Microswitches with Sputtered Au, Aupd, Au-on-Aupt, and Auptcu Alloy - Electric Contacts
Commenced in January 2007
Frequency: Monthly
Edition: International
Paper Count: 84460
Microswitches with Sputtered Au, Aupd, Au-on-Aupt, and Auptcu Alloy - Electric Contacts

Authors: Nikolay Konukhov

Abstract:

This paper to report on a new analytic model for predicting microcontact resistance and the design, fabrication, and testing of microelectromechanical systems (MEMS) metal contact switches with sputtered bimetallic (i.e., gold (Au)-on-Au-platinum (Pt), (Au-on-Au-(6.3at%)Pt)), binary alloy (i.e., Au-palladium (Pd), (Au-(3.7at%)Pd)), and ternary alloy (i.e., Au-Pt-copper (Cu), (Au-(5.0at%)Pt-(0.5at%)Cu)) electric contacts. The microswitches with bimetallic and binary alloy contacts resulted in contact resistance values between 1–2

Keywords: alloys, electric contacts, microelectromechanical systems (MEMS), microswitch

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