**Commenced**in January 2007

**Frequency:**Monthly

**Edition:**International

**Paper Count:**30517

##### Numerical Analysis on the Performance of Heatsink with Microchannels

**Authors:**
Jer-Huan Jang,
Han-Chieh Chiu,
Wei-Chung Yeih,
Jia-Jui Yang,
Chien-Sheng Huang

**Abstract:**

**Keywords:**
Numerical Analysis,
Thermal Resistance,
microchannels,
liquid cooling,
pressure difference

**Digital Object Identifier (DOI):**
doi.org/10.5281/zenodo.1058663

**References:**

[1] D.B. Tuckermann and R.F.W. Pease, High performance heat sinking for VLSI,IEEE Electronic Device Lett. EDL-2, pp.126-129, 1981.

[2] X.F. Peng, B.X. Wang, G.P. Peterson, and H.B. Ma, Experimental investigation of heat transfer in flat plates with rectangular microchannels, Int. J. Heat Mass Transfer, 38, pp. 127-137, 1995.

[3] X.F. Peng and G.P. Peterson, Friction flow characteristics of water flowing through rectangular microchannels, J. Exp. Heat Transfer, 7, pp. 249-264, 1995.

[4] X.F. Peng and G.P. Peterson, Convective heat transfer and flow friction for water flow in microchannel structures, Int. J. Heat Mass Transfer, 39, pp. 2599-2608, 1996.

[5] W. Qu, G. M. Mala, and D. Li, Heat transfer for water flow in trapezoidal silicon microcahnnels, Int. J. Heat Mass Transfer, 43, pp. 3925-3936, 2000.

[6] M.M. Rahman, Measurements of heat transfer in microchannel heat sink, Int. Comm. Heat MassTransfer, 27, pp. 495-506, 2000.

[7] S. M. Kim and I. Mudawar, Analytical heat diffusion models for different micro-channel heat sink cross-sectional geometries, Int. J. Heat Mass Transfer, 53, pp. 4002-4016, 2010.

[8] S. M. Kim and I. Mudawar, Analytical heat diffusion models for heat sinks with circular micro-channels, Int. J. Heat Mass Transfer, 53, pp. 4552-4566, 2010.

[9] P. Gunnasegaran, H. A. Mohammed, N. H. Shuaib, and R. Saidur, The effect of geometrical parameters on heat transfer characteristics of microchannels heat sink with different shapes, Int. Comm. Heat Mass Transfer, 37, pp. 1078-1086, 2010.

[10] Y. Chen, C. Zhang, M. Shi, and J. Wu, Three-dimensional numerical simulation of heat and fluid flow in noncircular microchannel heat sinks, Int. Comm. Heat Mass Transfer, 36, pp. 917-920, 2009.

[11] J. P. McHale, and S. V. Garimella, Heat transfer in trapezoidal microchannels of various aspect ratios, Int. J. Heat Mass Transfer, 53, pp. 365-375, 2010.

[12] H.S. Kou, J.J. Lee, and C.W. Chen, Optimal thermal performance of microchannel heatsink by adjusting channel width and height, Int. Comm. Heat MassTransfer, 35, pp. 577-582, 2008.

[13] K. Foli, T. Okabe, M. Olhofer, Yaochu Jin, and B. Sendhoff, Optimization of the micro heat exchanger: CFD, analytical approach and multi-objective evolutionary algorithms, Int. J. Heat Mass Transfer 49, pp. 1090-1099, 2005.

[14] J. Li and G.P. Peterson, 3-Dimensional numerical optimization of silicon-based high performance parallel microchannel heatsink with liquid flow, Int. J. Heat Mass Transfer, 50, pp. 2895-2904 ,2007.

[15] C.H. Chen, Forced convection heat transfer in microchannel heatsinks, Int. J. Heat Mass Transfer, 50, pp. 2182-2189, 2007.

[16] R.W. Knight, J.S. Goodling and D. J. Hall, Optimal thermal design of forced convection heatsinks---Analytical, ASME J. Electron. Packag., 113, pp. 313-321, 1986.

[17] S.J. Kim and D. Kim, Forced convection in microstructures for electronic equipment cooling, ASME J. Heat Transfer, 121, pp. 635-645, 1999.

[18] C.Y. Zhao and T.J. Lu, Analysis of microchannel heatsinks for electronics cooling, Int. J. Heat Mass Transfer, 45, pp. 4857-4869, 2002.

[19] P.S. Lee, S.V. Garimella, and D. Liu, Investigation of heat transfer in rectangular microchannels, Int. J. Heat Mass Transfer, 48, pp. 1688-1704, 2005.

[20] H.C. Chiu, J.H. Jang, H.W. Yeh, and M.S. Wu, The heat transfer characteristics of liquid cooling heatsink containing microchannels, Int. J. Heat Mass Transfer, 54, pp. 34-42, 2011.

[21] K. Vafai and L. Zhu, Analysis of two-layered micro-channel heat sink concept in electronic cooling, Int. J. Heat Mass Transfer, 42, pp. 2287-2297, 1997.