Commenced in January 2007
Frequency: Monthly
Edition: International
Paper Count: 2

Search results for: thermal creep

2 Second-Order Slip Flow and Heat Transfer in a Long Isoflux Microchannel

Authors: Huei Chu Weng

Abstract:

This paper presents a study on the effect of second-order slip on forced convection through a long isoflux heated or cooled planar microchannel. The fully developed solutions of flow and thermal fields are analytically obtained on the basis of the second-order Maxwell-Burnett slip and local heat flux boundary conditions. Results reveal that when the average flow velocity increases or the wall heat flux amount decreases, the role of thermal creep becomes more insignificant, while the effect of second-order slip becomes larger. The second-order term in the Deissler slip boundary condition is found to contribute a positive velocity slip and then to lead to a lower pressure drop as well as a lower temperature rise for the heated-wall case or to a higher temperature rise for the cooled-wall case. These findings are contrary to predictions made by the Karniadakis slip model.

Keywords: Microfluidics, forced convection, thermal creep, second-order boundary conditions.

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1 Particle Simulation of Rarefied Gas Flows witha Superimposed Wall Surface Temperature Gradient in Microgeometries

Authors: V. Azadeh Ranjbar

Abstract:

Rarefied gas flows are often occurred in micro electro mechanical systems and classical CFD could not precisely anticipate the flow and thermal behavior due to the high Knudsen number. Therefore, the heat transfer and the fluid dynamics characteristics of rarefied gas flows in both a two-dimensional simple microchannel and geometry similar to single Knudsen compressor have been investigated with a goal of increasing performance of a actual Knudsen compressor by using a particle simulation method. Thermal transpiration and thermal creep, which are rarefied gas dynamic phenomena, that cause movement of the flow from less to higher temperature is generated by using two different longitude temperature gradients (Linear, Step) along the walls of the flow microchannel. In this study the influence of amount of temperature gradient and governing pressure in various Knudsen numbers and length-to-height ratios have been examined.

Keywords: DSMC, Thermal transpiration, Thermal creep, MEMS, Knudsen Compressor.

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