Search results for: soldering

Authors: M. S. Nourbakhsh, M. E. Khosroshahi

Abstract:

Laser soldering is based on applying some soldering material (albumin) onto the approximated edges of the cut and heating the solder (and the underlying tissues) by a laser beam. Endogenous and exogenous materials such as indocyanine green (ICG) are often added to solders to enhance light absorption. Gold nanoshells are new materials which have an optical response dictated by the plasmon resonance. The wavelength at which the resonance occurs depends on the core and shell sizes, allowing nanoshells to be tailored for particular applications. The purposes of this study was use combination of ICG and different concentration of gold nanoshells for skin tissue soldering and also to examine the effect of laser soldering parameters on the properties of repaired skin. Two mixtures of albumin solder and different combinations of ICG and gold nanoshells were prepared. A full thickness incision of 2×20 mm2 was made on the surface and after addition of mixtures it was irradiated by an 810nm diode laser at different power densities. The changes of tensile strength σt due to temperature rise, number of scan (Ns), and scan velocity (Vs) were investigated. The results showed at constant laser power density (I), σt of repaired incisions increases by increasing the concentration of gold nanoshells in solder, Ns and decreasing Vs. It is therefore important to consider the tradeoff between the scan velocity and the surface temperature for achieving an optimum operating condition. In our case this corresponds to σt =1800 gr/cm2 at I~ 47 Wcm-2, T ~ 85ºC, Ns =10 and Vs=0.3mms-1.

Keywords: Tissue soldering, gold nanoshells, indocyanine green, combination, tensile strength.

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Authors: M.S.Nourbakhsh, M.E.khosroshahi

Abstract:

Gold coated silica core nanoparticles have an optical response dictated by the plasmon resonance. The wavelength at which the resonance occurs depends on the core and shell sizes, allowing nanoshells to be tailored for particular applications. The purposes of this study was to synthesize and use different concentration of gold nanoshells as exogenous material for skin tissue soldering and also to examine the effect of laser soldering parameters on the properties of repaired skin. Two mixtures of albumin solder and different concentration of gold nanoshells were prepared. A full thickness incision of 2×20 mm2 was made on the surface and after addition of mixtures it was irradiated by an 810nm diode laser at different power densities. The changes of tensile strength σt due to temperature rise, number of scan (Ns), and scan velocity (Vs) were investigated. The results showed at constant laser power density (I), σt of repaired incisions increases by increasing the concentration of gold nanoshells, Ns and decreasing Vs. It is therefore important to consider the trade off between the scan velocity and the surface temperature for achieving an optimum operating condition. In our case this corresponds to σt =1610 gr/cm2 at I~ 60 Wcm-2, T ~ 65ºC, Ns =10 and Vs=0.2mms-1.

Keywords: Tissue soldering, Diode laser, Gold Nanoshells, Tensile strength

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Authors: Arijit Roy

Abstract:

Occurrence of popcorn in IC packages while assembling them onto the PCB is a well known moisture sensitive reliability issues, especially for surface mount packages. Commonly reflow soldering simulation process is conducted to assess the impact of assembling IC package onto PCB. A strain gauge-based instrumentation is developed to investigate the popcorn effect in surface mount packages during reflow soldering process. The instrument is capable of providing real-time quantitative information of the occurrence popcorn phenomenon in IC packages. It is found that the popcorn occur temperatures between 218 to 241°C depending on moisture soak condition, but not at the peak temperature of the reflow process. The presence of popcorn and delamination are further confirmed by scanning acoustic tomography as a failure analysis.

Keywords: Instrumentation, Popcorn, Real-time, Solder Reflow, Strain Gauge.

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Authors: Rehan Waheed, Hasan Aftab Saeed, Wasim Tarar, Khalid Mahmood, Sajid Ullah Butt

Abstract:

Electromagnetic Interference (EMI) shielded doors made from brass extruded channels need to be welded with shielded enclosures to attain optimum shielding performance. Control of welding induced distortion is a problem in welding dissimilar metals like steel and brass. In this research, soldering of the steel-brass joint has been proposed to avoid weld distortion. The material used for brass channel is UNS C36000. The thickness of brass is defined by the manufacturing process, i.e. extrusion. The thickness of shielded enclosure material (ASTM A36) can be varied to produce joint between the dissimilar metals. Steel sections of different gauges are soldered using (91% tin, 9% zinc) solder to the brass, and strength of joint is measured by standard test procedures. It is observed that thin steel sheets produce a stronger bond with brass. The steel sections further require to be welded with shielded enclosure steel sheets through TIG welding process. Stresses and deformation in the vicinity of soldered portion is calculated through FE simulation. Crack formation in soldered area is also studied through experimental work. It has been found that in thin sheets deformation produced due to applied force is localized and has no effect on soldered joint area whereas in thick sheets profound cracks have been observed in soldered joint. The shielding effectiveness of EMI shielded door is compromised due to these cracks. The shielding effectiveness of the specimens is tested and results are compared.

