Interface Analysis of Annealed Al/Cu Cladded Sheet

Authors: Joon Ho Kim, Tae Kwon Ha

Abstract:

Effect of aging treatment on microstructural aspects of interfacial layers of the Cu/Al clad sheet produced by differential speed rolling (DSR) process were studied by electron back scattered diffraction (EBSD). Clad sheet of Al/Cu has been fabricated by using DSR, which caused severe shear deformation between Al and Cu plate to easily bond to each other. Rolling was carried out at 100^oC with speed ratio of 2, in which the total thickness reduction was 45%. Interface layers of clad sheet were analyzed by EBSD after subsequent annealing at 400^oC for 30 to 120min. With increasing annealing time, thickness of interface layer and fraction of high angle grain boundary were increased and average grain size was decreased.

Keywords: Aluminum/Copper clad sheet, differential speed rolling, interface layer, microstructure, annealing, electron back scattered diffraction.

Digital Object Identifier (DOI): doi.org/10.5281/zenodo.1091746

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