Commenced in January 2007
Frequency: Monthly
Edition: International
Paper Count: 5

Thermal Stability Related Publications

5 Effect of Manganese Doping on Ferrroelectric Properties of (K0.485Na0.5Li0.015)(Nb0.98V0.02)O3 Lead-Free Piezoceramic

Authors: Chongtham Jiten, Radhapiyari Laishram, K. Chandramani Singh

Abstract:

Alkaline niobate (Na0.5K0.5)NbO3 ceramic system has attracted major attention in view of its potential for replacing the highly toxic but superior lead zirconate titanate (PZT) system for piezoelectric applications. Recently, a more detailed study of this system reveals that the ferroelectric and piezoelectric properties are optimized in the Li- and V-modified system having the composition (K0.485Na0.5Li0.015)(Nb0.98V0.02)O3. In the present work, we further study the pyroelectric behaviour of this composition along with another doped with Mn4+. So, (K0.485Na0.5Li0.015)(Nb0.98V0.02)O3 + x MnO2 (x = 0, and 0.01 wt. %) ceramic compositions were synthesized by conventional ceramic processing route. X-ray diffraction study reveals that both the undoped and Mn4+-doped ceramic samples prepared crystallize into a perovskite structure having orthorhombic symmetry. Dielectric study indicates that Mn4+ doping has little effect on both the Curie temperature (Tc) and tetragonal-orthorhombic phase transition temperature (Tot). The bulk density, room-temperature dielectric constant (εRT), and room-c The room-temperature coercive field (Ec) is observed to be lower in Mn4+ doped sample. The detailed analysis of the P-E hysteresis loops over the range of temperature from about room temperature to Tot points out that enhanced ferroelectric properties exist in this temperature range with better thermal stability for the Mn4+ doped ceramic. The study reveals that small traces of Mn4+ can modify (K0.485Na0.5Li0.015)(Nb0.98V0.02)O3 system so as to improve its ferroelectric properties with good thermal stability over a wide range of temperature.

Keywords: sintering, Ceramics, Thermal Stability, dielectric properties, ferroelectric properties, lead-free

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4 Micro Particles Effect on Mechanical and Thermal Properties of Ceramic Composites - A Review

Authors: S. I. Durowaye, O. P. Gbenebor, B. O. Bolasodun, I. O. Rufai, V. O. Durowaye

Abstract:

Particles are the most common and cheapest reinforcement producing discontinuous reinforced composites with isotropic properties. Conventional fabrication methods can be used to produce a wide range of product forms, making them relatively inexpensive. Optimising composite development must include consideration of all the fundamental aspect of particles including their size, shape, volume fraction, distribution and mechanical properties. Research has shown that the challenges of low fracture toughness, poor crack growth resistance and low thermal stability can be overcome by reinforcement with particles. The unique properties exhibited by micro particles reinforced ceramic composites have made them to be highly attractive in a vast array of applications.

Keywords: Mechanical Properties, Ceramic Composites, Thermal Stability, Microparticles

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3 Thermally Stable Nanocrystalline Aluminum Alloys Processed by Mechanical Alloying and High Frequency Induction Heat Sintering

Authors: Hany R. Ammar, Khalil A. Khalil, El-Sayed M. Sherif

Abstract:

The current study investigated the influence of milling time and ball-to-powder (BPR) weight ratio on the microstructural constituents and mechanical properties of bulk nanocrystalline Al; Al-10%Cu; and Al-10%Cu-5%Ti alloys. Powder consolidation was carried out using a high frequency induction heat sintering where the processed metal powders were sintered into a dense and strong bulk material. The powders and the bulk samples were characterized using XRD and FEGSEM techniques. The mechanical properties were evaluated at various temperatures of 25°C, 100°C, 200°C, 300°C and 400°C to study the thermal stability of the processed alloys. The processed bulk nanocrystalline alloys displayed extremely high hardness values even at elevated temperatures. The Al-10%Cu-5%Ti alloy displayed the highest hardness values at room and elevated temperatures which are related to the presence of Ti-containing phases such as Al3Ti and AlCu2Ti. These phases are thermally stable and retain the high hardness values at elevated temperatures up to 400ºC.

Keywords: sintering, Hardness, Thermal Stability, nanocrystalline aluminum alloys, Mechanical Alloying

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2 Thermal Expansion Coefficient and Young’s Modulus of Silica-Reinforced Epoxy Composite

Authors: Hyu Sang Jo, Gyo Woo Lee

Abstract:

In this study, the evaluation of thermal stability of the micrometer-sized silica particle reinforced epoxy composite was carried out through the measurement of thermal expansion coefficient and Young’s modulus of the specimens. For all the specimens in this study from the baseline to those containing 50 wt% silica filler, the thermal expansion coefficients and the Young’s moduli were gradually decreased down to 20% and increased up to 41%, respectively. The experimental results were compared with fillervolume- based simple empirical relations. The experimental results of thermal expansion coefficients correspond with those of Thomas’s model which is modified from the rule of mixture. However, the measured result for Young’s modulus tends to be increased slightly. The differences in increments of the moduli between experimental and numerical model data are quite large.

Keywords: Thermal Stability, silica-reinforced, coefficient of thermal expansion, empirical model, Epoxy Composite

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1 Thermal Stability of a Vertical SOI-Based Capacitorless One-Transistor DRAM with Trench-Body Structure

Authors: Po-Hsieh Lin, Jyi-Tsong Lin

Abstract:

A vertical SOI-based MOSFET with trench body structure operated as 1T DRAM cell at various temperatures has been studied and investigated. Different operation temperatures are assigned for the device for its performance comparison, thus the thermal stability is carefully evaluated for the future memory device applications. Based on the simulation, the vertical SOI-based MOSFET with trench body structure demonstrates the electrical characteristics properly and possess conspicuous kink effect at various operation temperatures. Transient characteristics were also performed to prove that its programming window values and retention time behaviors are acceptable when the new 1T DRAM cell is operated at high operation temperature.

Keywords: Thermal Stability, SOI

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