Heat Transfer Modeling in Multi-Layer Cookware using Finite Element Method

Authors: Mohammad Reza Sedighi, Behnam Nilforooshan Dardashti

Abstract:

The high temperature degree and uniform Temperature Distribution (TD) on surface of cookware which contact with food are effective factors for improving cookware application. Additionally, the ability of pan material in retaining the heat and nonreactivity with foods are other significant properties. It is difficult for single material to meet a wide variety of demands such as superior thermal and chemical properties. Multi-Layer Plate (MLP) makes more regular TD. In this study the main objectives are to find the best structure (single or multi-layer) and materials to provide maximum temperature degree and uniform TD up side surface of pan. And also heat retaining of used metals with goal of improving the thermal quality of pan to economize the energy. To achieve this aim were employed Finite Element Method (FEM) for analyzing transient thermal behavior of applied materials. The analysis has been extended for different metals, we achieved the best temperature profile and heat retaining in Copper/ Stainless Steel MLP.

Keywords: Cookware, Energy optimization, Heat retaining, Laminated plate, Temperature distribution

Digital Object Identifier (DOI): doi.org/10.5281/zenodo.1054998

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