A Detailed Review on Pin Fin Heat Sink
Commenced in January 2007
Frequency: Monthly
Edition: International
Paper Count: 33104
A Detailed Review on Pin Fin Heat Sink

Authors: Vedulla Manoj Kumar, B. Nageswara Rao, Sk. Farooq

Abstract:

Heat sinks are being considered in many advanced heat transfer applications including automotive and stationary fuel cells as well as cooling of electronic devices. However, there are innumerable fundamental issues in the fields of heat transfer and fluid mechanics perspectives which remains unresolved. The present review emphasizes on the progress of research in the field of pin fin heat sinks, while understanding the fluid dynamics and heat transfer characteristics with a detailed and sophisticated prediction of the temperature distribution, high heat flux removal and by minimizing thermal resistance. Lot of research work carried out across the globe to address this challenge and trying to come up with an economically viable and user friendly solution. The high activities for future pin fin heat sinks research and development to meet the current issue is recorded in this article.

Keywords: Heat sinks, heat transfer, heat flux, thermal resistance, electronic devices.

Digital Object Identifier (DOI): doi.org/10.5281/zenodo.1127134

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References:


[1] Kim SK, Lee S, “on heat sink measurement and characterization”, Proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference (INTERPACK’97), Hawaii, June, (1997).
[2] Biber CR, Belady CL, “Pressure drop prediction for heat sinks: what is the best method?”, Proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference (INTERPACK’97), Hawaii, June, (1997).
[3] Rao T, “Fundamentals of microelectronic packaging”, Mc Graw Hill, New York, (2001).
[4] Shih CJ, Liu GC (2004), “Optimal design methodology of plate-fin heat sinks for electronic cooling using entropy generation strategy”, Comp Package Tech IEEE Trans 27(3), pp 551–559.
[5] Shah A, Sammakia B, Srihari H “A numerical study of the thermal performance of an impingement heat sink fin shape optimization”, ITHERM 2002:298–30, (2002).
[6] S. Y. Kim and R. L. Webb, “Thermal performance analysis of fan-heat sinks for CPU cooling”, Proceedings of the IMECE’03, IMECE2003-42172, (2003).
[7] D. Kim et al, “Thermal optimization of microchannel heat sink with pin fin structures”, Proceedings of the IMECE’03, IMECE2003-42180, (2003).
[8] E.M. Sparrow, J.W. Ramsey, C.A. Altemani, “Experiments on in-line pin fin arrays and performance comparisons with staggered arrays”, ASME J. Heat Transfer 102, (1980), pp 44-50.
[9] G.J. Van Fossen, “Heat transfer coefficients for staggered arrays of short pin fins”, ASME J. Eng. Power 104 (1982), pp 268–274.
[10] D.E. Metzger, C.S. Fan, S.W. Haley, “Effect of pin shape and array orientation on heat transfer and pressure loss and pin fin arrays”, ASME J. Eng. Gas Turbines Power 106 (1984), pp 252–257.
[11] M.K. Chyu, Y.C. Hsing, T.I.-P. Shih, V. Natarajan, “Heat transfer contributions of pins and endwall in pin-fin arrays: effects of thermal boundary condition modeling”, ASME J. Turbomach. 121 (1999), pp 257–263.
[12] F.E. Ames, L.A. Dvorak, M.J. Morrow, “Turbulent augmentation of internal convection over pins in staggered pin fin arrays”, in: Proceedings of ASME Turbo Expo, (GT2004-53889), 2004.
[13] S.W. Chang, T.L. Yang, C.C. Huang, K.F. Chiang, “Endwall heat transfer and pressure drop in rectangular channels with attached and detached circular pin-fin array”, Int. J. Heat Mass Transfer 51 (2008), pp 5247–5259.
[14] H. H. Jung and J. G. Maveety, “Pin-fin heat sink modeling and characterization”, Sixteenth IEEE semi-therm Symposium, 2000, pp 260-265.
[15] Hans Jonsson, Bahram Moshfegh, “Enhancement of the cooling performance of circular pin fin heat sinks under flow bypass conditions”, 2002 Inter Society Conference on Thermal Phenomena IEEE,2002, pp 425-432.
[16] Waqar Ahmed Khan, J. Richard Culham and M. Michael Yovanovich, “Modeling of Cylindrical Pin-Fin Heat Sinks for Electronic Packaging”, IEEE Transactions on components and packaging technologies, vol. 31, no. 3, september 2008, pp 536-545.
