Commenced in January 2007
Frequency: Monthly
Edition: International
Paper Count: 32020
Optimal Resource Configuration and Allocation Planning Problem for Bottleneck Machines and Auxiliary Tools

Authors: Yin-Yann Chen, Tzu-Ling Chen


This study presents the case of an actual Taiwanese semiconductor assembly and testing manufacturer. Three major bottleneck manufacturing processes, namely, die bond, wire bond, and molding, are analyzed to determine how to use finite resources to achieve the optimal capacity allocation. A medium-term capacity allocation planning model is developed by considering the optimal total profit to satisfy the promised volume demanded by customers and to obtain the best migration decision among production lines for machines and tools. Finally, sensitivity analysis based on the actual case is provided to explore the effect of various parameter levels.

Keywords: Capacity planning, capacity allocation, machine migration, resource configuration.

Digital Object Identifier (DOI):

Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 710


[1] S. Karabuk, S.D. Wu, Coordinating Strategic Capacity Planning in the Semiconductor Industry, Operations Research, 51 (2003) 839-849.
[2] T.-L. Chen, Y.-Y. Chen, H.-C. Lu, A capacity allocation and expansion model for TFT-LCD multi-site manufacturing, J Intell Manuf, 24 (2013) 847-872.
[3] Y.-Y. Chen, T.-L. Chen, W.-L. Chen, The capacity allocation planning and expansion policy problems considering auxiliary tools, in: 2011 International Conference on System Science and Engineering (ICSSE), 2011, pp. 622-626.
[4] Y.-Y. Chen, T.-L. Chen, C.-D. Liou, Medium-term multi-plant capacity planning problems considering auxiliary tools for the semiconductor foundry, Int J Adv Manuf Technol, 64 (2013) 1213-1230.
[5] J.T. Lin, T.-L. Chen, Y.-Y. Chen, Medium-term multi-plant capacity planning problems for semiconductor foundry, in: 2010 IEEE 17Th International Conference on Industrial Engineering and Engineering Management (IE&EM), 2010, pp. 779-783.