Commenced in January 2007
Frequency: Monthly
Edition: International
Paper Count: 8

Thermal Resistance Related Publications

8 Thermal Resistance Analysis of Flexible Composites Based on Al2O3 Aerogels

Authors: Jianzheng Wei, Duo Zhen, Zhihan Yang, Huifeng Tan

Abstract:

The deployable descent technology is a lightweight entry method using an inflatable heat shield. The heatshield consists of a pressurized core which is covered by different layers of thermal insulation and flexible ablative materials in order to protect against the thermal loads. In this paper, both aluminum and silicon-aluminum aerogels were prepared by freeze-drying method. The latter material has bigger specific surface area and nano-scale pores. Mullite fibers are used as the reinforcing fibers to prepare the aerogel matrix to improve composite flexibility. The flexible composite materials were performed as an insulation layer to an underlying aramid fabric by a thermal shock test at a heat flux density of 120 kW/m2 and uniaxial tensile test. These results show that the aramid fabric with untreated mullite fibers as the thermal protective layer is completely carbonized at the heat of about 60 s. The aramid fabric as a thermal resistance layer of the composite material still has good mechanical properties at the same heat condition.

Keywords: Flexibility, Aerogel, Thermal Resistance, aramid fabric

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7 A Detailed Review on Pin Fin Heat Sink

Authors: Vedulla Manoj Kumar, B. Nageswara Rao, Sk. Farooq

Abstract:

Heat sinks are being considered in many advanced heat transfer applications including automotive and stationary fuel cells as well as cooling of electronic devices. However, there are innumerable fundamental issues in the fields of heat transfer and fluid mechanics perspectives which remains unresolved. The present review emphasizes on the progress of research in the field of pin fin heat sinks, while understanding the fluid dynamics and heat transfer characteristics with a detailed and sophisticated prediction of the temperature distribution, high heat flux removal and by minimizing thermal resistance. Lot of research work carried out across the globe to address this challenge and trying to come up with an economically viable and user friendly solution. The high activities for future pin fin heat sinks research and development to meet the current issue is recorded in this article.

Keywords: Heat Transfer, Electronic Devices, Thermal Resistance, Heat Flux, heat sinks

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6 Verification of the Simultaneous Local Extraction Method of Base and Thermal Resistance of Bipolar Transistors

Authors: Robert Setekera, Luuk Tiemeijer, Ramses van der Toorn

Abstract:

In this paper an extensive verification of the extraction method (published earlier) that consistently accounts for self-heating and Early effect to accurately extract both base and thermal resistance of bipolar junction transistors is presented. The method verification is demonstrated on advanced RF SiGe HBTs were the extracted results for the thermal resistance are compared with those from another published method that ignores the effect of Early effect on internal base-emitter voltage and the extracted results of the base resistance are compared with those determined from noise measurements. A self-consistency of our method in the extracted base resistance and thermal resistance using compact model simulation results is also carried out in order to study the level of accuracy of the method.

Keywords: Avalanche, Bipolar Transistor, Thermal Resistance, compact modeling, base resistance, self-heating, Early voltage, parameter extraction

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5 A High Thermal Dissipation Performance Polyethyleneterephthalate Heat Pipe

Authors: Sih-Li Chen, Chih-Hao Chen, Chih-Chieh Chen, Guan-Wei Wu

Abstract:

A high thermal dissipation performance polyethylene terephthalate heat pipe has been fabricated and tested in this research. Polyethylene terephthalate (PET) is used as the container material instead of copper. Copper mesh and methanol are sealed in the middle of two PET films as the wick structure and working fluid. Although the thermal conductivity of PET (0.15-0.24 W/m·K) is much smaller than copper (401 W/m·K), the experiment results reveal that the PET heat pipe can reach a minimum thermal resistance of 0.146 (oC/W) and maximum effective thermal conductivity of 18,310 (W/m·K) with 36.9 vol% at 26 W input power. However, when the input power is larger than 30 W, the laminated PET will debond due to the high vapor pressure of methanol.