[17] Jakob, M, “Heat Transfer and Flow Resistance in Cross Flow of Gases over Tube Banks”, Trans. ASME, vol.60, 1938, pp 384.
[18] Zhukauskas, A., “Heat Transfer from Tubes in Cross Flow, in Advances in Heat Transfer”, eds. J. P. Harnett and T. F. Irvine, Jr., vol.8, 1972, pp 93–160.
[19] Shaukatullah, H., Storr, W. R., Hansen, B. J., and Gaynes, M. A., “Design and Optimization of Pin Fin Heat Sinks for Low Velocity Applications”, Proc. Int. Electronics Packaging Conference, 1996. pp. 486–494.
[20] Jonsson, H., and Moshfegh, B., “Modeling of the Thermal and Hydraulic Performance of Plate Fin, Strip Fin, and Pin Fin Heat Sinks—Influence of Flow Bypass”, IEEE Transactions on Components and Packaging Technologies, vol.24, no.2, 2001, pp.142–149.
[21] Ryu, H. C., Kim, D., and Kim, S. J., “Experimental Analysis of Shrouded Pin Fin Heat Sinks for Electronic Equipment Cooling”, Proc. ITherm Eighth Inter Society Conference on Thermal and Thermo mechanical Phenomena in Electronic Systems, ,2002, pp. 261– 266.
[22] Dogruoz, M. B., Urdaneta, M., and Ortega, A., “Experiments and Modeling of the Heat Transfer of In-Line Square Pin Fin Heat Sinks with Top Bypass Flow”, Paper # 200234245, Proc. IMECE, ASME International Mechanical Engineering Congress & Exposition, New Orleans, Louisiana, 2002.
[23] Dogruoz, M. B., Urdaneta, M., Ortega, A., and Westphal, R. V., “Experiments and Modeling of Hydraulic Resistance of In-Line Square Pin Fin Heat Sinks with Top Bypass Flow”, Paper #20021296, Proc. ITherm Eighth Intersociety Conference on Thermal and Thermo mechanical Phonomena in Electronic Systems, San Diego, California, 2002.
[24] Dogruoz, M. B., Urdaneta, M., and Ortega, A., “Experiments and Modeling of the Hydraulic Resistance and Heat Transfer of in Line Square Pin Fin Heat Sinks with Top By-Pass Flow”, International Journal of Heat and Mass Transfer, vol.48, 2005, pp. 5058–5071.
[25] Kim D., Kim, S. J., and Ortega, A., “Compact modeling of fluid flow and heat transfer in pin fin heat sinks”, ASME J. Electronic packaging, vol.126, 2004, pp 342-350.
[26] G. Hetsroni, A. Mosyak, Z. Segal, G. Ziskind, “A uniform temperature heat sink for cooling of electronic devices”, International Journal of Heat and Mass Transfer 45, Year 2002, pp 3275–3286.
[27] Denpong Soodphakdee, Masud Behnia, and David Watabe Copeland, “A Comparison of Fin Geometries for Heatsinks in Laminar Forced Convection: Part I - Round, Elliptical, and Plate Fins in Staggered and In-Line Configurations”, The International Journal of Microcircuits and Electronic Packaging, Volume 24, Number 1, First Quarter, Year 2001, pp 68-76.
[28] R. F. Babus'Haq, K. Akintunde, S. D. Probert, “Thermal performance of a pin-fin assembly”, Int. J. Heat and Fluid Flow, 16, Year 1995, pp 50-55.
[29] M. Tahat, Z. H. Kodah, B. A. Jarrah, S. D. Probert, “Heat transfers from pin-fin arrays experiencing forced convection”, Applied Energy, 67, Year 2000, pp 419-442.
[30] Duckjong Kim, Sung Jin Kim, Alfonso Ortegal, “Compact modeling of fluid flow and heat transfer in pin fin heat sinks”, J. Heat Transfer, 126, Year 2004, pp 342 -350.
[31] Yoav Peles, Ali Kosar, Chandan Mishra, Chih-Jung Kuo, Brandon Schneider, “Forced convective heat transfer across a pin fin micro heat sink”, Int. J. Heat and Mass Transfer, 48, Year 2005, pp 3615–3627.
[32] Abel Siu-Ho, Weilin Qu, Frank Pfefferkorn, “Experimental Study of Pressure Drop and Heat Transfer in a Single-Phase Micro Pin-Fin Heat Sink”, J. Heat Transfer, 129, Year 2007, pp 479 -487.
[33] Paisarn Naphon, "Investigation on heat transfer characteristics of tapered cylinder pin fin heat sinks, Energy Conversion and Management, 48, Year 2007, pp 2671–2679.
