Commenced in January 2007
Frequency: Monthly
Edition: International
Paper Count: 5

wetting Related Publications

5 Wetting Characterization of High Aspect Ratio Nanostructures by Gigahertz Acoustic Reflectometry

Authors: C. Virgilio, J. Carlier, P. Campistron, M. Toubal, P. Garnier, L. Broussous, V. Thomy, B. Nongaillard

Abstract:

Wetting efficiency of microstructures or nanostructures patterned on Si wafers is a real challenge in integrated circuits manufacturing. In fact, bad or non-uniform wetting during wet processes limits chemical reactions and can lead to non-complete etching or cleaning inside the patterns and device defectivity. This issue is more and more important with the transistors size shrinkage and concerns mainly high aspect ratio structures. Deep Trench Isolation (DTI) structures enabling pixels’ isolation in imaging devices are subject to this phenomenon. While low-frequency acoustic reflectometry principle is a well-known method for Non Destructive Test applications, we have recently shown that it is also well suited for nanostructures wetting characterization in a higher frequency range. In this paper, we present a high-frequency acoustic reflectometry characterization of DTI wetting through a confrontation of both experimental and modeling results. The acoustic method proposed is based on the evaluation of the reflection of a longitudinal acoustic wave generated by a 100 µm diameter ZnO piezoelectric transducer sputtered on the silicon wafer backside using MEMS technologies. The transducers have been fabricated to work at 5 GHz corresponding to a wavelength of 1.7 µm in silicon. The DTI studied structures, manufactured on the wafer frontside, are crossing trenches of 200 nm wide and 4 µm deep (aspect ratio of 20) etched into a Si wafer frontside. In that case, the acoustic signal reflection occurs at the bottom and at the top of the DTI enabling its characterization by monitoring the electrical reflection coefficient of the transducer. A Finite Difference Time Domain (FDTD) model has been developed to predict the behavior of the emitted wave. The model shows that the separation of the reflected echoes (top and bottom of the DTI) from different acoustic modes is possible at 5 Ghz. A good correspondence between experimental and theoretical signals is observed. The model enables the identification of the different acoustic modes. The evaluation of DTI wetting is then performed by focusing on the first reflected echo obtained through the reflection at Si bottom interface, where wetting efficiency is crucial. The reflection coefficient is measured with different water / ethanol mixtures (tunable surface tension) deposited on the wafer frontside. Two cases are studied: with and without PFTS hydrophobic treatment. In the untreated surface case, acoustic reflection coefficient values with water show that liquid imbibition is partial. In the treated surface case, the acoustic reflection is total with water (no liquid in DTI). The impalement of the liquid occurs for a specific surface tension but it is still partial for pure ethanol. DTI bottom shape and local pattern collapse of the trenches can explain these incomplete wetting phenomena. This high-frequency acoustic method sensitivity coupled with a FDTD propagative model thus enables the local determination of the wetting state of a liquid on real structures. Partial wetting states for non-hydrophobic surfaces or low surface tension liquids are then detectable with this method.

Keywords: Semiconductor, wetting, acoustic reflectometry, gigahertz

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4 Wetting Properties of Silver Based Alloys

Authors: Zoltan Weltsch, József Hlinka, Eszter Kókai

Abstract:

The temperature dependence of wettability (wetting angle, Θ (T)) for Ag-based melts on graphite and Al2O3 substrates is compared. Typical alloying effects are found, as the Ag host metal is gradually replaced by various metallic elements. The essence of alloying lies in the change of the electron/atom (e/a) ratio. This ratio is also manifested in the shift of wetting angles on the same substrate. Nevertheless, the effects are partially smeared by other (metallurgical) factors, like the interaction between the oxygenalloying elements and by the graphite substrate-oxygen interaction. In contrast, such effects are not pronounced in the case of Al2O3 substrates. As a consequence, Θ(T) exhibits an opposite trend in the case of two substrates. Crossovers of the Θ(T) curves were often found. The positions of crossovers depend on the chemical character and concentration of solute atoms. Segregation and epitaxial texture formation after solidification were also observed in certain alloy drops, especially in high concentration range. This phenomenon is not yet explained in every detail.

