Search results for: polyimides

Authors: Zill-E-Huma, Humaira Siddiqi

Abstract:

This paper comprises of synthesis of thermally stable, mechanically strong polyimides. The polyimides were considered as most diverse class of polymers having unlimited applications. They were widely used as optical wave guides, in aerospace, for gas separation, as biomaterials and in electronics. Here the focus was to increase thermal stability and mechanical strength of polyimides. For this purpose two monomers were synthesized and were further polymerized via anhydrides to polyimides. The monomer diamines were synthesized by nucleophilic attack of aniline/2-fluoro aniline on hydroxy benzaldehydes. The two diamines synthesized were 3-(bis(4-aminophenyl) methyl) phenol (3OHDA) and 4-(bis(4-amino-3-fluorophenyl) methyl) phenol (2F4OHDA). These diamines were then reacted with dianhydrides to get polyimides. Two neat polyimides of both diamines with pyromellitic dianhydride (PMDA) and one neat polyimide of 4'-(Hexafluoroisopropylidene) diphthalic dianhydride (6FDA) with 3OHDA were synthesized. To compare the properties of synthesized polyimides like thermal stability, rigidity, flexibility, toughness etc. a commercial diamine oxydianiline (ODA) was used. Polyimides from oxydianiline were basically rigid. Nine different polyimide blends were synthesized from 3OHDA and commercial diamines ODA to have a better comparison of properties. TGA and mechanical testing results showed that with the increase in the percentage of 3OHDA in comparison to ODA the flexibility, toughness, strength of polyimide, thermal stability goes on increasing. So, synthesized diamines were responsible for improvement of properties of polyimides.

Keywords: diamines, dianhydrides, oxydianiline, polyimides

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Authors: Yogesh S. Patel

Abstract:

Novel polyimides were synthesized by Diels–Alder polymerization. Bisfuran was reacted with a couple of bismaleimides containing diglycidyl ether of bisphenol-A and F (epoxy) segment to obtain Diels–Alder polyadducts. Polyadducts were then aromatized and imidized (i.e. cyclized) through carboxylic and amide groups to afford polyimides. Synthesized polyadducts and polyimides were characterized by elemental analysis, spectral features, the number of average molecular weight (Mn) and thermal analysis. The ‘in situ’ glass fiber reinforced composites were prepared and characterized by mechanical, electrical, and chemical properties. These properties were compared with the other reported polyimides. All the composites showed good mechanical and electrical properties and good resistance to organic solvents and mineral acids.

Keywords: Diels-Alder reaction, bisfuran, bismaleimides, polyimide

Procedia PDF Downloads 347

Authors: Tariku Nefo Duke

Abstract:

Herein, we synthesized three PIs/h-boron nitride composite films for corrosion resistance of mild steel material. The structures of these three polyimide/h-boron nitride composite films were confirmed using (FTIR, 1H NMR, 13C NMR, and 2D NMR) spectroscopy techniques. The synthesized PIs composite films have high mechanical properties, thermal stability, high glass-transition temperature (Tg), and insulating properties. It has been shown that the presence of electroactive TiO2, SiO2, and h-BN, in polymer coatings effectively inhibits corrosion. The h-BN displays an admirable anti-corrosion barrier for the 6F-OD and BT-OD films. PI/ h-BN composite films of 6F-OD exhibited better resistance to water vapor, high corrosion resistance, and positive corrosion voltage. Only four wt. percentage of h-BN in the composite is adequate.

Keywords: polyimide, corrosion resistance, electroactive, Tg

Procedia PDF Downloads 164

Authors: Hati̇ce Bi̇rtane, Asli Beyler Çi̇ği̇l, Memet Vezi̇r Kahraman

Abstract:

Polyimide (PI) is one of the most important super-engineering materials because of its mechanical properties and its thermal stability. Electronic industry is the typical extensive applications of polyimides including interlayer insulation films, buffer coating, films, alpha-ray shielding films, and alignment films for liquid crystal displays. The mechanical and thermal properties of polymers are generally improved by the addition of inorganic additives. The challenges in this area of high-performance organic/inorganic hybrid materials are to obtain significant improvements in the interfacial adhesion between the polymer matrix and the reinforcing material since the organic matrix is relatively incompatible with the inorganic phase. In this study, modified nanodiamond was prepared from the reaction of nanodiamond and (3-Mercaptopropyl)trimethoxysilane. Poly(amic acid) was prepared from the reaction of 3,3',4,4'-Benzophenonetetracarboxylic dianhydride (BTDA) and 4,4'-Oxydianiline (ODA). Polyimide/modified nanodiamond hybrids were prepared by blending of poly(amic acid) and organically modified nanodiamond. The morphology of the Polyimide/ modified nanodiamond hybrids was characterized by scanning electron microscopy (SEM). Chemical structure of polyimide and Polyimide/modified nanodiamond hybrids was characterized by FTIR. FTIR results showed that the Polyimide/modified nanodiamond hybrids were successfully prepared. A thermal property of the Polyimide/modified nanodiamond hybrids was characterized by thermogravimetric analysis (TGA).

Keywords: hybrid materials, nanodiamond, polyimide, polymer

Procedia PDF Downloads 211