Commenced in January 2007
Frequency: Monthly
Edition: International
Paper Count: 5

stack Related Publications

5 SCR-Stacking Structure with High Holding Voltage for I/O and Power Clamp

Authors: Yong-Seo Koo, Hyun-Young Kim, Chung-Kwang Lee, Han-Hee Cho, Sang-Woon Cho

Abstract:

In this paper, we proposed a novel SCR (Silicon Controlled Rectifier) - based ESD (Electrostatic Discharge) protection device for I/O and power clamp. The proposed device has a higher holding voltage characteristic than conventional SCR. These characteristics enable to have latch-up immunity under normal operating conditions as well as superior full chip ESD protection. The proposed device was analyzed to figure out electrical characteristics and tolerance robustness in term of individual design parameters (D1, D2, D3). They are investigated by using the Synopsys TCAD simulator. As a result of simulation, holding voltage increased with different design parameters. The holding voltage of the proposed device changes from 3.3V to 7.9V. Also, N-Stack structure ESD device with the high holding voltage is proposed. In the simulation results, 2-stack has holding voltage of 6.8V and 3-stack has holding voltage of 10.5V. The simulation results show that holding voltage of stacking structure can be larger than the operation voltage of high-voltage application.

Keywords: stack, holding voltage, ESD, SCR, power clamp

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4 Bandwidth Control Using Reconfigurable Antenna Elements

Authors: Sudhina H. K, Ravi M. Yadahalli, N. M. Shetti

Abstract:

Reconfigurable antennas represent a recent innovation in antenna design that changes from classical fixed-form, fixed function antennas to modifiable structures that can be adapted to fit the requirements of a time varying system.

The ability to control the operating band of an antenna system can have many useful applications. Systems that operate in an acquire-and-track configuration would see a benefit from active bandwidth control. In such systems a wide band search mode is first employed to find a desired signal then a narrow band track mode is used to follow only that signal. Utilizing active antenna bandwidth control, a single antenna would function for both the wide band and narrow band configurations providing the rejection of unwanted signals with the antenna hardware. This ability to move a portion of the RF filtering out of the receiver and onto the antenna itself will also aid in reducing the complexity of the often expensive RF processing subsystems.

Keywords: MEMS, designing methods, stack, reconfigurable elements

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3 Reduction of Leakage Power in Digital Logic Circuits Using Stacking Technique in 45 Nanometer Regime

Authors: P.K. Sharma, B. Bhargava, S. Akashe

Abstract:

Power dissipation due to leakage current in the digital circuits is a biggest factor which is considered specially while designing nanoscale circuits. This paper is exploring the ideas of reducing leakage current in static CMOS circuits by stacking the transistors in increasing numbers. Clearly it means that the stacking of OFF transistors in large numbers result a significant reduction in power dissipation. Increase in source voltage of NMOS transistor minimizes the leakage current. Thus stacking technique makes circuit with minimum power dissipation losses due to leakage current. Also some of digital circuits such as full adder, D flip flop and 6T SRAM have been simulated in this paper, with the application of reduction technique on ‘cadence virtuoso tool’ using specter at 45nm technology with supply voltage 0.7V.

Keywords: low power, stack, threshold voltage

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2 Impact of Viscous and Heat Relaxation Loss on the Critical Temperature Gradients of Thermoacoustic Stacks

Authors: Abdulrahman S. Abduljalil, Zhibin Yu, Artur J. Jaworski

Abstract:

A stack with a small critical temperature gradient is desirable for a standing wave thermoacoustic engine to obtain a low onset temperature difference (the minimum temperature difference to start engine-s self-oscillation). The viscous and heat relaxation loss in the stack determines the critical temperature gradient. In this work, a dimensionless critical temperature gradient factor is obtained based on the linear thermoacoustic theory. It is indicated that the impedance determines the proportion between the viscous loss, heat relaxation losses and the power production from the heat energy. It reveals the effects of the channel dimensions, geometrical configuration and the local acoustic impedance on the critical temperature gradient in stacks. The numerical analysis shows that there exists a possible optimum combination of these parameters which leads to the lowest critical temperature gradient. Furthermore, several different geometries have been tested and compared numerically.

Keywords: stack, viscous effect, Critical temperature gradient, heat relaxation

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1 Interfacing C and TMS320C6713 Assembly Language (Part-I)

Authors: Abdullah A. Wardak

Abstract:

This paper describes an interfacing of C and the TMS320C6713 assembly language which is crucially important for many real-time applications. Similarly, interfacing of C with the assembly language of a conventional microprocessor such as MC68000 is presented for comparison. However, it should be noted that the way the C compiler passes arguments among various functions in the TMS320C6713-based environment is totally different from the way the C compiler passes arguments in a conventional microprocessor such as MC68000. Therefore, it is very important for a user of the TMS320C6713-based system to properly understand and follow the register conventions when interfacing C with the TMS320C6713 assembly language subroutine. It should be also noted that in some cases (examples 6-9) the endian-mode of the board needs to be taken into consideration. In this paper, one method is presented in great detail. Other methods will be presented in the future.

Keywords: Arguments, stack, Interfacing, Assembly Language, high level language

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