Commenced in January 2007
Frequency: Monthly
Edition: International
Paper Count: 4

Thermal Modeling Related Publications

4 Simulation of Laser Structuring by Three Dimensional Heat Transfer Model

Authors: Bassim Bachy, Joerg Franke

Abstract:

In this study, a three dimensional numerical heat transfer model has been used to simulate the laser structuring of polymer substrate material in the Three-Dimensional Molded Interconnect Device (3D MID) which is used in the advanced multifunctional applications. A finite element method (FEM) transient thermal analysis is performed using APDL (ANSYS Parametric Design Language) provided by ANSYS. In this model, the effect of surface heat source was modeled with Gaussian distribution, also the effect of the mixed boundary conditions which consist of convection and radiation heat transfers have been considered in this analysis. The model provides a full description of the temperature distribution, as well as calculates the depth and the width of the groove upon material removal at different set of laser parameters such as laser power and laser speed. This study also includes the experimental procedure to study the effect of laser parameters on the depth and width of the removal groove metal as verification to the modeled results. Good agreement between the experimental and the model results is achieved for a wide range of laser powers. It is found that the quality of the laser structure process is affected by the laser scan speed and laser power. For a high laser structured quality, it is suggested to use laser with high speed and moderate to high laser power.

Keywords: Simulation, Thermal Modeling, Laser Structuring, Finite element analysis

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3 Assessing the Effect of Thermodynamic, Hydrodynamic and Geometric of an Air Cooled Condenser on COP of Vapor Compression Cycle

Authors: Hosein Shokohmand, Mahmood Hosein Zare, Abdorreza Qolibeik

Abstract:

In this paper, the effects of thermodynamic, hydrodynamic and geometric of an air cooled condenser on COP of vapor compression cycle are investigated for a fixed condenser facing surface area. The system is utilized with a scroll compressor, modeled based on thermodynamic and heat transfer equations employing Matlab software. The working refrigerant is R134a whose thermodynamic properties are called from Engineering Equation Software. This simulation shows that vapor compression cycle can be designed by different configurations and COPs, economical and optimum working condition can be obtained via considering these parameters.

Keywords: Thermal Modeling, heat exchanger, COP, vapor compression cycle, air cooled condenser

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2 Air flow and Heat Transfer Modeling of an Axial Flux Permanent Magnet Generator

Authors: Airoldi G., Bumby J. R., Dominy C., G.L. Ingram, Lim C. H., Mahkamov K., N. L. Brown, A. Mebarki, M. Shanel

Abstract:

Axial Flux Permanent Magnet (AFPM) Machines require effective cooling due to their high power density. The detrimental effects of overheating such as degradation of the insulation materials, magnets demagnetization, and increase of Joule losses are well known. This paper describes the CFD simulations performed on a test rig model of an air cooled Axial Flux Permanent Magnet (AFPM) generator built at Durham University to identify the temperatures and heat transfer coefficient on the stator. The Reynolds Averaged Navier-Stokes and the Energy equations are solved and the flow pattern and heat transfer developing inside the machine are described. The Nusselt number on the stator surfaces has been found. The dependency of the heat transfer on the flow field is described temperature field obtained. Tests on an experimental are undergoing in order to validate the CFD results.

Keywords: CFD, Thermal Modeling, Axial flux permanent magnet machines

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1 Thermal Modeling of Dry-Transformers and Estimating Temperature Rise

Authors: M. Ghareh, L. Sepahi

Abstract:

Temperature rise in a transformer depends on variety of parameters such as ambient temperature, output current and type of the core. Considering these parameters, temperature rise estimation is still complicated procedure. In this paper, we present a new model based on simple electrical equivalent circuit. This method avoids the complication associated to accurate estimation and is in very good agreement with practice.

Keywords: Thermal Modeling, temperature rise, equivalent thermal circuit

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