Commenced in January 2007
Frequency: Monthly
Edition: International
Paper Count: 4

Search results for: electronic cooling

4 Numerical Simulations of Electronic Cooling with In-Line and Staggered Pin Fin Heat Sinks

Authors: Yue-Tzu Yang, Hsiang-Wen Tang, Jian-Zhang Yin, Chao-Han Wu

Abstract:

Three-dimensional incompressible turbulent fluid flow and heat transfer of pin fin heat sinks using air as a cooling fluid are numerically studied in this study. Two different kinds of pin fins are compared in the thermal performance, including circular and square cross sections, both are in-line and staggered arrangements. The turbulent governing equations are solved using a control-volume- based finite-difference method. Subsequently, numerical computations are performed with the realizable k - ԑ turbulence for the parameters studied, the fin height H, fin diameter D, and Reynolds number (Re) in the range of 7 ≤ H ≤ 10, 0.75 ≤ D ≤ 2, 2000 ≤ Re ≤ 126000 respectively. The numerical results are validated with available experimental data in the literature and good agreement has been found. It indicates that circular pin fins are streamlined in comparing with the square pin fins, the pressure drop is small than that of square pin fins, and heat transfer is not as good as the square pin fins. The thermal performance of the staggered pin fins is better than that of in-line pin fins because the staggered arrangements produce large disturbance. Both in-line and staggered arrangements show the same behavior for thermal resistance, pressure drop, and the entropy generation.

Keywords: Pin-fin, heat sinks, simulations, turbulent flow.

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3 Effects of Various Substrate Openings for Electronic Cooling under Forced and Natural Convection

Authors: Shen-Kuei Du, Jen-Chieh Chang, Chia-Hong Kao, Tzu-Chen Hung, Chii-Ray Lin

Abstract:

This study experimentally investigates the heat transfer effects of forced convection and natural convection under different substrate openings design. A computational fluid dynamics (CFD) model was established and implemented to verify and explain the experimental results and heat transfer behavior. It is found that different opening position will destroy the growth of the boundary layer on substrates to alter the cooling ability for both forced under low Reynolds number and natural convection. Nevertheless, having too many opening may reduce heat conduction and affect the overall heat transfer performance. This study provides future researchers with a guideline on designing and electronic package manufacturing.

Keywords: electronic cooling, experiment, opening concept, CFD.

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2 Development of Thermal Model by Performance Verification of Heat Pipe Subsystem for Electronic Cooling under Space Environment

Authors: MK Lee, JS Hong, SM Sin, HU Oh

Abstract:

Heat pipes are used to control the thermal problem for electronic cooling. It is especially difficult to dissipate heat to a heat sink in an environment in space compared to earth. For solving this problem, in this study, the Poiseuille (Po) number, which is the main measure of the performance of a heat pipe, is studied by CFD; then, the heat pipe performance is verified with experimental results. A heat pipe is then fabricated for a spatial environment, and an in-house code is developed. Further, a heat pipe subsystem, which consists of a heat pipe, MLI (Multi Layer Insulator), SSM (Second Surface Mirror), and radiator, is tested and correlated with the TMM (Thermal Mathematical Model) through a commercial code. The correlation results satisfy the 3K requirement, and the generated thermal model is verified for application to a spatial environment.

Keywords: CFD, Heat pipe, Radiator, Space.

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1 An Experimental Investigation of Thermoelectric Air-Cooling Module

Authors: Yu-Wei Chang, Chiao-Hung Cheng, Wen-Fang Wu, Sih-Li Chen

Abstract:

This article experimentally investigates the thermal performance of thermoelectric air-cooling module which comprises a thermoelectric cooler (TEC) and an air-cooling heat sink. The influences of input current and heat load are determined. And performances under each situation are quantified by thermal resistance analysis. Since TEC generates Joule heat, this nature makes construction of thermal resistance network difficult. To simplify the analysis, this article emphasizes on the resistance heat load might meet when passing through the device. Therefore, the thermal resistances in this paper are to divide temperature differences by heat load. According to the result, there exists an optimum input current under every heating power. In this case, the optimum input current is around 6A or 7A. The performance of the heat sink would be improved with TEC under certain heating power and input current, especially at a low heat load. According to the result, the device can even make the heat source cooler than the ambient. However, TEC is not always effective at every heat load and input current. In some situation, the device works worse than the heat sink without TEC. To determine the availability of TEC, this study figures out the effective operating region in which the TEC air-cooling module works better than the heat sink without TEC. The result shows that TEC is more effective at a lower heat load. If heat load is too high, heat sink with TEC will perform worse than without TEC. The limit of this device is 57W. Besides, TEC is not helpful if input current is too high or too low. There is an effective range of input current, and the range becomes narrower when the heat load grows.

Keywords: Thermoelectric cooler, TEC, electronic cooling, heat sink.

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