[34] Tzer-Ming Jeng, Sheng-Chung Tzeng, “Pressure drop and heat transfer of square pin-fin arrays in in-line and staggered arrangements”, Int. J. Heat and Mass Transfer, 50, Year 2007, pp. 2364–2375.
[35] W. A. Khan, J. R. Culham, M. M. Yovanovic, “Modeling of Cylindrical Pin-Fin Heat Sinks for Electronic Packaging”, IEEE Transactions on Components and Packaging Technologies. 31, No. 3, Year 2008 pp 536-545.
[36] N. K. C. Selvarasu, D. K. Tafti, N. E. Blackwell, “Effect of pin density on heat-mass transfer and fluid flow at low Reynolds numbers in mini channels”, J. Heat Transfer, 126, 2010, pp. 061702-1-8.
[37] Jian Yang, Min Zeng, Qiuwang Wang, Akira Nakayama, “Forced Convection Heat Transfer Enhancement by Porous Pin Fins in Rectangular Channels”, J. Heat Transfer, 132, Year 2010, pp. 051702-1-8.
[38] H. S. Kang, “Optimization of a Pin Fin with Variable Base Thickness”, J. Heat Transfer, 132, Year 2010, pp. 034501-1-4.
[39] Bejan, A. and Morega, A. M., “Optimal Arrays of Pin Fins and Plate Fins in Laminar Forced Convection,” ASME Journal of Heat Transfer, Vol. 115, Year 1993, pp 75-81.
[40] Jubran, B. A., Hamdan, M. A., and Abdullah, R. M., “Enhanced Heat Transfer, Missing Pin, and Optimization for Cylindrical Pin Fin Arrays,” ASME Journal of Heat Transfer, Vol. 115, Year 1993. pp. 576-583.
[41] Bejan, A, “The Optimal Spacing for Cylinders in Crossflow Forced Convection,” ASME Journal of Heat Transfer, Vol. 117, Year 1995, pp 767-770.
[42] Tahat, M. A, Babus’Haq, R. F., and Probert, S. D., “Forced Steady-State Convections from Pin Fin Arrays,” Applied Energy, Vol. 48, Year 1994, pp 335-351.
[43] Tahat, M. A, Kodah, Z. H., Jarrah, B. A. and Probert, S. D., “Heat Transfer from Pin-Fin Arrays Experiencing Forced Convection,” Applied Energy, Vol. 67, Year 2000, pp 419-442.
[44] Azar, K. and Mandrone, C. D., “Effect of Pin Fin Density of the Thermal Performance of Unshrouded Pin Fin Heat Sinks,” ASME Journal of Electronic Packaging, Vol. 116, Year 1994, pp 306-309.
[45] Minakami, K. and Iwasaki, H., “Heat Transfer Characteristics of Pin-Fins with in Line Arrangement,” Heat Transfer - Japanese Research, Vol. 23, No. 3, Year 1994, pp 213-228.
[46] Babus’Haq, R. F., Akintunde, K. and Probert, S. D., “Thermal Performance of a Pin-Fin Assembly,” Int. J. of Heat and Fluid Flow, Vol. 16, No. 1, Year1995, pp 50-55.
[47] Jonsson, H. and Palm, B., “Experimental Comparison of Different Heat Sink Designs for Cooling of Electronics,” ASME, HTD-Vol. 329, National Heat Transfer conference, Vol. 7, pp 5055, 1996.
[48] Stanescu, G., Fowler, A. J. and Bejan, A., “The Optimal Spacing of Cylinders in Free-Stream Crossflow Forced Convection,” Int. J. Heat Mass Transfer, Vol. 39, No. 2, Year 1996, pp 311-317.
[49] Wirtz, R. A., Sohal, R., and Wang, H., “Thermal Performance of Pin-Fin Fan-Sink Assemblies,” J. of Electronic Packaging, Vol. 119, March, Year 1997, pp 26-31.
[50] Zapach, T., Newhouse, T., Taylor, J., and Thomasing, P., “Experimental Verification of a Model for the Optimization of Pin Fin Heat Sinks,” The Seventh Inter Society Conference on Thermal Phenomena, Las Vegas, Nevada, USA, May 23 - 26, Vol. 1, Year 2000, pp 63-69.
[51] Zukauskas, A., “Heat Transfer from Tubes in Crossflow,” Advances in Heat Transfer, Vol. 8, Year 1972, pp 93-160.
