WASET
    Y. Kobayashi and  T. Shirochi and  Y. Yasuda and  T. Morita,  Preparation of Metallic Copper Nanoparticles by Reduction of Copper Ions in Aqueous Solution and Their Metal-Metal Bonding Properties.   journal   = {International Journal of Materials and Metallurgical Engineering}, [online]. World Academy of Science, Engineering and Technology.
    September 2013, vol. 82(10). 769 - 772
    [viewed 19 April 2024]. Available from: https://publications.waset.org/pdf/17215.