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Numerical Analysis on the Performance of Heatsink with Microchannels

Authors: Jer-Huan Jang, Han-Chieh Chiu, Wei-Chung Yeih, Jia-Jui Yang, Chien-Sheng Huang

Abstract:

In this paper, numerical simulation is used to investigate the thermal performance of liquid cooling heatsink with microchannels due to geometric arrangement. Commercial software ICEPAK is utilized for the analysis. The considered parameters include aspect ratio, porosity and the length and height of microchannel. The aspect ratio varies from 3 to 16 and the length of microchannel is 10mm, 14mm, and 18mm. The height of microchannel is 2mm, 3mm and 4mm. It is found short channel have better thermal efficiency than long channel at 490Pa. No matter the length of channel the best aspect ratio is 4. It is also noted that pressure difference at 2940Pa the best aspect ratio from 4 to 8, it means pressure difference affect aspect ratio, effective thermal resistance at low pressure difference but lower effective thermal resistance at high pressure difference.

Keywords: Numerical Analysis, Thermal Resistance, microchannels, liquid cooling, pressure difference

Digital Object Identifier (DOI): doi.org/10.5281/zenodo.1058663

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References:


[1] D.B. Tuckermann and R.F.W. Pease, High performance heat sinking for VLSI,IEEE Electronic Device Lett. EDL-2, pp.126-129, 1981.
[2] X.F. Peng, B.X. Wang, G.P. Peterson, and H.B. Ma, Experimental investigation of heat transfer in flat plates with rectangular microchannels, Int. J. Heat Mass Transfer, 38, pp. 127-137, 1995.
[3] X.F. Peng and G.P. Peterson, Friction flow characteristics of water flowing through rectangular microchannels, J. Exp. Heat Transfer, 7, pp. 249-264, 1995.
[4] X.F. Peng and G.P. Peterson, Convective heat transfer and flow friction for water flow in microchannel structures, Int. J. Heat Mass Transfer, 39, pp. 2599-2608, 1996.
[5] W. Qu, G. M. Mala, and D. Li, Heat transfer for water flow in trapezoidal silicon microcahnnels, Int. J. Heat Mass Transfer, 43, pp. 3925-3936, 2000.
[6] M.M. Rahman, Measurements of heat transfer in microchannel heat sink, Int. Comm. Heat MassTransfer, 27, pp. 495-506, 2000.
[7] S. M. Kim and I. Mudawar, Analytical heat diffusion models for different micro-channel heat sink cross-sectional geometries, Int. J. Heat Mass Transfer, 53, pp. 4002-4016, 2010.
[8] S. M. Kim and I. Mudawar, Analytical heat diffusion models for heat sinks with circular micro-channels, Int. J. Heat Mass Transfer, 53, pp. 4552-4566, 2010.
[9] P. Gunnasegaran, H. A. Mohammed, N. H. Shuaib, and R. Saidur, The effect of geometrical parameters on heat transfer characteristics of microchannels heat sink with different shapes, Int. Comm. Heat Mass Transfer, 37, pp. 1078-1086, 2010.
[10] Y. Chen, C. Zhang, M. Shi, and J. Wu, Three-dimensional numerical simulation of heat and fluid flow in noncircular microchannel heat sinks, Int. Comm. Heat Mass Transfer, 36, pp. 917-920, 2009.
[11] J. P. McHale, and S. V. Garimella, Heat transfer in trapezoidal microchannels of various aspect ratios, Int. J. Heat Mass Transfer, 53, pp. 365-375, 2010.
[12] H.S. Kou, J.J. Lee, and C.W. Chen, Optimal thermal performance of microchannel heatsink by adjusting channel width and height, Int. Comm. Heat MassTransfer, 35, pp. 577-582, 2008.
[13] K. Foli, T. Okabe, M. Olhofer, Yaochu Jin, and B. Sendhoff, Optimization of the micro heat exchanger: CFD, analytical approach and multi-objective evolutionary algorithms, Int. J. Heat Mass Transfer 49, pp. 1090-1099, 2005.
[14] J. Li and G.P. Peterson, 3-Dimensional numerical optimization of silicon-based high performance parallel microchannel heatsink with liquid flow, Int. J. Heat Mass Transfer, 50, pp. 2895-2904 ,2007.
[15] C.H. Chen, Forced convection heat transfer in microchannel heatsinks, Int. J. Heat Mass Transfer, 50, pp. 2182-2189, 2007.
[16] R.W. Knight, J.S. Goodling and D. J. Hall, Optimal thermal design of forced convection heatsinks---Analytical, ASME J. Electron. Packag., 113, pp. 313-321, 1986.
[17] S.J. Kim and D. Kim, Forced convection in microstructures for electronic equipment cooling, ASME J. Heat Transfer, 121, pp. 635-645, 1999.
[18] C.Y. Zhao and T.J. Lu, Analysis of microchannel heatsinks for electronics cooling, Int. J. Heat Mass Transfer, 45, pp. 4857-4869, 2002.
[19] P.S. Lee, S.V. Garimella, and D. Liu, Investigation of heat transfer in rectangular microchannels, Int. J. Heat Mass Transfer, 48, pp. 1688-1704, 2005.
[20] H.C. Chiu, J.H. Jang, H.W. Yeh, and M.S. Wu, The heat transfer characteristics of liquid cooling heatsink containing microchannels, Int. J. Heat Mass Transfer, 54, pp. 34-42, 2011.
[21] K. Vafai and L. Zhu, Analysis of two-layered micro-channel heat sink concept in electronic cooling, Int. J. Heat Mass Transfer, 42, pp. 2287-2297, 1997.