[52] Kondo, Y., Matsushima, H. and Komatsu, T., “Optimization of Pin-Fin Heat Sinks for Impingement Cooling of Electronic Packages,” J. of Electronic Packaging, Vol. 122, September, Year 2000, pp 240-246.
[53] Amer Al-Damook, N. Kapur, J.L. Summers, H.M. Thompson, “An experimental and computational investigation of thermal air flows through perforated pin heat sinks” Applied Thermal Engineering, Volume 89, 5 October 2015, pp 365–376.
[54] Massimiliano Rizzi and Ivan Catton, “An Experimental Study of Pin Fin Heat Sinks and Determination of End Wall Heat Transfer”, ASME 2003 Heat Transfer Summer Conference, Volume 3, July 2003, pp 445-452.
[55] Zhuo Cui, “Effect of Heat Sink Structure Improvement on Heat Dissipation Performance in High Heat Flux”, ASME 2016 5th International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 1, January- 2016, pp. V001T03A011.
[56] Ko-Ta Chiang, Chih-Chung Chou, Nun-Ming Liu, “Application of response surface methodology in describing the thermal performances of a pin-fin heat sink”, International Journal of Thermal Sciences, Volume 48, Issue 6, June 2009, pp 1196–1205.
[57] Kai-Shing Yang, Wei-Hsin Chu, Ing-Yong Chen, Chi-Chuan Wang, “A comparative study of the airside performance of heat sinks having pin fin configurations”, International Journal of Heat and Mass Transfer, Volume 50, Issues 23–24, November 2007, pp 4661–4667.
[58] A. Bar-Cohen and M. Iyengar, “Design and optimization of air-cooled heat sinks for sustainable development,” IEEE Trans. Compon. and Packag. Technol., vol. 25, Year 2002, pp 584-591.
[59] A. Bar-Cohen and M. Iyengar, “Least-energy optimization of air-cooled heat sinks for sustainable development,” IEEE Trans. Compon. and Packag. Technol., vol. 26, pp. 16-25, 2003.
[60] M. Iyengar and A. Bar-Cohen, “Least-energy optimization of forced convection plate-fin heat sinks,” IEEE Trans. Compon. and Packag. Technol., vol. 26, Year 2003, pp 62-70.
[61] N. Afgan, M. G. Carvalho, S. Prstic and A. Bar-Cohen, “Sustainability assessment of aluminum heat sink design,” Heat Transfer Engineering, vol. 24, Year 2003, pp 39-48.
[62] W. B. Krueger, and A. Bar-Cohen, “Optimal numerical design of forced convection heat sinks,” IEEE Trans. Compon. and Packag. Technol., vol. 27, Year 2004, pp 417-425.
[63] A. Bar-Cohen, R. Bahadur and M. Iyengar, “Least-energy optimization of air-cooled heat sinks for sustainability-theory, geometry and material selection,” Energy, vol. 31, Year 2006, pp 579-619.
[64] M Tahat, Z.H Kodah, B.A Jarrah, S.D Probert, “Heat transfers from pin-fin arrays experiencing forced convection”, Applied Energy, Volume 67, Issue 4, 1 December 2000, Pages 419–442.
[65] R.F. Babus'Haq, K. Akintunde, S.D. Probert, “Thermal performance of a pin-fin assembly”, International Journal of Heat and Fluid Flow, Volume 16, Issue 1, February 1995, Pages 50–55.
[66] G. Stanescu, A.J. Fowler, A. Bejan, “The optimal spacing of cylinders in free-stream cross-flow forced convection”, International Journal of Heat and Mass Transfer, Volume 39, Issue 2, January 1996, Pages 311–317.
[67] M. Almogbel, A. Bejan, “Cylindrical trees of pin fins”, International Journal of Heat and Mass Transfer, Volume 43, Issue 23, 1 December 2000, Pages 4285–4297.
[68] R. Pakrouh, M.J. Hosseini, A.A. Ranjbar, R. Bahrampoury, “A numerical method for PCM-based pin fin heat sinks optimization”, Energy Conversion and Management, Volume 103, October 2015, Pages 542–552.
[69] Cheng-Hung Huang, Yu-Chen Liu, Herchang Ay, “The design of optimum perforation diameters for pin fin array for heat transfer enhancement”, International Journal of Heat and Mass Transfer, Volume 84, May 2015, Pages 752–765.
[70] Jin Zhao, Shanbo Huang, Liang Gong, Zhaoqin Huang, “Numerical study and optimizing on micro square pin-fin heat sink for electronic cooling”, Applied Thermal Engineering, Volume 93, 25 January 2016, Pages 1347–1359.
