Search results for: A. Keffous

Authors: S. Kaci, A. Keffous, O. Fellahi, I. Bozetine, H. Menari

Abstract:

In this paper, we report the fabrication and characterization of Acropora-like lead sulfide nanostructured thin films using chemical bath deposition. The method has the strong points of low temperature and no surfactant, comparing with the other method. The preferential growth directions of the broad branches were indexed as along (200) directions. The photoelectrochemical property of the as-deposited thin films was also investigated. Photoelectrochemical characterization was performed in the aim to determine the flat band potential (Vfb) and to confirm the n-type character of PbS, elucidated from the J(V) curves both in the dark and under illumination. The apparition of the photocurrent Jph started at a potential VON of −0.41 V/ECS and increased towards the anodic direction, which is typical of n-type behavior. The near infrared absorbance spectrum displayed an absorbance edge at 1959 nm, showing blue shift comparing to bulk PbS (3020 nm). These nanostructured lead sulfide thin films may have potential application as dispersed photoelectrode capable of generating H2 under visible light.

Keywords: lead sulfide, nanostructures, photo-conversion, thin films

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Authors: Karima Bourenane, Aissa Keffous

Abstract:

In this paper, we present an experimental method on the etching reaction of p-type 6H-SiC, etching that was carried out in HF/K₂Cr₂O₇ solutions. The morphology of the etched surface was examined with varying K₂Cr₂O₇ concentrations, etching time and temperature solution. The surfaces of the etched samples were analyzed using Scanning electron microscopy (SEM), Fourier transform infrared spectroscopy (FT-IR) and Photoluminescence. The surface morphology of samples etched in HF/K₂Cr₂O₇ is shown to depend on the solution composition and bath temperature. The investigation of the HF/K₂Cr₂O₇ solutions on 6H-SiC surface shows that as K₂Cr₂O₇ concentration increases, the etch rate increases to reach a maximum value at about 0.75 M and then decreases. Similar behavior has been observed when the temperature of the solution is increased. The maximum etch rate is found for 80 °C. Taking into account the result, a polishing etching solution of 6H-SiC has been developed. In addition, the result is very interesting when, to date, no chemical polishing solution has been developed on silicon carbide (SiC). Finally, we have proposed a dissolution mechanism of the silicon carbide in HF/K₂Cr₂O₇ solutions.

Keywords: silicon carbide, dissolution, Chemical etching, mechanism

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