Switching Behaviors of HfO2/NiSix Based RRAM

Authors: Z. X. Chen, Z. Fang, X. P. Wang, G. -Q. Lo, D. -L. Kwong, Y. H. Wu

Abstract:

This paper presents a study of Ni-silicides as the bottom electrode of HfO₂-based RRAM. Various silicidation conditions were used to obtain different Ni concentrations within the Ni-silicide bottom electrode, namely Ni₂Si, NiSi, and NiSi₂. A 10nm HfO₂ switching material and 50nm TiN top electrode was then deposited and etched into 500nm by 500nm square RRAM cells. Cell performance of the Ni₂Si and NiSi cells were good, while the NiSi₂ cell could not switch reliably, indicating that the presence of Ni in the bottom electrode is important for good switching.

Keywords: HfO2-based, Ni-silicide, NiSi, resistive RAM (RRAM).

Digital Object Identifier (DOI): doi.org/10.5281/zenodo.1087774

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