Search results for: Nabihah%20Razali

Authors: Sharifah Nabihah Syed Jaafar, Umar Adli Amran, Rasidi Roslan, Chia Chin Hua, Sarani Zakaria

Abstract:

Bio-composites derived from plant fiber and/or bioderived polymer, are likely more ecofriendly and demonstrate competitive performance with petroleum based composites. In this research, the bio phenol-formaldehyde (bio-PF) was used as a matrix and oil palm empty fruit bunch fiber (EFB) as reinforcement. The matrix was synthesized via liquefaction and condensation to enhance the combination of phenol and formaldehyde, during the process. Then, the bio-PF was mixed with different percentage of EFB (5%, 10%, 15% and 20%) and molded at 180oC. The samples that viewed under scanning electron microscopy (SEM) showed an excellent wettability and interaction between EFB and matrix. Samples of 10% EFB gave the optimum properties of impact and hardness meanwhile sample 15% of EFB gave the highest reading of flexural modulus (MOE) and flexural strength (MOR). For thermal stability analysis, it was found that the weight loss and the activation energy (Ea) of the bio-composites samples were decreased as the filler content increased.

Keywords: EFB, liquefaction, phenol formaldehyde, lignin.

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Authors: Rohaya Abdul Wahab, Raja Mohd Fuad Tengku Aziz, Nazaliza Othman, Sharifah Saleh, Nabihah Razali, Rozaimah Baharim, Md Hanif Md Nasir

Abstract:

This paper will discuss flip chip methodology, in which I/O pads, standard cells, macros and bump cells array are placed in the floorplan, then routed using Astro place and route tool. Final DRC and LVS checking is done using Calibre verification tool. The design vehicle to run this methodology is an OpenRISC design targeted to Silterra 0.18 micrometer technology with 6 metal layers for routing. Astro has extensive support for flip chip placement and routing. Astro tool commands for flip chip are straightforward approach like the conventional standard wire bond packaging. However since we do not have flip chip commands in our Astro tool, no LEF file for bump cell and no LEF file for flip chip I/O pad, we create our own methodology to prepare for future flip chip tapeout. 

Keywords: Astro, bump cell, Calibre, flip chip, LEF, methodology, SCHEME, TCL.

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