD; then, the
heat pipe performance is verified with experimental results. A heat
pipe is then fabricated for a spatial environment, and an in-house code
is developed. Further, a heat pipe subsystem, which consists of a heat
pipe, MLI (Multi Layer Insulator), SSM (Second Surface Mirror), and
radiator, is tested and correlated with the TMM (Thermal
Mathematical Model) through a commercial code. The correlation
results satisfy the 3K requirement, and the generated thermal model is
verified for application to a spatial environment.},
	    journal   = {International Journal of Mechanical and Mechatronics Engineering},
	  volume    = {4},
	  number    = {10},
	  year      = {2010},
	  pages     = {1030 - 1034},
	  ee        = {https://publications.waset.org/pdf/5644},
	  url   	= {https://publications.waset.org/vol/46},
	  bibsource = {https://publications.waset.org/},
	  issn  	= {eISSN: 1307-6892},
	  publisher = {World Academy of Science, Engineering and Technology},
	  index 	= {Open Science Index 46, 2010},
	}