Treatment of Inorganic Filler Surface by Silane-Coupling Agent: Investigation of Treatment Condition and Analysis of Bonding State of Reacted Agent

Authors: Hiroshi Hirano, Joji Kadota, Toshiyuki Yamashita, Yasuyuki Agari

Abstract:

It is well known that enhancing interfacial adhesion between inorganic filler and matrix resin in a composite lead to favorable properties such as excellent mechanical properties, high thermal resistance, prominent electric insulation, low expansion coefficient, and so on. But it should be avoided that much excess of coupling agent is reacted due to a negative impact of their final composite-s properties. There is no report to achieve classification of the bonding state excepting investigation of coating layer thickness. Therefore, the analysis of the bonding state of the coupling agent reacted with the filler surface such as BN particles with less functional group and silica particles having much functional group was performed by thermal gravimetric analysis and pyrolysis GC/MS. The reacted number of functional groups on the silane-coupling agent was classified as a result of the analysis. Thus, we succeeded in classifying the reacted number of the functional groups as a result of this study.

Keywords: Inorganic filler, boron nitride, surface treatment, coupling agent, analysis of bonding state

Digital Object Identifier (DOI): doi.org/10.5281/zenodo.1081531

References:

[1] E.P. Plueddemann, "Silane Coupling Agents," 2nd Ed., Plenum Press, New York, 1990.
[2] H. Ishida and S. Rimdusit, "Effect of CaCO3 on the mechanical and rheological properties of a ring-opening phenolic resin: polybenzoxazine," Polym. Comps, 5(2), 1984, pp. 101-123.
[3] K.W. Garrette, H.M. Rosenberg, Thethermal conductivity of epoxy-resin/
[4] Powder compositematerials," J. Phys. D: Appl. Phys., 7, 1974, pp. 1247-1258.
[5] P. Bujard, Proc. I-THERM 1988, Los Angles, May, IEEE, 1988, pp. 41.
[6] Y. Agari, A. Ueda, M. Tanaka, S. Nagai, "Thermal conductivity of a polymer filled with particles in the wide range from low to super-high volume content," J. Appl. Polym. Sci., 40(6), 1990, pp. 929-941.
[7] N. Tsutsumi, N. Takeuchi, T. Kiyotsukuri, "Measurement of thermal diffusivity of filler-polyimide composites by flash radiometry," J. Polym. Sci., Part B, Polym Phys. 29(8), 1991, pp. 1085-1093.
[8] M. Michael, L. Ngugen, "Effect of Mold Compound Thermal Conductivity on IC Package Thermal Performance," Intersoc. Conf. on Thermal Phenomena, IEEE, 1992, pp. 246.
[9] G.R. Nasr, M.M. Badawy, Polym. Degrad. Stab. 47, 1995, pp. 391-395.
[10] H. Ishida and S. Rimdusit, "Very high thermal conductivity obtained by boron nitride-filled polybenzoxazine," Thermochim. Acta, 320, 1998, pp. 177-186.
[11] K. Wattanakul, H. Manuspiya, N. Yanumet, "The adsorption of cationic surfactants on BN surface: Its effects on the thermal conductivity and mechanical properties of BN-epoxy composite," Colloids and Surfaces A: Physicochem. Eng. Aspects," 369, 2010, pp. 203-210.
[12] Y. Q. Li, T. Qiu, J. Xu and X. C. He, "Surface modification of aluminium nitride powder," Journal of Materials Science Letters, 15(20), 1996, pp. 1758-1761.
[13] L. Sun, J.J. Aklonis, R. Salovey, "Mode Filled Polymers," Polym. Eng. Sci., 33, 1993, pp. 1308-1319.
[14] A. C. Moloney, H. H. Kausch and H. R. Stieger, "The fracture of particulate-filled epoxide resins," J. Mater. Sci., 18(1), 1983, pp. 208-216.
[15] Y. Xu, D.D.L. Chung, "Increasing the thermal conductivity of boron nitride and aluminum nitride particle epoxy-matrix composites by particle surface treatments," Composite Interfaces, 7(4), 2000, pp. 243-256.
[16] Y. Nakamura, T. Gotoh, T. Usa, A. Harada, K. Takeuchi, T. Iida, K. Nagata, "AFM observation of a Silane Coupling Agent Layers with Various Organic Functional Groups Deposited on a Mica Surface," J. Network Polym. Japan, 27(4), 2006, pp. 202-209.
[17] H. Hanagasaki, T. Ohashi, H. Suenaga, "Research on the properties of treated BN filler as material of heat releasing resin: http://www.pref.hiroshima.lg.jp/www/contents/1190870484258/files/491 9.pdf, 46, 2006.
[18] H. Hozoji, O. Horie, M. Ogata, S. Numata, N. Kinjo, "Improvement of Mechanical Properties for Epoxy Molding Compounds by Treatment of Coupling Agent on Spherical Filler," Kobunshi Ronbunshu, 47(6), 1990, pp. 483-490.