Keywords: Dissimilar metals, soldering, joint strength, EMI shielding.

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Authors: Mihai Brânzei, Ioan Plotog, Ion Pencea

Abstract:

The Pads have unique values of thermophysical properties (THP) having important contribution over heat transfer into the PCB structure. Materials with high thermal diffusivity (TD) rapidly adjust their temperature to that of their surroundings, because the HT is quick in compare to their volumetric heat capacity (VHC). In the paper is presenting the diffusivity tests (ASTM E1461 flash method) for PCBs with different core materials. In the experiments, the multilayer structure of PCBA was taken into consideration, an equivalent property referring to each of experimental structure be practically measured. Concerning to entire structure, the THP emphasize the major contribution of substrate in establishing of reflow soldering process (RSP) heat transfer necessities. This conclusion offer practical solution for heat transfer time constant calculation as function of thickness and substrate material diffusivity with an acceptable error estimation.

Keywords: heat transfer time constant, packaging, reflowsoldering process, thermal diffusivity.

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Authors: Zoltán Weltsch, József Hlinka, Eszter Kókai

Abstract:

The temperature dependence of wettability (wetting angle, Θ (T)) for Ag-based melts on graphite and Al2O3 substrates is compared. Typical alloying effects are found, as the Ag host metal is gradually replaced by various metallic elements. The essence of alloying lies in the change of the electron/atom (e/a) ratio. This ratio is also manifested in the shift of wetting angles on the same substrate. Nevertheless, the effects are partially smeared by other (metallurgical) factors, like the interaction between the oxygenalloying elements and by the graphite substrate-oxygen interaction. In contrast, such effects are not pronounced in the case of Al2O3 substrates. As a consequence, Θ(T) exhibits an opposite trend in the case of two substrates. Crossovers of the Θ(T) curves were often found. The positions of crossovers depend on the chemical character and concentration of solute atoms. Segregation and epitaxial texture formation after solidification were also observed in certain alloy drops, especially in high concentration range. This phenomenon is not yet explained in every detail.

Keywords: Contact angle, graphite, silver, soldering, solid solubility, substrate, temperature dependence, wetting.

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Authors: Zainudin Kornain, Azman Jalar, Rozaidi Rasid, Fong Chee Seng

Abstract:

Void formation in underfill is considered as failure in flip chip manufacturing process. Void formation possibly caused by several factors such as poor soldering and flux residue during die attach process, void entrapment due moisture contamination, dispense pattern process and setting up the curing process. This paper presents the comparison of single step and two steps curing profile towards the void and black dots formation in underfill for Hi-CTE Flip Chip Ceramic Ball Grid Array Package (FC-CBGA). Statistic analysis was conducted to analyze how different factors such as wafer lot, sawing technique, underfill fillet height and curing profile recipe were affected the formation of voids and black dots. A C-Mode Scanning Aqoustic Microscopy (C-SAM) was used to scan the total count of voids and black dots. It was shown that the 2 steps curing profile provided solution for void elimination and black dots in underfill after curing process.

Keywords: black dots formation, curing profile, FC-CBGA, underfill, void formation,

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Authors: Solyman Sharifi, Naghdali Choupani

Abstract:

Adhesively bonded joints are preferred over the conventional methods of joining such as riveting, welding, bolting and soldering. Some of the main advantages of adhesive joints compared to conventional joints are the ability to join dissimilar materials and damage-sensitive materials, better stress distribution, weight reduction, fabrication of complicated shapes, excellent thermal and insulation properties, vibration response and enhanced damping control, smoother aerodynamic surfaces and an improvement in corrosion and fatigue resistance. This paper presents the behavior of adhesively bonded joints subjected to combined thermal loadings, using the numerical methods. The joint configuration considers aluminum as central adherend with six different outer adherends including aluminum, steel, titanium, boronepoxy, unidirectional graphite-epoxy and cross-ply graphite-epoxy and epoxy-based adhesives. Free expansion of the joint in x direction was permitted and stresses in adhesive layer and interfaces calculated for different adherends.

Keywords: Thermal stress, patch repair, Adhesive joint, Finiteelement analysis.

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