Commenced in January 2007
Frequency: Monthly
Edition: International
Paper Count: 2

skin effect Related Publications

2 Conductivity and Selection of Copper Clad Steel Wires for Grounding Applications

Authors: George Eduful, Kingsford J. A. Atanga

Abstract:

Copper clad steel wire (CCS) is primarily used for grounding applications to reduce the high incidence of copper ground conductor theft in electrical installations. The cross sectional area of the CCS is selected by relating the diameter equivalence to a copper conductor. The main difficulty is how to use a simple analytical relation to determine the right conductivity of CCS for a particular application. The use of Eddy-Current instrument for measuring conductivity is known but in most cases, the instrument is not readily available. The paper presents a simplified approach on how to size and determine CCS conductivity for a given application.

Keywords: grounding, Conductivity, copper clad steel wire, skin effect

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1 Skin Effect: A Natural Phenomenon for Minimization of Ground Bounce in VLSI RC Interconnect

Authors: Shilpi Lavania

Abstract:

As the frequency of operation has attained a range of GHz and signal rise time continues to increase interconnect technology is suffering due to various high frequency effects as well as ground bounce problem. In some recent studies a high frequency effect i.e. skin effect has been modeled and its drawbacks have been discussed. This paper strives to make an impression on the advantage side of modeling skin effect for interconnect line. The proposed method has considered a CMOS with RC interconnect. Delay and noise considering ground bounce problem and with skin effect are discussed. The simulation results reveal an advantage of considering skin effect for minimization of ground bounce problem during the working of the model. Noise and delay variations with temperature are also presented.

Keywords: Noise, delay, skin effect, Interconnect, Ground Bounce

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