Thermal Management of a Compact Electronic Device Subjected to Different Harsh Operating Conditions

Authors: Murat Parlak, Muhammed Çağlar Malyemez

Abstract:

In a harsh environment, it is crucialtoinvestigatethethermal problem systematically implement a reliableandeffectivecoolingtechniqueformilitaryequipment. In this study, an electronicaldevice has been designed to fit different boundary conditions. Manyfinalternatives can be possiblesolutionsforthethermal problem. Therefore, it is an important step to define an easyproduciblefindesignand a low power fan selection for the optimum unit-design satisfying IP68. The equipment is planned to serve at 71C environment conditions and it also can be screwedto a cold plate at +85C. In both conditions, it is intendedtousethesamechassiswithoutanymodifications. To optimize such a ruggeddevice, all CFD analysis has been done withAnsysFluent 2021®. Afterstudyingpinfins, it is seenthatthesurfacearea is not enough, hencethefin-type is changed to a straightrectangulartypewithforcedconvectioncooling. Finally, a verycompactproductthat can serve in a harsh environment is obtained.

Keywords: electronic cooling, harsh environment, forced convection, compact design