Search results for: Syang-Peng Rwei

Authors: Ragu Sasikumar, Palraj Ranganathan, Shen-Ming Chen, Syang-Peng Rwei

Abstract:

A highly sensitive, and selective α-Lipoic acid (ALA) sensor based on a functionalized multi-walled carbon nanotubes-polyindole/Ti2O3 (f-MWCNTs-PIN/Ti2O3) nanocomposite modified glassy carbon electrode (GCE) was developed. The fabricated f-MWCNTs-PIN/Ti2O3/GCE displayed an enhanced voltammetric response for oxidation towards ALA relative to that of a f-MWCNTs/GCE, f-MWCNTs-PIN/GCE, Ti2O3/GCE, and a bare GCE. Under optimum conditions, the f-MWCNTs-PIN/Ti2O3/GCE showed a wide linear range at ALA concentrations of 0.39-115.8 µM. The limit of detection of 12 nM and sensitivity of about 6.39 µA µM-1cm-2. The developed sensor showed anti-interference, reproducibility, good repeatability, and operational stability. Applied possibility of the sensor has been confirmed in vegetable samples.

Keywords: f-MWCNT, polyindole, Ti2O3, Alzheimer’s diseases, ALA sensor

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Authors: Rwei-Ching Chang, Bo-Yu Su

Abstract:

Adhesion of copper thin films deposited on polyethylene terephthAdhesion of copper thin films deposited on polyethylene terephthalate substrate by direct current sputtering with different sputtering parameters is discussed in this work. The effects of plasma treatment with 0, 5, and 10 minutes on the thin film properties are investigated first. Various argon flow rates at 40, 50, 60 standard cubic centimeters per minute (sccm), deposition power at 30, 40, 50 W, and film thickness at 100, 200, 300 nm are also discussed. The 3-dimensional surface profilometer, micro scratch machine, and optical microscope are used to characterize the thin film properties. The results show that the increase of the plasma treatment time on the polyethylene terephthalate surface affects the roughness and critical load of the films. The critical load increases as the plasma treatment time increases. When the plasma treatment time was adjusted from 5 minutes to 10 minutes, the adhesion increased from 8.20 mN to 13.67 mN. When the argon flow rate is decreased from 60 sccm to 40 sccm, the adhesion increases from 8.27 mN to 13.67 mN. The adhesion is also increased by the condition of higher power, where the adhesion increased from 13.67 mN to 25.07 mN as the power increases from 30 W to 50 W. The adhesion of the film increases from 13.67 mN to 21.41mN as the film thickness increases from 100 nm to 300 nm. Comparing all the deposition parameters, it indicates the change of the power and thickness has much improvement on the film adhesion.alate substrate by direct current sputtering with different sputtering parameters is discussed in this work. The effects of plasma treatment with 0, 5, and 10 minutes on the thin film properties are investigated first. Various argon flow rates at 40, 50, 60 standard cubic centimeters per minute (sccm), deposition power at 30, 40, 50 W, and film thickness at 100, 200, 300 nm are also discussed. The 3-dimensional surface profilometer, micro scratch machine, and optical microscope are used to characterize the thin film properties. The results show that the increase of the plasma treatment time on the polyethylene terephthalate surface affects the roughness and critical load of the films. The critical load increases as the plasma treatment time increases. When the plasma treatment time was adjusted from 5 minutes to 10 minutes, the adhesion increased from 8.20 mN to 13.67 mN. When the argon flow rate is decreased from 60 sccm to 40 sccm, the adhesion increases from 8.27 mN to 13.67 mN. The adhesion is also increased by the condition of higher power, where the adhesion increased from 13.67 mN to 25.07 mN as the power increases from 30 W to 50 W. The adhesion of the film increases from 13.67 mN to 21.41mN as the film thickness increases from 100 nm to 300 nm. Comparing all the deposition parameters, it indicates the change of the power and thickness has much improvement on the film adhesion.

Keywords: flexible substrate, sputtering, adhesion, copper thin film

Procedia PDF Downloads 130