Preparation of Metallic Copper Nanoparticles by Reduction of Copper Ions in Aqueous Solution and Their Metal-Metal Bonding Properties

Authors: Y. Kobayashi, T. Shirochi, Y. Yasuda, T. Morita

Abstract:

This paper describes a method for preparing metallic Cu nanoparticles in aqueous solution, and a metal-metal bonding technique using the Cu particles.Preparation of the Cu particle colloid solution was performed in water at room temperature in air using a copper source (0.01 M Cu(NO₃)₂), a reducing reagent (0.2 - 1.0 M hydrazine), and stabilizers (0.5×10^-3 M citric acid and 5.0×10^-3 M cetyltrimethylammonium bromide). The metallic Cu nanoparticles with sizes of ca. 60nm were prepared at all the hydrazine concentrations examined. A stage and a plate of metallic Cu were successfully bonded under annealing at 400^oC and pressurizing at 1.2 MPa for 5min in H₂ gas with help of the metallic Cu particles. A shear strength required for separating the bonded Cu substrates reached the maximum value at a hydrazine concentration of 0.8M, and it decreased beyond the concentration. Consequently, the largest shear strength of 22.9 MPa was achieved at the 0.8 M hydrazine concentration.

Keywords: Aqueous solution, Bonding, Colloid, Copper, Nanoparticle.

Digital Object Identifier (DOI): doi.org/10.5281/zenodo.1088612

References:

[1] S. Matsuoka, and H. Imai, “Direct welding of different metals used ultrasonic vibration,” J. Mater. Process. Technol., vol. 209, pp. 954–960, 2009.
[2] T. Saeid, A. Abdollah-Zadeh, and B. Sazgari, “Weldability and mechanical properties of dissimilar aluminum-copper lap joints made by friction stir welding,”J. Alloys Comp.,vol. 490,pp. 652–655, 2010.
[3] A. Lesnewich, R.L. Peaslee, E.M. Breinan, K.E. Richter, J.M. Gerken, and R.K. Sager, Jr., Fundamentals of welding, 7th ed. vol. 1, C. Weisman, Ed.Miami: American Welding Society, 1976, ch. 1.
[4] M. Takagi, “Electron-diffraction study of liquid-solid transition of thin metal films,”J. Phys. Soc. Jpn.,vol. 9, pp. 359–363, 1954.
[5] J. R. Gronza, and R. J. Dowding, “Nanoparticulate materials densification,”Nanostruct. Mater.,vol. 7, 749–768, 1996.
[6] E. Ide, S. Angata, A. Hirose, and K.F. Kobayashi, “Metal-metal bonding process using Ag metallo-organic nanoparticles,” Acta Mater., vol. 53, pp. 2385–2393, 2005.
[7] J.G. Bai, Z.Z. Zhang, J.N. Calata, and G.-Q. Lu, “Low-temperature sintered nanoscale silver as a novel semiconductor device-metallized substrate interconnect material,”IEEE Trans. Compon. Packag. Tecnol., vol. 29,pp. 589–593,2006.
[8] A. K. Gain, Y.C. Chan, A. Sharif, N.B. Wong, and W.K.C. Yung, “Interfacial microstructure and shear strength of Ag nano particle doped Sn-9Zn solder in ball grid array packages,”Microelectron. Reliab.,vol. 49, pp. 746–753, 2009.
[9] Y. Morisada, T. Nagaoka, M. Fukusumi, Y. Kashiwagi, M. Yamamoto, and M. Nakamoto, “A low-temperature bonding process using mixed Cu-Ag nanoparticles,” J. Electron. Mater.,vol. 39, pp. 1283–1288, 2010.
[10] Y.-S. Li, Y.-C. Lu, K.-S. Chou, and F.-J. Liu, “Synthesis and characterization of silver-copper colloidal ink and its performance against electrical migration,” Mater. Res. Bull.,Vol. 45, pp. 1837–1843, 2010.
[11] K. Ihara, Y. Kobayashi, N. Shibamiya, M. Minato, Y. Yasuda, T. Morita, and S. Yamada, “Metallic bonding with the use of copper compound powders,”Ceram. Trans., vol. 219, 373–378, 2010.
[12] Y. Kobayashi, S. Ishida, K. Ihara, Y. Yasuda, and T. Morita, “Metal-metal bonding process using copper nanoparticles,” World J. Eng., vol. 7 (Supplement 3), 583–584, 2010.
[13] Y. Kobayashi, T. Shirochi, Y. Yasuda, and T. Morita, “Preparation of metallic copper nanoparticles in aqueous solution and their bonding properties,” Solid State Sci., vol. 13, pp. 553–558, 2011.
[14] Y. Kobayashi, T. Maeda, K. Watanabe, K. Ihara, Y. Yasuda, and T. Morita, “Preparation of CuOnanoparticles by metal salt-base reaction in aqueous solution and their metallic bonding property,” J. Nanoparticle Res., vol. 13, 5365–5372, 2011.
[15] Y. Kobayashi, T. Shirochi, Y. Yasuda, T. Morita, “Metal-metal bonding process using metallic copper nanoparticles prepared in aqueous solution,”Int. J.Adhes.Adhes.,vol. 33, 50–55, 2012.
[16] T. Maeda, Y. Abe, Y. Kobayashi, Y. Yasuda, and T. Morita, “Synthesis of metallic copper nanoparticles using copper oxide nanoparticles as precursor and their metal-metal bonding properties,” Sci. Technol. Weld.Join.,vol. 17,489–494,2012.
[17] T. Maeda, Y. Kobayashi, Y. Yasuda, and T. Morita, “Metal-metal bonding process using copper oxide nanoparticles,” Sci. Technol. Weld.Join.,vol. 17, 556–563, 2012.
[18] Y. Kobayashi, S. Ishida, K. Ihara, Y. Yasuda, and T. Morita, “Preparation of copper nanoparticles and metal-metal bonding process using them,” World J. Eng., in press.
[19] T. Morita, E. Ide, Y. Yasuda, A. Hirose1, and K. Kobayashi, “Study of bonding technology using silver nanoparticles,”Jpn. J. Appl. Phys.,vol. 47,pp. 6615–6622, 2008.
[20] T. Morita Y, Yasuda, E, Ide, Y, Akada, and A. Hirose, “Bonding technique using micro-scaled silver-oxide particles for in-situ formation of silver nanoparticles,” Mater. Trans.,vol. 49, pp. 2875–2880, 2008.
[21] Y. Yasuda, E. Ide, and T. Morita, “Low-temperature bonding using silver nanoparticles stabilized by short-chain alkylamines,” Jpn. J. Appl. Phys.,vol. 48, pp. 125004, 2009.
[22] T. Morita, Y. Yasuda, E. Ide, and A. Hirose, “Direct bonding to aluminum with silver-oxide microparticles,” Mater. Trans.Vol. 50, pp. 226–228, 2009.