Boiling Heat Transfer Enhancement Using Hydrophilic Millimeter Copper Free Particles

Authors: Abbasali Abouei Mehrizi, Hao Wang, Leping Zhou

Abstract:

Modification of surface wettability is one of the conventional approaches to manipulate the boiling heat transfer. Instead of direct surface modification, in the present study, the surface is decorated with free copper particles with different hydrophobicity. We used millimeter-sized copper particles with two different hydrophobicity. The surface is covered with untreated, hydrophilic, and a combination of hydrophobic and hydrophilic copper particles separately, and the heat flux and wall superheat temperature was measured experimentally and compared with the bare polished copper surface. The results show that the untreated copper particles can slightly improve the boiling heat transfer when the hydrophilic copper particles have better performance. Combining hydrophilic and hydrophobic copper particles reduces boiling heat transfer.

Keywords: boiling heat transfer, copper balls, hydrophobic, hydrophilic