Doping Profile Measurement and Characterization by Scanning Capacitance Microscope for PocketImplanted Nano Scale n-MOSFET
Commenced in January 2007
Frequency: Monthly
Edition: International
Paper Count: 32794
Doping Profile Measurement and Characterization by Scanning Capacitance Microscope for PocketImplanted Nano Scale n-MOSFET

Authors: Muhibul Haque Bhuyan, Farseem Mannan Mohammedy, Quazi Deen Mohd Khosru


This paper presents the doping profile measurement and characterization technique for the pocket implanted nano scale n-MOSFET. Scanning capacitance microscopy and atomic force microscopy have been used to image the extent of lateral dopant diffusion in MOS structures. The data are capacitance vs. voltage measurements made on a nano scale device. The technique is nondestructive when imaging uncleaved samples. Experimental data from the published literature are presented here on actual, cleaved device structures which clearly indicate the two-dimensional dopant profile in terms of a spatially varying modulated capacitance signal. Firstorder deconvolution indicates the technique has much promise for the quantitative characterization of lateral dopant profiles. The pocket profile is modeled assuming the linear pocket profiles at the source and drain edges. From the model, the effective doping concentration is found to use in modeling and simulation results of the various parameters of the pocket implanted nano scale n-MOSFET. The potential of the technique to characterize important device related phenomena on a local scale is also discussed.

Keywords: Linear Pocket Profile, Pocket Implanted n-MOSFET, Scanning Capacitance Microscope, Atomic Force Microscope.

Digital Object Identifier (DOI):

Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1960


[1] M. Nishida and H. Onodera, "An anomalous increase of threshold voltage with shortening the channel lengths for deeply boron-implanted n-channel MOSFETs," IEEE Transactions on Electron Devices, vol. 48, pp. 1101, 1981.
[2] M. Orlowski, C. Mazure, and F. Lau, "Submicron short-channel effects due to gate reoxidation induced lateral interstitial diffusion," in IEEE IEDM Technical Digest, 1987, pp. 87-632.
[3] C. Rafferty, H. Vuong, S. Eshraghi, M. Giles, M. Pinto, and S. Hillenius, "Explanation of reverse short-channel effect by defect gradients," in IEEE IEDM Technical Digest, 1993, pp. 93-311.
[4] G.G. Shahidi, J. Warnock, S. Fischer, P. A. McFarland, A. Acovic, S. Subbanna, E. Ganin, E. Crabbe, J. Comfort, J. Y.-C. Sun, T. H. Ning, and B. Davari, "High-performance devices for a 0.15-╬╝m CMOS technology," IEEE Electron Device Letters, vol. 14, pp. 466-468, Oct. 1993.
[5] B. Yu, C. H. J. Wann, E. D. Nowak, K. Noda, and C. Hu, "Short-channel effect improved by lateral channel-engineering in deep-submicronmeter MOSFET-s," IEEE Transactions on Electron Devices, vol. 44, pp. 627- 634, April 1997.
[6] S. M. Sze, "Physics of Semiconductor Devices," 2nd Edition, John Wiley and Sons, New York, ch. 8, 1981.
[7] P. C. Zalm, "The application of dynamic SIMS in silicon semiconductor technology," Philips Journal of Research, vol. 47, nos. 3-5, pp. 287-302, 1993.
[8] G. J. L. Ouwerling, "A problem-specific inverse method for twodimensional doping profile determination from capacitance-voltage measurements," Solid State Electronics, vol. 34, no. 2, pp. 197-214, 1991.
[9] N. Khalil, J. Faricelli, D. Bell, and Selberherr, "The extraction of twodimensional MOS transistor doping via inverse modeling," IEEE Electron Device Lett., vol. 16, pp. 17-19, Jan. 1995.
[10] Z. K. Lee, M. B. McIlrath and D. A. Antoniadis, "Two dimensional doping profile characterization of MOSFET-s by inverse modeling using I-V characteristics in the subthreshold region," IEEE Transactions on Electron Devices, vol. 46, pp. 1640-1649, Aug. 1999.
[11] R. N. Kleiman, M. L. O-Malley, F. H. Baumann, J. P. Garno and G. L. Timp, "Junction delineation of 0.15 m MOS devices using scanning capacitance mircoscopy," in IEDM Technical Digest, 1997, pp. 691-694.
[12] W. Rosner, W. Hansch, B. Moore, M. Orlowski, A. Spitzer, and C. Werner, DRC Proceedings, p. 9, 1990.
[13] S. T. Ahn and W. A. Tiller, Journal of Electrochemical Society, vol. 135, p. 2370, 1988.
[14] S. H. Goodwin-Johnson, R. Subrahmanyan, C.E. Floyd and H. Z. Massoud, "Two-dimensional impurity profiling with emission computed tomography techniques," IEEE Transactions on Computer Aided Design of Integrated Circuits and Systems, vol. 8, no. 4, pp. 323-335, 1989.
[15] C.C. Williams, J. Slinkman, W.P. Hough, and H.K. Wickramasinghe, "Lateral dopant profiling with 200 nm resolution by scanning capacitance microscopy," Applied Physics Letters, Vol. 55, no.16, p. 1662-1664, Oct. 1989.
[16] D. W. Abraham, C. Williams, J. Slikman, and H. K. Wickramasinghe, "Lateral dopant profiling in semiconductors by force microscopy using capacitive detection," Journal of Vacuum Science and Technology, vol. B9, pp. 703, 1991.
[17] S. Hosaka, S. Hosoki, K. Takata, K. Horiuchi, and N. Natsuaki, "Observation of pn junctions on implanted silicon using a scanning tunneling microscope," Applied Physics Letters, vol. 53, pp. 487, 1988.
[18] S. Kordic, E.J. Van Loenon, D. Dijkkamp, A.J. Hoeven and H.K. Moraai, "Scanning tunneling microscopy on cleaved silicon pn junctions," IEEE IEDM Technical Digest, pp. 277-280, 1989.
[19] J. R. Matey and J. Blanc, "Scanning capacitance microscopy," Journal of Applied Physics, vol. 57, no. 5, pp. 1437-1444, 1985.
[20] C. C. Williams, W. P. Hough and S. A. Rishton, "Scanning capacitance microscopy on a 25 nm scale," Applied Physics Letters, vol. 55, pp. 203 - 205, 1989.
[21] Y. Huang and C. C. Williams, "Capacitance-voltage measurement and modeling on a nanometer scale by scanning C-V microscopy," Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, vol. 12, no. 1, pp. 369-372, 1994.
[22] H. Edwards, R. McGlothlin, R. S. Martin, Elisa U, M. Gribelyuk, R. Mahaffy, C. K. Shih, R. S. List and V. A. Ukraintsev, "Scanning Capacitance Spectroscopy: An analytical technique for p-n junction delineation in Si devices," Applied Physics Letters vol. 72, 1998, pp. 698-700.
[23] W. Van Gelder and E.H. Nicollian, "Silicon impurity distribution as revealed by pulsed MOS C-V measurements," Solid State Science, Journal of Electrochemical Society, vol. 118, p. 138-141, 1971.
[24] M. H. Bhuyan and Q. D. M. Khosru, "Linear pocket profile based threshold voltage model for sub-100 nm n-MOSFET incorporating substrate and drain bias effects," in Proc. of the 5th International Conference on Electrical and Computer Engineering (ICECE 2008), 20-22 December 2008, Dhaka, Bangladesh, pp. 447-451.
[25] M. H. Bhuyan and Q. D. M. Khosru, "Linear profile based analytical surface potential model for pocket implanted sub-100 nm n-MOSFET," Journal of Electron Devices, France, ISSN 1682-3427, vol. 7, 2010, pp 235-240.
[26] M. H. Bhuyan and Q. D. M. Khosru, "Inversion layer effective mobility model for pocket implanted nano scale n-MOSFET," International Journal of Electrical and Electronics Engineering, ISSN 2010-3972, vol. 5, no. 1, Januay 2011, pp. 50-57.
[27] Muhibul Haque Bhuyan and Q. D. M. Khosru, "An Analytical Subthreshold Drain Current Model for Pocket Implanted Nano Scale n- MOSFET," Journal of Electron Devices, France, ISSN 1682-3427, vol. 8, October 2010, pp. 263-267.
[28] M. H. Bhuyan and Q. D. M. Khosru, "Low frequency drain current flicker noise model for pocket implanted nano scale n-MOSFET," in Proc. of the IEEE Nanotechnology Materials and Devices Conference (NMDC 2010), 12-15 October 2010, California, USA, pp. 295-299.