[71] Carlos A. Rubio-Jimenez, Satish G. Kandlikar, and Abel Hernandez-Guerrero, Numerical Analysis of Novel Micro Pin Fin Heat Sink with Variable Fin Density, IEEE transactions on components, packaging and manufacturing technology, Vol. 2, NO. 5, May 2012, pp 825-833.
[72] Abas Abdoli, Gianni Jimenez, George S. Dulikravich, “Thermo-fluid analysis of micro pin-fin array cooling configurations for high heat fluxes with a hot spot”, International Journal of Thermal Sciences, Volume 90, April 2015, Pages 290–297.
[73] T.J. John, B. Mathew, H. Hegab, “Parametric study on the combined thermal and hydraulic performance of single phase micro pin-fin heat sinks part I: Square and circle geometries”, International Journal of Thermal Sciences, Volume 49, Issue 11, November 2010, pp 2177–2190.
[74] A.A. Zukauskas, “Heat transfer from tubes in cross flow advances in Heat Transfer”, vol. 8, Academic Press, New York, 1972, pp. 93–160.
[75] V.T. Morgan, “The overall convective heat transfer from smooth circular cylinders”, in: T.F. Irvine, Jr., J.P. Hartnett (Eds.), Advances in Heat Transfer, vol. 11, Academic Press, New York, pp. 199–264.
[76] S. Mahmoud, R. Al-Dadah, D.K. Aspinwall, S.L. Soo, H. Hemida, “Effect of micro fin geometry on natural convection heat transfer of horizontal microstructures”, Appl. Therm. Eng. 31 (2011), pp 627–633.
[77] Satish g. kandlikar, “High Flux Heat Removal with Microchannels—A Roadmap of Challenges and Opportunities”, heat transfer engineering, 26(8), 2005, pp 5–14.
[78] Hussam Jouharaa, Brian P. Axcell, “Modelling and simulation techniques for forced convection heat transfer in heat sinks with rectangular fins, Simulation Modelling Practice and Theory”, volume 17, year 2009, pp 871–882.
[79] Taiho Yeom, Terrence Simon, Tao Zhang, Min Zhang, Mark North, Tianhong Cui, “Enhanced heat transfer of heat sink channels with micro pin fin roughened walls”, International Journal of Heat and Mass Transfer, Volume 92, January 2016, pp 617–627.
[80] D.A. McNeil, A.H. Raeisi, P.A. Kew, R.S. Hamed, “An investigation into flow boiling heat transfer and pressure drop in a pin–finned heat sink”, International Journal of Multiphase Flow, Volume 67, Supplement, December 2014, pp 65–84.
[81] Yoav Peles, Ali Koşar, Chandan Mishra, Chih-Jung Kuo, Brandon Schneider, “Forced convective heat transfer across a pin fin micro heat sink”, International Journal of Heat and Mass Transfer, Volume 48, Issue 17, August 2005, pp 3615–3627.
[82] Raj Bahadur, Avram Bar-Cohen, “Orthotropic thermal conductivity effect on cylindrical pin fin heat transfer”, International Journal of Heat and Mass Transfer, Volume 50, Issues 5–6, March 2007, pp 1155–1162.
[83] S.W. Chang, T.L. Yang, C.C. Huang, K.F. Chiang, “Endwall heat transfer and pressure drop in rectangular channels with attached and detached circular pin-fin array”, International Journal of Heat and Mass Transfer, Volume 51, Issues 21–22, October 2008, pp 5247–5259.
[84] T. Bello-Ochende, J.P. Meyer, A. Bejan, “Constructal multi-scale pin–fins”, International Journal of Heat and Mass Transfer, Volume 53, Issues 13–14, June 2010, pp 2773–2779.
[85] Yeh Rong-Hua, “An analytical study of the optimum dimensions of rectangular fins and cylindrical pin fins”, International Journal of Heat and Mass Transfer, Volume 40, Issue 15, October 1997, pp 3607–3615.
[86] R.F. Baus'Haq, S.D. Probert, C.R. Taylor, “Heat-transfer effectivenesses of shrouded, rectangular-fin arrays”, Applied Energy, Volume 46, Issue 2, 1993, pp 99–112.
[87] Andrea Diani, Simone Mancin, Claudio Zilio, Luisa Rossetto, “An assessment on air forced convection on extended surfaces: Experimental results and numerical modeling”, International Journal of Thermal Sciences International Journal of Multiphase Flow, Volume 67, Supplement, December 2014, pp 65–84.