Keywords: Thermal Resistance, PET, effective thermal conductivity, heat pipe

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4 Numerical Simulation of the Effects of Nanofluid on a Heat Pipe Thermal Performance

Authors: Barzin Gavtash, Khalid Hussain, Mohammad Layeghi, Saeed Sadeghi Lafmejani

Abstract:

This research aims at modeling and simulating the effects of nanofluids on cylindrical heat pipes thermal performance using the ANSYS-FLUENT CFD commercial software. The heat pipe outer wall temperature distribution, thermal resistance, liquid pressure and axial velocity in presence of suspended nano-scaled solid particle (i.e. Cu, Al2O3 and TiO2) within the fluid (water) were investigated. The effect of particle concentration and size were explored and it is concluded that the thermal performance of the heat pipe is improved when using nanofluid as the system working fluid. Additionally, it was observed that the thermal resistance of the heat pipe drops as the particle concentration level increases and particle radius decreases.

Keywords: Nanofluid, CFD, Thermal Resistance, heat pipe

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3 Numerical Analysis on the Performance of Heatsink with Microchannels

Authors: Jer-Huan Jang, Han-Chieh Chiu, Wei-Chung Yeih, Jia-Jui Yang, Chien-Sheng Huang

Abstract:

In this paper, numerical simulation is used to investigate the thermal performance of liquid cooling heatsink with microchannels due to geometric arrangement. Commercial software ICEPAK is utilized for the analysis. The considered parameters include aspect ratio, porosity and the length and height of microchannel. The aspect ratio varies from 3 to 16 and the length of microchannel is 10mm, 14mm, and 18mm. The height of microchannel is 2mm, 3mm and 4mm. It is found short channel have better thermal efficiency than long channel at 490Pa. No matter the length of channel the best aspect ratio is 4. It is also noted that pressure difference at 2940Pa the best aspect ratio from 4 to 8, it means pressure difference affect aspect ratio, effective thermal resistance at low pressure difference but lower effective thermal resistance at high pressure difference.

Keywords: Numerical Analysis, Thermal Resistance, microchannels, liquid cooling, pressure difference

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2 Thermal Load Calculations of Multilayered Walls

Authors: Bashir M. Suleiman

Abstract:

Thermal load calculations have been performed for multi-layered walls that are composed of three different parts; a common (sand and cement) plaster, and two types of locally produced soft and hard bricks. The masonry construction of these layered walls was based on concrete-backed stone masonry made of limestone bricks joined by mortar. These multilayered walls are forming the outer walls of the building envelope of a typical Libyan house. Based on the periodic seasonal weather conditions, within the Libyan cost region during summer and winter, measured thermal conductivity values were used to implement such seasonal variation of heat flow and the temperature variations through the walls. The experimental measured thermal conductivity values were obtained using the Hot Disk technique. The estimation of the thermal resistance of the wall layers ( R-values) is based on measurements and calculations. The numerical calculations were done using a simplified analytical model that considers two different wall constructions which are characteristics of such houses. According to the obtained results, the R-values were quite low and therefore, several suggestions have been proposed to improve the thermal loading performance that will lead to a reasonable human comfort and reduce energy consumption.

Keywords: Thermal Resistance, thermal loading, multilayered walls, Libyan bricks

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1 Performance Analysis of Heat Pipe Using Copper Nanofluid with Aqueous Solution of n-Butanol

Authors: Senthilkumar R, Vaidyanathan S, Sivaraman B

Abstract:

This study presents the improvement of thermal performance of heat pipe using copper nanofluid with aqueous solution of n-Butanol. The nanofluids kept in the suspension of conventional fluids have the potential of superior heat transfer capability than the conventional fluids due to their improved thermal conductivity. In this work, the copper nanofluid which has a 40 nm size with a concentration of 100 mg/lit is kept in the suspension of the de-ionized (DI) water and an aqueous solution of n-Butanol and these fluids are used as a working medium in the heat pipe. The study discusses about the effect of heat pipe inclination, type of working fluid and heat input on the thermal efficiency and thermal resistance. The experimental results are evaluated in terms of its performance metrics and are compared with that of DI water.

Keywords: Thermal Resistance, Thermal Efficiency, heat pipe, copper nanofluid with aqueous solution of n-Butanol

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