Keywords: Contact angle, Soldering, Silver, Graphite, wetting, substrate, temperature dependence, solid solubility

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3 Tin (II) Chloride a Suitable Wetting Agent for AA1200 - SiC Composites

Authors: E. I. Akpan, S. O. Adeosun, S. A. Balogun, A. S. Abdulmunim

Abstract:

SiC reinforced Aluminum samples were produced by stir casting of liquid AA1200 aluminum alloy at 600-650ºC casting temperature. 83µm SiC particles were rinsed in 10g/l, 20g/l and 30g/l molar concentration of Sncl2 through cleaning times of 0, 60, 120, and 180 minutes. Some cast samples were tested for mechanical properties and some were subjected to heat treatment before testing. The SnCl2 rinsed SiC reinforced aluminum exhibited higher yield strength, hardness, stiffness and elongation which increases with cleaning concentration and time up to 120 minutes, compared to composite with untreated SiC. However, the impact energy resistance decreases with cleaning concentration and time. The improved properties were attributed to good wettability and mechanical adhesion at the fiber-matrix interface. Quenching and annealing the composite samples further improve the tensile/yield strengths, elongation, stiffness, hardness similar to those of the as-cast samples.

Keywords: Composites, reinforcement, Tensile Strength, Aluminum, intermetallic, wetting, Al-SIC

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2 Wetting Front Propagation during Quenching of Aluminum Plate by Water Spray

Authors: M. M. Seraj, M. S. Gadala

Abstract:

This study presents a systematic analysis of wetted region due to cooling of aluminum plate by water spray impingement with respect to different water flow rates, spray nozzle heights, and subcooling. Unlike jet impingement, the wetting is not commenced upon spray impingement and there is a delay in wetness of hot test surface. After initiation, the wetting (black zone) progresses gradually to cover all test plate and provides efficient cooling in nucleate boiling regime. Generally, spray cooling is found function of spray flow rate, spray-to-surface distance and water subcooling. Wetting delay is decreasing by increasing of spray flow rate until spray impact area is not become bigger that test surface. Otherwise, higher spray flow rate is not practically accelerated start of wetting. Very fast wetting due to spray cooling can be obtained by dense spray (high floe rate) discharged from adjacent nozzle to the test surface. Highly subcooling water spray also triggers earlier wetting of hot aluminum plate.

Keywords: water spray, wetting, flow rate, aluminum plate

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1 Study of Reactive Wetting of Sn–0.7Cu and Sn–0.3Ag–0.7Cu Lead Free Solders during Solidification on Nickel Coated Al Substrates

Authors: K.N. Prabhu, Satyanarayana

Abstract:

Microstructure, wetting behavior and interfacial reactions between Sn–0.7Cu and Sn–0.3Ag–0.7Cu (SAC0307) solders solidified on Ni coated Al substrates were compared and investigated. Microstructure of Sn–0.7Cu alloy exhibited a eutectic matrix composed of primary β-Sn dendrites with a fine dispersion of Cu6Sn5 intermetallics whereas microstructure of SAC0307 alloy exhibited coarser Cu6Sn5 and finer Ag3Sn precipitates of IMCs with decreased tin dendrites. Contact angles ranging from 22° to 26° were obtained for Sn–0.7Cu solder solidified on substrate surface whereas for SAC0307 solder alloy contact angles were found to be in the range of 20° to 22°. Sn–0.7Cu solder/substrate interfacial region exhibited faceted (Cu, Ni)6Sn5 IMCs protruding into the solder matrix and a small amount of (Cu, Ni)3Sn4 intermetallics at the interface. SAC0307 solder/substrate interfacial region showed mainly (Cu, Ni)3Sn4 intermetallics adjacent to the coating layer and (Cu, Ni)6Sn5 IMCs in the solder matrix. The improvement in the wettability of SAC0307 solder alloy on substrate surface is attributed to the formation of cylindrical shape (Cu,Ni)6Sn5 and a layer of (Cu, Ni)3Sn4 IMCs at the interface.

Keywords: Intermetallics, Contact angle, wetting, lead-free solder

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