An Experimental Investigation of Thermoelectric Air-Cooling Module

Authors: Yu-Wei Chang, Chiao-Hung Cheng, Wen-Fang Wu, Sih-Li Chen

Abstract:

This article experimentally investigates the thermal performance of thermoelectric air-cooling module which comprises a thermoelectric cooler (TEC) and an air-cooling heat sink. The influences of input current and heat load are determined. And performances under each situation are quantified by thermal resistance analysis. Since TEC generates Joule heat, this nature makes construction of thermal resistance network difficult. To simplify the analysis, this article emphasizes on the resistance heat load might meet when passing through the device. Therefore, the thermal resistances in this paper are to divide temperature differences by heat load. According to the result, there exists an optimum input current under every heating power. In this case, the optimum input current is around 6A or 7A. The performance of the heat sink would be improved with TEC under certain heating power and input current, especially at a low heat load. According to the result, the device can even make the heat source cooler than the ambient. However, TEC is not always effective at every heat load and input current. In some situation, the device works worse than the heat sink without TEC. To determine the availability of TEC, this study figures out the effective operating region in which the TEC air-cooling module works better than the heat sink without TEC. The result shows that TEC is more effective at a lower heat load. If heat load is too high, heat sink with TEC will perform worse than without TEC. The limit of this device is 57W. Besides, TEC is not helpful if input current is too high or too low. There is an effective range of input current, and the range becomes narrower when the heat load grows.

Keywords: Thermoelectric cooler, TEC, electronic cooling, heat sink.

Digital Object Identifier (DOI): doi.org/10.5281/zenodo.1333628

References:

[1] D. Strassberg, "Cooling Hot Microprocessor," EDN, vol. 39, 1994, pp. 40-50.
[2] R.C. Chu, "Thermal management roadmap cooling electronic products from handheld device to supercomputers," MIT Rohsenow Symposium, Cambridge, MA, May 2002.
[3] G. S. Nolas, G. A. Slack, J. L. Cohn, and S. B. Schujman, "The Next Generation of Thermoelectric Materials," in 1995 Proc. of the 17th Int. Conf. on Thcrmoclcctrics, pp. 294-297.
[4] A. D. Kraus, A. Bar-Cohen, Thermal Analysis and Control of Electronic Equipment, HEMISPHERE, Washington, 1983, ch. 18.
[5] S. B. Riffat, X. Ma, "Thermoelectrics: a review of present and potential applications," Appl. Thermal Eng., vol. 23, 2003, pp. 913-935.
[6] W. L. Kolander, H. B. Lyon, "Thermoelectric Cooler Utility for Electronic Applications," ASME HTD-Vol. 239, National Heat Transfer Conference, vol. 7, 1996.
[7] J. W. Vandersande, J. P. Fleurial, "Thermal Management of Power Electronics Using Thermoelectric Coolers," in 1996 Proceedings of the 15th International Conference on Thermoelectrics, pp. 252-255.
[8] J. G. Stockholm, "Current State of Peltier Cooling," in 1997 Proceedings of the 16th International Conference on Thermoelectrics, pp. 37-46.
[9] D. T. Morelli, "Potential Applications of Advanced Thermoelectrics in the Automobile Industry," in 1996 Proceedings of the 13th International Conference on Thermoelectrics, pp. 383-386.
[10] Gilley et al., "Thermoelectric refrigerator with evaporating/condensing heat exchanger (Patent style)," US Patent 6003319, December 21, 1999.
[11] D. Astrain, J. G. Vián, M. Domínguez, "Increase the COP in the Thermoelectric Refrigeration by the Optimization of Heat Dissipation," Applied Thermal Eng., vol. 23, 2003, pp. 2183-2200.
[12] S. B. Riffat, S. A. Omer, X. Ma, "A Novel Thermoelectric Refrigeration System employing Heat Pipes and a Phase Material: an Experimental Investigation," Renewable Energy, vol. 23, 2001, pp. 313-323.
[13] J. Y. Hammoud, N. Abazardia, "Effects of the Liquid Inlet Temperature on the Thermoelectric Cooler Performance in a Liquid-TEC Thermal System", in 2002 21st International Conference on Thermoelectrics, pp. 506-510.
[14] M. Chung, N. M. Miskovsky, P. H. Cutler, N. Kumar, V. Patel, "Theoretical analysis of a field emission enhanced semiconductor thermoelectric cooler", Solid-State Electronics, vol. 47, 2003, pp.1745-1751.
[15] A. Chakraborty, B. B. Saha, S. Koyama, K. C. Ng, "Thermodynamic modelling of a solid state thermoelectric cooling device: Temperature-entropy analysis", Int. Journal of Heat and Mass Transfer, vol. 49, 2006, pp.3547-3554.
[16] B. J. Huang, C. J. Chin, C. L. Duang, "A Design Method of Thermoelectric Coolers," Int. Journal of Refrigeration, vol. 23, 2000, pp. 208-218.